公开(公告)号：US20240107719A1

公开(公告)日：2024-03-28

申请号：US18160378

申请日：2023-01-27

Applicant: Delphi Technologies IP Limited

Inventor： Bryan Rohl ,  Chris Fruth ,  Edward Choi ,  Todd Nakanishi

IPC: H05K7/20

CPC classification number: H05K7/209 ,  H05K7/2049 ,  H05K7/20854 ,  H05K7/20927

Abstract: A subassembly for an electrical component includes: a first plate including: a wall, stepped walls extending from opposite sides of the wall, flange elements extending outwardly from the stepped walls, each flange element defining an engagement slot; a first heatsink positioned on the wall between the stepped walls; a second heatsink; a power module between the first heatsink and the second heatsink; and a second plate including: a plate wall extending across the second heatsink, transition walls extending from opposite sides of the plate wall, and prongs extending from the transition walls toward the first plate and substantially perpendicular to an inner surface of the plate wall in contact with the second heatsink, wherein the prongs are aligned with and configured to engage the engagement slots.