公开(公告)号：US20230352326A1

公开(公告)日：2023-11-02

申请号：US18349666

申请日：2023-07-10

Applicant: EBARA CORPORATION

Inventor： Kuniaki YAMAGUCHI ,  Toshio MIZUNO ,  Itsuki KOBATA ,  Mitsuru MIYAZAKI ,  Naoki TOYOMURA ,  Takuya INOUE

IPC: H01L21/67 ,  B24B37/10 ,  B24B49/14 ,  B24B53/017 ,  B24B37/34 ,  H01L21/304 ,  H01L21/306 ,  H01L21/02

CPC classification number: H01L21/67248 ,  H01L21/67178 ,  H01L21/67109 ,  H01L21/67051 ,  H01L21/67046 ,  H01L21/67028 ,  H01L21/67219 ,  B24B37/105 ,  B24B49/14 ,  B24B53/017 ,  B24B37/345 ,  H01L21/304 ,  H01L21/30625 ,  H01L21/6704 ,  H01L21/02065 ,  H01L21/02052

Abstract: A polishing apparatus is provided. The polishing apparatus includes:



a polishing unit configured to polish a substrate by bringing a polishing tool into contact with the substrate and moving the substrate relatively to the polishing tool; a cleaning unit; and a first transfer robot configured to transfer the substrate before polishing to the polishing unit and/or configured to transfer the substrate after polishing from the polishing unit to the cleaning unit. The cleaning unit includes: at least one cleaning module, a buff processing module configured to perform a buff process to the substrate, and a second transfer robot configured to transfer the substrate between the cleaning module and the buff processing module, the second transfer robot being different from the first robot.

公开(公告)号：US20170216991A1

公开(公告)日：2017-08-03

申请号：US15514785

申请日：2016-01-18

Applicant: EBARA CORPORATION

Inventor： Kuniaki YAMAGUCHI ,  ltsuki KOBATA ,  Toshio MIZUNO

IPC: B24B37/005 ,  H01L21/66 ,  H01L21/306 ,  B24B37/10 ,  B24B37/34

Abstract: The invention simulates polishing amount taking into account pressure concentration that occurs in the vicinity of the edge of a substrate when a small-diameter buffing pad overhangs the substrate to be buffed.One embodiment of the invention provides a method for simulating polishing amount in a case where a polishing pad of a smaller size than a substrate is used to buff the substrate. The method includes measuring distributions of pressure that is applied from the polishing pad to the substrate according to each overhang amount of the polishing pad relative to the substrate by using a pressure sensor, and correcting the pressure that is used in the polishing amount simulation in accordance with the overhang amounts and the measured pressure distributions.

公开(公告)号：US20160101498A1

公开(公告)日：2016-04-14

申请号：US14879786

申请日：2015-10-09

Applicant: EBARA CORPORATION

Inventor： Kuniaki YAMAGUCHI ,  Itsuki KOBATA ,  Toshio MIZUNO

IPC: B24B37/11 ,  H01L21/67

CPC classification number: B24B37/11 ,  H01L21/67051 ,  H01L21/67173 ,  H01L21/67178 ,  H01L21/67219

Abstract: A buffing apparatus for buffing a substrate is provided. The apparatus includes: a buff table for holding the substrate, the buff table being rotatable; a buff head to which a buff pad for buffing the substrate is attachable, the buff head being rotatable and movable in a direction approaching the buff table and a direction away from the buff table, and an internal supply line for supplying process liquid for the buffing to the substrate being formed inside the buff head; and an external nozzle provided separately through the internal supply line in order to supply the process liquid to the substrate.

Abstract translation: 提供了一种用于抛光衬底的抛光装置。 该装置包括：用于保持基板的抛光台，可旋转的抛光台; 一个抛光头，用于抛光衬底的抛光垫可附接到该抛光头上，该抛光头可旋转并且可在接近该抛光台的方向上移动并且远离该抛光台的方向，以及用于为抛光提供处理液体的内部供应线 到形成在抛光头内部的基板; 以及通过内部供应管线单独设置的外部喷嘴，以便将处理液体供应到基板。

