公开(公告)号：US20240075580A1

公开(公告)日：2024-03-07

申请号：US18137280

申请日：2023-04-20

Applicant: EBARA CORPORATION

Inventor： Toshifumi KIMBA ,  Kohei OHSHIMA ,  Kohei OTA

IPC: B24B37/013 ,  B24B49/04 ,  B24B49/08 ,  B24B49/12

CPC classification number: B24B37/013 ,  B24B49/045 ,  B24B49/08 ,  B24B49/12

Abstract: A surface property measuring system capable of accurately measuring a surface property of a polishing pad without damaging the polishing pad and without reducing throughput of the entire polishing process is disclosed. The surface property measuring system includes: an optical measuring device configured to direct light to a polishing surface of a polishing pad when the polishing pad is rotating, and measure a surface property of the polishing pad based on reflected light from the polishing surface; a cover member disposed between the optical measuring device and the polishing pad; and a transparent-liquid supply line coupled to an inlet port provided in the cover member and configured to supply a transparent liquid onto the polishing pad through the inlet port. The cover member has a light transmissive portion on an optical path of the light and the reflected light.

公开(公告)号：US20240051080A1

公开(公告)日：2024-02-15

申请号：US18257898

申请日：2021-11-09

Applicant: EBARA CORPORATION

Inventor： Kohei OTA ,  Nobuyuki TAKADA

IPC: B24B37/10 ,  B24B37/04 ,  H01L21/306

CPC classification number: B24B37/107 ,  B24B37/042 ,  H01L21/30625

Abstract: To suppress damage to a surface to be polished of a substrate and improve a polishing rate. A substrate processing apparatus includes a table 100 for supporting a substrate WF, a pad holder 226 for holding a polishing pad 222 for polishing the substrate WF supported by the table 100, a nozzle 228 for supplying a polishing liquid around the pad holder 226, and a pad rotation mechanism for rotating the pad holder 226. The pad holder 226 includes a discharge hole 221-2a formed in the center of a holding surface 221-2c configured to hold the polishing pad 222 and a discharge passage 221-2b communicated with an outside of the pad holder 226 from the discharge hole 221-2a.