公开(公告)号：US20240399526A1

公开(公告)日：2024-12-05

申请号：US18670447

申请日：2024-05-21

Applicant: EBARA CORPORATION

Inventor： Yuichi KATO ,  Itsuki KOBATA ,  Nobuyuki TAKADA ,  Shingo TOGASHI ,  Hiroaki NISHIDA

IPC: B24B37/005 ,  B24B37/11

Abstract: A polishing head capable of accurately controlling a thickness profile of a wafer is disclosed. The polishing head includes a plurality of pressure actuators, an actuator operation controller, an actuator support portion, and an clastic holder. The actuator operation controller is mounted on a head main body.

公开(公告)号：US20210237221A1

公开(公告)日：2021-08-05

申请号：US17166521

申请日：2021-02-03

Applicant: Ebara Corporation

Inventor： Nobuyuki TAKADA ,  Hozumi YASUDA

IPC: B24B9/06 ,  B24B37/30 ,  B24B37/04 ,  B24B49/04 ,  B24B49/10

Abstract: Polishing uniformity of a surface to be polished of a substrate is improved by appropriately according with a state of the surface to be polished during polishing. A substrate processing apparatus includes a table 100 for supporting a substrate WF, a pad holder 226 for holding a polishing pad 222 for polishing the substrate WF supported by the table 100, an elevating mechanism for elevating the pad holder 226 with respect to the substrate WF, a swing mechanism for swinging the pad holder 226 in a radial direction of the substrate WF, supporting members 300A and 300B for supporting the polishing pad 222 swung to outside the table 100 by the swing mechanism, and driving mechanisms 310 and 320 for adjusting at least one of a height and a distance to the substrate WF of the supporting member 300 while polishing the substrate WF.

公开(公告)号：US20230060135A1

公开(公告)日：2023-03-02

申请号：US17759932

申请日：2021-01-13

Applicant: EBARA CORPORATION

Inventor： Nobuyuki TAKADA ,  Hozumi YASUDA

IPC: H01L21/687 ,  B24B37/005 ,  B24B37/10 ,  B24B41/06 ,  H01L21/67 ,  B24B49/02 ,  H01L21/304 ,  H01L21/68 ,  H01L21/683

Abstract: A substrate processing apparatus includes a table, a pad holder, an elevating mechanism, and at least three centering mechanisms. The table is for supporting a substrate. The pad holder is for holding a polishing pad for polishing the substrate supported by the table. The elevating mechanism is for elevating the pad holder with respect to the substrate. The at least three centering mechanisms are for pushing the substrate supported by the table in a center direction of the table to position the substrate. The at least three centering mechanisms each include a rotation shaft arranged in a peripheral area of the table and a centering member mounted to the rotation shaft.

公开(公告)号：US20210193494A1

公开(公告)日：2021-06-24

申请号：US17126447

申请日：2020-12-18

Applicant: Ebara Corporation

Inventor： Nobuyuki TAKADA ,  Hozumi YASUDA

IPC: H01L21/68 ,  H01L21/66 ,  H01L21/306 ,  B24B37/20

Abstract: To improve uniformity in polishing of a polished surface of a substrate regardless of a tolerance of a diameter of the substrate. A substrate processing apparatus includes a table 100, a pad holder 226, a swing mechanism, a supporting member 300A, 300B, a measuring instrument 400, and a driving mechanism 320. The table 100 supports a substrate WF. The pad holder 226 holds a polishing pad 222. The polishing pad 222 polishes the substrate WF supported to the table 100. The swing mechanism swings the pad holder 226. The supporting member 300A, 300B supports the polishing pad 222 swung to outside the table 100 by the swing mechanism. The measuring instrument 400 is configured to measure a diameter of the substrate WF. The driving mechanism 320 adjusts a position of the supporting member 300A, 300B with respect to the substrate WF supported to the table 100 according to the diameter of the substrate WF measured by the measuring instrument 400.

