公开(公告)号：US20180236631A1

公开(公告)日：2018-08-23

申请号：US15883978

申请日：2018-01-30

Applicant: EBARA CORPORATION

Inventor： Yohei Eto ,  Toru Maruyama

IPC: B24B37/015 ,  B24B55/02 ,  B24B49/14 ,  B24B57/02

CPC classification number: B24B37/015 ,  B24B37/107 ,  B24B49/14 ,  B24B55/02 ,  B24B57/02 ,  F28F3/12 ,  F28F2210/10

Abstract: A heat exchanger which can allow a surface temperature of a polishing pad to promptly reach a target temperature and can realize a uniform distribution of the surface temperature of the polishing pad is disclosed. The heat exchanger includes a pad contact surface capable of contacting the polishing pad, a heating flow passage through which a heating fluid is to flow, and a cooling flow passage through which a cooling fluid is to flow. The heating flow passage and the cooling flow passage are arranged side by side from beginnings to ends thereof, and the heating flow passage and the cooling flow passage cross each other at different levels at a peripheral portion of the pad contact surface.

公开(公告)号：US10414018B2

公开(公告)日：2019-09-17

申请号：US15436559

申请日：2017-02-17

Applicant: Ebara Corporation

Inventor： Toru Maruyama ,  Hisanori Matsuo ,  Yasuyuki Motoshima ,  Yohei Eto ,  Mitsunori Komatsu

IPC: B24B37/015 ,  B24B37/20

Abstract: There is disclosed an apparatus which can maintain a surface temperature of a polishing pad at a desired target temperature. The apparatus for regulating a surface temperature of a polishing pad, includes: a pad contact member which is contactable with a surface of the polishing pad and which has a heating flow passage and a cooling flow passage formed therein; a heating-liquid supply pipe coupled to the heating flow passage; a cooling-liquid supply pipe coupled to the cooling flow passage; a first flow control valve attached to the heating-liquid supply pipe; a second flow control valve attached to the cooling-liquid supply pipe; a pad-temperature measuring device configured to measure a surface temperature of the polishing pad; and a valve controller configured to operate the first flow control valve and the second flow control valve based on the surface temperature of the polishing pad.

公开(公告)号：US11380559B2

公开(公告)日：2022-07-05

申请号：US16842974

申请日：2020-04-08

Applicant: EBARA CORPORATION ,  HIRATA CORPORATION

Inventor： Yohei Eto ,  Junji Kunisawa ,  Teruaki Hombo ,  Keiji Kanazawa

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/687

Abstract: An object is to suppress dew condensation in a carrier device. There is provided a carrier device comprising a body; a rotational part provided to be rotatable relative to the body; an arm supported on the rotational part; an end effector provided in a leading end portion of the arm and configured to hold a work; a gas supply unit configured to supply a gas to an arm-side internal space provided in an arm-side base portion of the end effector and/or in the leading end portion of the arm; and an exhaust unit provided in a body-side internal space that communicates with the arm-side internal space and configured to discharge the gas in the arm-side internal space and/or in the body-side internal space.

公开(公告)号：US10589398B2

公开(公告)日：2020-03-17

申请号：US15883978

申请日：2018-01-30

Applicant: EBARA CORPORATION

Inventor： Yohei Eto ,  Toru Maruyama

IPC: B24B37/015 ,  B24B55/02 ,  B24B49/14 ,  B24B57/02 ,  B24B37/10 ,  F28F3/12

Abstract: A heat exchanger which can allow a surface temperature of a polishing pad to promptly reach a target temperature and can realize a uniform distribution of the surface temperature of the polishing pad is disclosed. The heat exchanger includes a pad contact surface capable of contacting the polishing pad, a heating flow passage through which a heating fluid is to flow, and a cooling flow passage through which a cooling fluid is to flow. The heating flow passage and the cooling flow passage are arranged side by side from beginnings to ends thereof, and the heating flow passage and the cooling flow passage cross each other at different levels at a peripheral portion of the pad contact surface.

