公开(公告)号：US20220016651A1

公开(公告)日：2022-01-20

申请号：US17374583

申请日：2021-07-13

Applicant: EBARA CORPORATION

Inventor： Fumitoshi Oikawa ,  Koichi Fukaya ,  Hisajiro Nakano

IPC: B05B7/04 ,  B08B3/02 ,  B08B15/02

Abstract: According to one embodiment, provided is a substrate cleaning device including a nozzle that includes: a first supply port; a second supply port; a third supply port; a first discharge port; and a third discharge port, wherein the substrate cleaning device is configured to clean a substrate with jets of the second mixed fluid of the gas, the treatment liquid and the surface tension reducing gas.

公开(公告)号：US12205831B2

公开(公告)日：2025-01-21

申请号：US18444981

申请日：2024-02-19

Applicant: EBARA CORPORATION

Inventor： Mitsuru Miyazaki ,  Tomoaki Fujimoto ,  Koichi Fukaya ,  Fumitoshi Oikawa ,  Takuya Inoue

IPC: H01L21/67 ,  B08B1/32 ,  B08B3/02 ,  B24B7/22 ,  H01L21/687

Abstract: A cleaning apparatus includes: a cleaning tank that defines a cleaning space for cleaning a wafer; a wafer rotation mechanism that is arranged inside the cleaning tank and holds and rotates the wafer; a cleaning member that contacts and cleans a surface of the wafer, is rotatable around a central axis extending in a lateral direction, and has a length in an axial direction longer than a radius of the wafer; a swing mechanism that swings the cleaning member around a swing axis located inside the cleaning tank to move the cleaning member from a retracted position outside of the wafer to a cleaning position directly above the wafer; a second cleaning means that cleans the surface of the wafer; and a second swing mechanism that swings the second cleaning means around a second swing axis located inside the cleaning tank to pass directly above a center of the wafer.

公开(公告)号：US11094548B2

公开(公告)日：2021-08-17

申请号：US16313442

申请日：2017-06-26

Applicant: EBARA CORPORATION

Inventor： Shinji Kajita ,  Hisajiro Nakano ,  Tomoatsu Ishibashi ,  Koichi Fukaya ,  Yasuyuki Motoshima ,  Yohei Eto ,  Fumitoshi Oikawa

IPC: H01L21/304 ,  H01L21/67 ,  H01L21/687 ,  H01L21/02

Abstract: An apparatus for cleaning a substrate has a holding unit 60 that holds a substrate W; a rotated unit 30 connected to the holding unit 60; a rotating unit 35 that is provided on a peripheral outer side of the rotated unit 30 and rotates the rotated unit 30; and a cleaning unit 10, 20 that physically cleans the substrate W held by the holding unit 60.

公开(公告)号：US20240082885A1

公开(公告)日：2024-03-14

申请号：US18511727

申请日：2023-11-16

Applicant: EBARA CORPORATION

Inventor： Fumitoshi Oikawa ,  Koichi Fukaya ,  Erina Baba ,  Shuichi Suemasa ,  Hisajiro Nakano

IPC: B08B3/02 ,  B08B1/04

CPC classification number: B08B3/024 ,  B08B1/04 ,  B08B2203/0288

Abstract: A substrate cleaning device includes a rotation mechanism that rotates the substrate, a first cleaning solution supply nozzle that discharges a cleaning solution to which ultrasonic vibration is applied to the surface of the substrate, and a swing mechanism that swings the first cleaning solution supply nozzle from a vicinity of a rotation center of the substrate toward an outer peripheral edge of the substrate in a range narrower than a half-surface of the substrate.

公开(公告)号：US12100587B2

公开(公告)日：2024-09-24

申请号：US17068114

申请日：2020-10-12

Applicant: EBARA CORPORATION

Inventor： Fumitoshi Oikawa ,  Tomoaki Fujimoto ,  Mitsuru Miyazaki ,  Koichi Fukaya

IPC: H01L21/02 ,  B08B1/32 ,  B08B3/10 ,  B08B13/00 ,  H01L21/67

CPC classification number: H01L21/02087 ,  B08B1/32 ,  B08B3/102 ,  B08B13/00 ,  H01L21/67017

Abstract: A substrate cleaning apparatus has: a substrate rotating part that rotates a substrate; an edge cleaning member for cleaning an edge part of the substrate; an edge rotating part that rotates the edge cleaning member around an edge rotary shaft that extends in a direction orthogonal to a substrate rotary shaft; a moving part that moves a position of the edge cleaning member with respect to the edge part of the substrate; and a control part that controls the moving part to move the position of the edge cleaning member with respect to the edge part of the substrate, and causes the edge cleaning member to clean a one-side edge area including a face on one side, a side face area including a side face, and an another-side edge area including a face on another side in the edge part of the substrate.

公开(公告)号：US11948811B2

公开(公告)日：2024-04-02

申请号：US17128643

申请日：2020-12-21

Applicant: EBARA CORPORATION

Inventor： Mitsuru Miyazaki ,  Tomoaki Fujimoto ,  Koichi Fukaya ,  Fumitoshi Oikawa ,  Takuya Inoue

IPC: H01L21/67 ,  B08B1/04 ,  B08B3/02 ,  B24B7/22 ,  H01L21/687

CPC classification number: H01L21/67051 ,  B08B1/04 ,  B08B3/024 ,  B24B7/228 ,  H01L21/67046 ,  H01L21/6719 ,  H01L21/67219 ,  H01L21/67253 ,  H01L21/68764

Abstract: A cleaning apparatus includes: a cleaning tank that defines a cleaning space for cleaning a wafer; a wafer rotation mechanism that is arranged inside the cleaning tank and holds and rotates the wafer; a cleaning member that contacts and cleans a surface of the wafer, is rotatable around a central axis extending in a lateral direction, and has a length in an axial direction longer than a radius of the wafer; a swing mechanism that swings the cleaning member around a swing axis located inside the cleaning tank to move the cleaning member from a retracted position outside of the wafer to a cleaning position directly above the wafer; a second cleaning means that cleans the surface of the wafer; and a second swing mechanism that swings the second cleaning means around a second swing axis located inside the cleaning tank to pass directly above a center of the wafer.

公开(公告)号：US20220203411A1

公开(公告)日：2022-06-30

申请号：US17561268

申请日：2021-12-23

Applicant: EBARA CORPORATION

Inventor： Fumitoshi Oikawa ,  Koichi Fukaya ,  Erina Baba ,  Shuichi Suemasa ,  Hisajiro Nakano

IPC: B08B3/12 ,  B08B3/02 ,  B08B1/04

Abstract: A substrate cleaning device includes a rotation mechanism that rotates the substrate, a first cleaning solution supply nozzle that discharges a cleaning solution to which ultrasonic vibration is applied to the surface of the substrate, and a swing mechanism that swings the first cleaning solution supply nozzle from a vicinity of a rotation center of the substrate toward an outer peripheral edge of the substrate in a range narrower than a half-surface of the substrate.