公开(公告)号：US20240075579A1

公开(公告)日：2024-03-07

申请号：US18272941

申请日：2022-01-05

Applicant: EBARA CORPORATION

Inventor： Kohei OHSHIMA ,  Hisanori MATSUO ,  Toshifumi KIMBA ,  Nobuyuki TAKADA

IPC: B24B37/005

CPC classification number: B24B37/005

Abstract: The present invention relates to a surface property measuring apparatus for a polishing pad used for polishing a substrate, such as a semiconductor wafer, a surface property measuring method for a polishing pad, and a surface property judging mehod for a polishing pad. The surface property measuring apparatus (30) includes: a light-emitting structure (32) configured to irradiate the polishing pad (2) with light from a plurality of directions as viewed from a polishing surface (2a) of the polishing pad (2); and a light-receiving structure (32) configured to receive reflected light traveling in a plurality of directions from the surface of the polishing pad (2).

公开(公告)号：US20240051080A1

公开(公告)日：2024-02-15

申请号：US18257898

申请日：2021-11-09

Applicant: EBARA CORPORATION

Inventor： Kohei OTA ,  Nobuyuki TAKADA

IPC: B24B37/10 ,  B24B37/04 ,  H01L21/306

CPC classification number: B24B37/107 ,  B24B37/042 ,  H01L21/30625

Abstract: To suppress damage to a surface to be polished of a substrate and improve a polishing rate. A substrate processing apparatus includes a table 100 for supporting a substrate WF, a pad holder 226 for holding a polishing pad 222 for polishing the substrate WF supported by the table 100, a nozzle 228 for supplying a polishing liquid around the pad holder 226, and a pad rotation mechanism for rotating the pad holder 226. The pad holder 226 includes a discharge hole 221-2a formed in the center of a holding surface 221-2c configured to hold the polishing pad 222 and a discharge passage 221-2b communicated with an outside of the pad holder 226 from the discharge hole 221-2a.

公开(公告)号：US20220305610A1

公开(公告)日：2022-09-29

申请号：US17700816

申请日：2022-03-22

Applicant: EBARA CORPORATION

Inventor： Takuya FUJIMOTO ,  Nobuyuki TAKADA

IPC: B24B37/013 ,  B24B37/04

Abstract: The substrate polishing apparatus capable of measuring a film thickness of a substrate with high accuracy without decreasing a transmittance of light when measuring the film thickness of a substrate being polished is disclosed. The substrate polishing apparatus includes: a stage; a polishing head configured to hold a polishing pad; a polishing-liquid supply nozzle; a film-thickness measuring head; a spectrum analyzer; and a head nozzle to which the film-thickness measuring head is attached. The head nozzle includes a first flow-passage system and a second flow-passage system each configured to form a flow of liquid across an optical path of light and reflected light, the first flow-passage system has an aperture located on the optical path, the second flow-passage system has a liquid outlet port and a liquid suction port located at both sides of the aperture.

公开(公告)号：US20180236630A1

公开(公告)日：2018-08-23

申请号：US15900140

申请日：2018-02-20

Applicant: Ebara Corporation

Inventor： Hozumi YASUDA ,  Itsuki KOBATA ,  Nobuyuki TAKAHASHI ,  Suguru SAKUGAWA ,  Nobuyuki TAKADA

IPC: B24B37/013 ,  B24B37/10 ,  B24B53/017

CPC classification number: B24B37/013 ,  B24B21/12 ,  B24B27/0084 ,  B24B37/105 ,  B24B37/107 ,  B24B53/017

Abstract: A polisher for locally polishing a substrate is provided. The polisher includes a polishing member having a processing surface that comes into contact with the substrate and is smaller than the substrate, a pressing mechanism for pressing the polishing member against the substrate, a first drive mechanism for imparting motion to the polishing member in a first motion direction parallel to a surface of the substrate, a second drive mechanism for imparting motion to the polishing member in a second motion direction perpendicular to the first motion direction and having a component parallel to the surface of the substrate, and a controller for controlling the action of the polisher.