公开(公告)号：US11094548B2

公开(公告)日：2021-08-17

申请号：US16313442

申请日：2017-06-26

Applicant: EBARA CORPORATION

Inventor： Shinji Kajita ,  Hisajiro Nakano ,  Tomoatsu Ishibashi ,  Koichi Fukaya ,  Yasuyuki Motoshima ,  Yohei Eto ,  Fumitoshi Oikawa

IPC: H01L21/304 ,  H01L21/67 ,  H01L21/687 ,  H01L21/02

Abstract: An apparatus for cleaning a substrate has a holding unit 60 that holds a substrate W; a rotated unit 30 connected to the holding unit 60; a rotating unit 35 that is provided on a peripheral outer side of the rotated unit 30 and rotates the rotated unit 30; and a cleaning unit 10, 20 that physically cleans the substrate W held by the holding unit 60.

公开(公告)号：US10475691B2

公开(公告)日：2019-11-12

申请号：US15063137

申请日：2016-03-07

Applicant: Ebara Corporation

Inventor： Toru Maruyama ,  Yasuyuki Motoshima ,  Yohei Eto

IPC: H01L21/687 ,  B25J15/00 ,  B25J11/00

Abstract: A substrate transfer hand is configured to sandwich a substrate between a plurality of receiving members and a gripping member and to fix the substrate by moving the gripping member with an actuator. The plurality of receiving members each have a flat plate-shaped support portion mounted on the main hand body, a substrate outer periphery holding portion supported on the support portion and configured to hold an outer periphery of the substrate, and a substrate lower surface holding portion supported on the support portion and configured to hold a lower surface of the substrate. The substrate outer periphery holding portion has a portion provided vertically from the support portion and configured to hold the substrate in contact with the outer periphery of the substrate. The substrate lower surface holding portion has a portion inclined from an outer peripheral side toward an inner side of the substrate to be held. The substrate outer periphery holding portion and the substrate lower surface holding portion are spaced from each other by a gap or a groove.

公开(公告)号：US20160264365A1

公开(公告)日：2016-09-15

申请号：US15063137

申请日：2016-03-07

Applicant: Ebara Corporation

Inventor： Toru Maruyama ,  Yasuyuki Motoshima ,  Yohei Eto

IPC: B65G47/90 ,  H01L21/687 ,  B25J11/00

Abstract: A substrate transfer hand is configured to sandwich a substrate between a plurality of receiving members and a gripping member and to fix the substrate by moving the gripping member with an actuator. The plurality of receiving members each have a flat plate-shaped support portion mounted on the main hand body, a substrate outer periphery holding portion supported on the support portion and configured to hold an outer periphery of the substrate, and a substrate lower surface holding portion supported on the support portion and configured to hold a lower surface of the substrate. The substrate outer periphery holding portion has a portion provided vertically from the support portion and configured to hold the substrate in contact with the outer periphery of the substrate. The substrate lower surface holding portion has a portion inclined from an outer peripheral side toward an inner side of the substrate to be held. The substrate outer periphery holding portion and the substrate lower surface holding portion are spaced from each other by a gap or a groove.

Abstract translation: 衬底传送手构造成将衬底夹在多个接收构件和夹持构件之间，并且通过用致动器移动夹持构件来固定衬底。 所述多个接收部件各自具有安装在所述主手柄上的平板状支撑部，支撑在所述支撑部上并被构造成保持所述基板的外周的基板外周保持部，以及基板下表面保持部 支撑在支撑部分上并构造成保持基板的下表面。 基板外周保持部具有从支撑部垂直设置的部分，并且被配置为保持基板与基板的外周接触。 基板下表面保持部具有从要保持的基板的外周侧向内侧倾斜的部分。 基板外周保持部和基板下表面保持部通过间隙或槽彼此间隔开。