公开(公告)号：US20160059380A1

公开(公告)日：2016-03-03

申请号：US14832767

申请日：2015-08-21

Applicant: EBARA CORPORATION

Inventor： Kuniaki YAMAGUCHI ,  Itsuki KOBATA ,  Toshio MIZUNO ,  Mitsuru MIYAZAKI ,  Naoki TOYOMURA ,  Takuya INOUE

IPC: B24B53/017 ,  B08B3/12 ,  B08B3/10 ,  B08B3/02 ,  H01L21/306 ,  B08B1/00

CPC classification number: B24B53/017 ,  B08B1/04 ,  B08B3/02 ,  B08B2203/0288 ,  H01L21/67046 ,  H01L21/67051

Abstract: An embodiment of the present invention provides a buff process module. The buff process module includes: a buff table on which a processing target object is mounted; a buff head that holds a buff pad for applying a predetermined process to the processing target object; a buff arm that supports and swings the buff head; a dresser for dressing the buff pad; and a cleaning mechanism that is disposed between the buff table and the dresser and is for cleaning the buff pad.

Abstract translation: 本发明的实施例提供了一种buff处理模块。 抛光处理模块包括：抛光台，其上安装有加工对象物体; 保持用于将预定处理应用于处理目标对象的抛光垫的抛光头; 一个支撑和摆动buff头的抛光臂; 用于打磨抛光垫的梳妆台; 以及清洁机构，其布置在抛光台和修整器之间并且用于清洁抛光垫。

公开(公告)号：US20190118338A1

公开(公告)日：2019-04-25

申请号：US16228525

申请日：2018-12-20

Applicant: EBARA CORPORATION

Inventor： Kuniaki YAMAGUCHI ,  Itsuki KOBATA ,  Toshio MIZUNO ,  Mitsuru MIYAZAKI ,  Naoki TOYOMURA ,  Takuya INOUE

IPC: B24B53/017 ,  H01L21/67 ,  B08B3/02 ,  B08B1/04

Abstract: An embodiment of the present invention provides a buff process module. The buff process module includes: a buff table on which a processing target object is mounted; a buff head that holds a buff pad for applying a predetermined process to the processing target object; a buff arm that supports and swings the buff head; a dresser for dressing the buff pad; and a cleaning mechanism that is disposed between the buff table and the dresser and is for cleaning the buff pad.

公开(公告)号：US20160099156A1

公开(公告)日：2016-04-07

申请号：US14872342

申请日：2015-10-01

Applicant: EBARA CORPORATION

Inventor： Kuniaki YAMAGUCHI ,  Toshio MIZUNO ,  Itsuki KOBATA ,  Mitsuru MIYAZAKI ,  Naoki TOYOMURA ,  Takuya INOUE

IPC: H01L21/306 ,  H01L21/02

CPC classification number: H01L21/67248 ,  B24B37/105 ,  B24B37/345 ,  B24B49/14 ,  B24B53/017 ,  H01L21/67028 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/67109 ,  H01L21/67178 ,  H01L21/67219

Abstract: A polishing apparatus is provided. The polishing apparatus includes: a polishing unit configured to polish a substrate by bringing a polishing tool into contact with the substrate and moving the substrate relatively to the polishing tool; a cleaning unit; and a first transfer robot configured to transfer the substrate before polishing to the polishing unit and/or configured to transfer the substrate after polishing from the polishing unit to the cleaning unit. The cleaning unit includes: at least one cleaning module, a buff processing module configured to perform a buff process to the substrate, and a second transfer robot configured to transfer the substrate between the cleaning module and the buff processing module, the second transfer robot being different from the first robot.

Abstract translation: 提供了一种抛光装置。 抛光装置包括：抛光单元，被配置为通过使抛光工具与基板接触并相对于抛光工具移动基板来抛光基板; 清洁单元; 以及第一传送机器人，其被配置为在抛光之前将所述基板转移到所述抛光单元和/或构造成在从所述抛光单元抛光到所述清洁单元之后将所述基板转移。 所述清洁单元包括：至少一个清洁模块，抛光处理模块，被配置为对所述基板执行抛光处理;以及第二传送机器人，其被配置为在所述清洁模块和所述抛光处理模块之间传送所述基板，所述第二传送机器人 不同于第一台机器人。

