公开(公告)号：US11329362B2

公开(公告)日：2022-05-10

申请号：US16719536

申请日：2019-12-18

Applicant: Drexel University

Inventor： Vasil Pano ,  Ibrahim Tekin ,  Baris Taskin ,  Kapil R. Dandekar ,  Yuqiao Liu

IPC: H01Q1/22 ,  H01Q9/30 ,  H01Q1/48 ,  H01L23/66

Abstract: On-chip wireless links offer improved network performance due to long distance communication, additional bandwidth, and broadcasting capabilities of antennas. A Through-Silicon Via (TSV)-based antenna design called TSV_A establishes multi-band wireless communication through the silicon substrate medium with only a 3 dB loss over a 30 mm on-chip distance. Simulation results show an improvement in network latency up to ˜13% (average improvement of ˜7%), energy-delay improvements of ˜34% on average, and an improvement in throughput up to ˜34% (average improvement).

公开(公告)号：US20200212538A1

公开(公告)日：2020-07-02

申请号：US16719536

申请日：2019-12-18

Applicant: Drexel University

Inventor： Vasil Pano ,  Ibrahim Tekin ,  Baris Taskin ,  Kapil R. Dandekar ,  Yuqiao Liu

IPC: H01Q1/22 ,  H01Q9/30 ,  H01Q1/48 ,  H01L23/66

Abstract: On-chip wireless links offer improved network performance due to long distance communication, additional bandwidth, and broadcasting capabilities of antennas. A Through-Silicon Via (TSV)-based antenna design called TSV_A establishes multi-band wireless communication through the silicon substrate medium with only a 3 dB loss over a 30 mm on-chip distance. Simulation results show an improvement in network latency up to ˜13% (average improvement of ˜7%), energy-delay improvements of ˜34% on average, and an improvement in throughput up to ˜34% (average improvement).