公开(公告)号：US11843434B2

公开(公告)日：2023-12-12

申请号：US17213930

申请日：2021-03-26

Applicant: Drexel University

Inventor： Oday Bshara ,  Vasil Pano ,  Md Abu Saleh Tajin ,  Kapil R. Dandekar

IPC: H04B7/0456 ,  H04B7/06 ,  H04W16/28 ,  H04B7/0491

CPC classification number: H04B7/0617 ,  H04B7/0456 ,  H04B7/0491 ,  H04B7/0695 ,  H04W16/28

Abstract: Low latency beamforming using phased antenna arrays is the key for practical deployment of envisioned millimeter wave (mmWave) Gbps mobile networks. This work aims towards reducing the overhead of the exhaustive sector-level sweep phase of the analog beamforming adopted in the IEEE 802.11ad standard. This system uses a reconfigurable antenna single RF chain in the sub-6 GHz new radio (NR) band to aid codebook-based beam selection in the mmWave band of the NR. The system exploits the congruence between the spatial propagation signatures of signals at both mmWave and sub-6 GHz frequencies to reduce the beam search space.

公开(公告)号：US20210306042A1

公开(公告)日：2021-09-30

申请号：US17213930

申请日：2021-03-26

Applicant: Drexel University

Inventor： Oday Bshara ,  Vasil Pano ,  Md Abu Saleh Tajin ,  Kapil R. Dandekar

IPC: H04B7/06 ,  H04B7/0456 ,  H04B7/0491 ,  H04W16/28

Abstract: Low latency beamforming using phased antenna arrays is the key for practical deployment of envisioned millimeter wave (mmWave) Gbps mobile networks. This work aims towards reducing the overhead of the exhaustive sector-level sweep phase of the analog beamforming adopted in the IEEE 802.11ad standard. This system uses a reconfigurable antenna single RF chain in the sub-6 GHz new radio (NR) band to aid codebook-based beam selection in the mmWave band of the NR. The system exploits the congruence between the spatial propagation signatures of signals at both mmWave and sub-6 GHz frequencies to reduce the beam search space.

公开(公告)号：US20240252389A1

公开(公告)日：2024-08-01

申请号：US18560487

申请日：2022-05-16

Applicant: Drexel University

Inventor： Hassan El Mghari ,  Gregory Olsen ,  Zikang Ling ,  Srivatsa Rayar Ganesh ,  William Mongan ,  Vasil Pano ,  Kapil R. Dandekar

IPC: A61H15/00 ,  A61H9/00 ,  A61N1/04 ,  A61N1/36 ,  G16H40/63

CPC classification number: A61H15/0078 ,  A61H9/0078 ,  A61N1/0452 ,  A61N1/36031 ,  G16H40/63 ,  A61H2201/10 ,  A61H2201/123 ,  A61H2201/164 ,  A61H2201/165 ,  A61H2201/1654 ,  A61H2201/501 ,  A61H2201/5084 ,  A61H2209/00 ,  A61H2230/085

Abstract: A deep vein thrombosis prevention device (DVT-PD) is a wearable device for the lower extremities senses the user's dynamic or static movements and actuates accordingly to lower DVT risks. The device uses a comprehensive control system together with an integrated machine learning model. to classify, manage, direct, and regulate signals and the behavior of the device.

公开(公告)号：US11329362B2

公开(公告)日：2022-05-10

申请号：US16719536

申请日：2019-12-18

Applicant: Drexel University

Inventor： Vasil Pano ,  Ibrahim Tekin ,  Baris Taskin ,  Kapil R. Dandekar ,  Yuqiao Liu

IPC: H01Q1/22 ,  H01Q9/30 ,  H01Q1/48 ,  H01L23/66

Abstract: On-chip wireless links offer improved network performance due to long distance communication, additional bandwidth, and broadcasting capabilities of antennas. A Through-Silicon Via (TSV)-based antenna design called TSV_A establishes multi-band wireless communication through the silicon substrate medium with only a 3 dB loss over a 30 mm on-chip distance. Simulation results show an improvement in network latency up to ˜13% (average improvement of ˜7%), energy-delay improvements of ˜34% on average, and an improvement in throughput up to ˜34% (average improvement).

公开(公告)号：US20200212538A1

公开(公告)日：2020-07-02

申请号：US16719536

申请日：2019-12-18

Applicant: Drexel University

Inventor： Vasil Pano ,  Ibrahim Tekin ,  Baris Taskin ,  Kapil R. Dandekar ,  Yuqiao Liu

IPC: H01Q1/22 ,  H01Q9/30 ,  H01Q1/48 ,  H01L23/66

Abstract: On-chip wireless links offer improved network performance due to long distance communication, additional bandwidth, and broadcasting capabilities of antennas. A Through-Silicon Via (TSV)-based antenna design called TSV_A establishes multi-band wireless communication through the silicon substrate medium with only a 3 dB loss over a 30 mm on-chip distance. Simulation results show an improvement in network latency up to ˜13% (average improvement of ˜7%), energy-delay improvements of ˜34% on average, and an improvement in throughput up to ˜34% (average improvement).