公开(公告)号：US20160059376A1

公开(公告)日：2016-03-03

申请号：US14834195

申请日：2015-08-24

Applicant: EBARA CORPORATION

Inventor： Kuniaki YAMAGUCHI ,  Toshio MIZUNO ,  Itsuki KOBATA

IPC: B24B37/04 ,  B24B41/00 ,  B24B37/20

CPC classification number: B24B37/04 ,  B24B37/10 ,  B24B37/20 ,  B24B41/002

Abstract: A buffing module for buffing a substrate is provided. The buffing module comprises a buff table for supporting the substrate, the buff table being rotatable; and a buff head to which a buff pad is attached, being rotatable and movable in a direction of approaching the buff table and a direction of moving away from the buff table. The buff pad includes a first part and a second part arranged so as to surround the first part on an outer side of the first part, the first part and the second part have different characteristics from each other.

Abstract translation: 提供了用于抛光衬底的抛光模块。 抛光模块包括用于支撑基板的抛光台，可旋转的抛光台; 以及一个抛光头，一个抛光垫被安装在该抛光头上，可以在接近抛光台的方向上旋转和移动，并且一个从抛光台移开的方向。 该抛光垫包括第一部分和第二部分，其布置成围绕第一部分的外侧上的第一部分，第一部分和第二部分具有彼此不同的特性。

公开(公告)号：US20240217050A1

公开(公告)日：2024-07-04

申请号：US18396359

申请日：2023-12-26

Applicant: EBARA CORPORATION

Inventor： Toshio MIZUNO ,  Yosuke HIMORI

IPC: B24B5/16 ,  B24B7/04 ,  B24B27/00 ,  B24B27/04

CPC classification number: B24B5/162 ,  B24B7/04 ,  B24B27/003 ,  B24B27/04 ,  B24B5/26

Abstract: Provided is a technique allowing an effective process of a bevel portion of a workpiece. A processing apparatus 1 includes a workpiece table 10 configured to hold a workpiece Wf, and a processing head 30 configured to hold a processing pad Pd. The processing pad includes a pad surface 120 provided with at least one groove 130 having an inner circumferential groove wall 131 and an outer circumferential groove wall 132. The processing apparatus 1 is configured to rotate the workpiece table and the processing head, and bring an edge 133 of the inner circumferential groove wall and an edge 134 of the outer circumferential groove wall in contact with a bevel portion 100 of the workpiece during a process of the workpiece.

公开(公告)号：US20230405762A1

公开(公告)日：2023-12-21

申请号：US18347464

申请日：2023-07-05

Applicant: EBARA CORPORATION

Inventor： Kuniaki YAMAGUCHI ,  Itsuki KOBATA ,  Toshio MIZUNO ,  Mitsuru MIYAZAKI ,  Naoki TOYOMURA ,  Takuya INOUE

IPC: B24B53/017 ,  B08B3/02 ,  B08B1/04 ,  H01L21/67

CPC classification number: B24B53/017 ,  B08B3/02 ,  B08B1/04 ,  H01L21/67046 ,  H01L21/67051 ,  B08B2203/0288

Abstract: An embodiment of the present invention provides a buff process module. The buff process module includes: a buff table on which a processing target object is mounted; a buff head that holds a buff pad for applying a predetermined process to the processing target object; a buff arm that supports and swings the buff head; a dresser for dressing the buff pad; and a cleaning mechanism that is disposed between the buff table and the dresser and is for cleaning the buff pad.

公开(公告)号：US20170252895A1

公开(公告)日：2017-09-07

申请号：US15604328

申请日：2017-05-24

Applicant: EBARA CORPORATION

Inventor： Kuniaki YAMAGUCHI ,  Itsuki KOBATA ,  Toshio MIZUNO ,  Mitsuru MIYAZAKI ,  Naoki TOYOMURA ,  Takuya INOUE

IPC: B24B53/017 ,  H01L21/67 ,  B08B1/04 ,  B08B3/02

CPC classification number: B24B53/017 ,  B08B1/04 ,  B08B3/02 ,  B08B2203/0288 ,  H01L21/67046 ,  H01L21/67051

Abstract: An embodiment of the present invention provides a buff process module. The buff process module includes: a buff table on which a processing target object is mounted; a buff head that holds a buff pad for applying a predetermined process to the processing target object; a buff arm that supports and swings the buff head; a dresser for dressing the buff pad; and a cleaning mechanism that is disposed between the buff table and the dresser and is for cleaning the buff pad.