公开(公告)号：US20240106337A1

公开(公告)日：2024-03-28

申请号：US18162031

申请日：2023-01-31

Applicant: Delphi Technologies IP Limited

Inventor： Edward Choi

IPC: H02M7/00 ,  B60L50/51 ,  B60L50/60 ,  H02P27/06 ,  H05K1/18

CPC classification number: H02M7/003 ,  B60L50/51 ,  B60L50/60 ,  H02P27/06 ,  H05K1/181 ,  B60L2210/42

Abstract: A system includes: an inverter configured to convert DC power from a battery to AC power to drive a motor, wherein the inverter includes: a power module for an inverter for an electric vehicle, the power module comprising: a first substrate having an outer layer and an inner layer; a first electrically conductive spacer coupled to the inner layer of the first substrate; a first semiconductor die coupled to the first electrically conductive spacer; and a second substrate having an outer layer and an inner layer, the first semiconductor die coupled to the inner layer of the second substrate.

公开(公告)号：US20240408936A1

公开(公告)日：2024-12-12

申请号：US18330487

申请日：2023-06-07

Applicant: Delphi Technologies IP Limited

Inventor： Edward Choi ,  Andreas Mayer

IPC: B60H1/00

Abstract: A system for an electric vehicle includes: a first heat sink including a cooling pipe extending in an axial direction; a housing including a port to receive the cooling pipe, the port including an alignment feature; and a second heat sink between the first heat sink and the housing, the second heat sink including an opening to cooperate with the alignment feature of the port to align the second heat sink with the housing.

公开(公告)号：US20240324150A1

公开(公告)日：2024-09-26

申请号：US18187894

申请日：2023-03-22

Applicant: Delphi Technologies IP Limited

Inventor： Edward Choi ,  Todd George Nakanishi

IPC: H05K7/20 ,  B60L50/51 ,  F28F13/06

CPC classification number: H05K7/209 ,  B60L50/51 ,  F28F13/06 ,  H05K7/20845 ,  B60L2210/40

Abstract: A heat sink system includes: a container including a cavity; a housing connecting to the container to cover the cavity, wherein one or more of the container or the housing includes an inlet port, and one or more of the container or the housing includes an outlet port; and a cooling module in the cavity between the container and the housing, the cooling module in a flow of coolant from the inlet port to the outlet port, wherein the cooling module includes: first cooling fins with a first cooling fin geometry, and second cooling fins with a second cooling fin geometry, wherein the first cooling fins are upstream of the second cooling fins along the flow of coolant from the inlet port to the outlet port.

公开(公告)号：US20240414885A1

公开(公告)日：2024-12-12

申请号：US18330480

申请日：2023-06-07

Applicant: Delphi Technologies IP Limited

Inventor： Edward Choi ,  Andreas Mayer

IPC: H05K7/20 ,  H05K7/14

Abstract: A system for an electric vehicle includes: a first heat sink including a first mounting hole extending through the first heat sink; a second heat sink positioned adjacent to the first heat sink in an axial direction; and a spacer between the first heat sink and the second heat sink to set a distance between the first heat sink and the second heat sink, the spacer including: a flange that is coupled to both the first heat sink and the second heat sink, the flange having a thickness in the axial direction, and a protrusion extending away from the flange, the protrusion received by the first mounting hole of the first heat sink.

公开(公告)号：US20240107719A1

公开(公告)日：2024-03-28

申请号：US18160378

申请日：2023-01-27

Applicant: Delphi Technologies IP Limited

Inventor： Bryan Rohl ,  Chris Fruth ,  Edward Choi ,  Todd Nakanishi

IPC: H05K7/20

CPC classification number: H05K7/209 ,  H05K7/2049 ,  H05K7/20854 ,  H05K7/20927

Abstract: A subassembly for an electrical component includes: a first plate including: a wall, stepped walls extending from opposite sides of the wall, flange elements extending outwardly from the stepped walls, each flange element defining an engagement slot; a first heatsink positioned on the wall between the stepped walls; a second heatsink; a power module between the first heatsink and the second heatsink; and a second plate including: a plate wall extending across the second heatsink, transition walls extending from opposite sides of the plate wall, and prongs extending from the transition walls toward the first plate and substantially perpendicular to an inner surface of the plate wall in contact with the second heatsink, wherein the prongs are aligned with and configured to engage the engagement slots.

公开(公告)号：US20240107718A1

公开(公告)日：2024-03-28

申请号：US18159449

申请日：2023-01-25

Applicant: Delphi Technologies IP Limited

Inventor： Edward Choi

IPC: H05K7/20 ,  H01L23/367

CPC classification number: H05K7/209 ,  H01L23/3675

Abstract: A system includes a power module, wherein the power module includes an interlocking feature on a first surface of the power module; and at least one heat sink, wherein the surface of the at least one heat sink includes a layer of thermal interface material.

公开(公告)号：US20240105547A1

公开(公告)日：2024-03-28

申请号：US18159427

申请日：2023-01-25

Applicant: Delphi Technologies IP Limited

Inventor： Edward Choi

IPC: H01L23/40

CPC classification number: H01L23/4006 ,  H01L2023/405 ,  H01L2023/4087

Abstract: A system includes a power module, wherein the power module includes a first interlocking feature on a first surface of the power module; and at least one heat sink, wherein the at least one heat sink includes a second interlocking feature on a surface of the at least one heat sink, wherein the surface of the at least one heat sink includes a layer of thermal interface material.