-
公开(公告)号：US20240138087A1
公开(公告)日：2024-04-25
申请号：US18109912
申请日：2023-02-15
Applicant: ELEMENTS PERFORMANCE TECHNOLOGY INC.
Inventor： JERRYSON LEE , Ethan Lee , Yu-Jia Huang , KUO-SUNG HUANG
CPC classification number: H05K7/14322 , H05B45/37
Abstract: A power conversion device having a temperature determination function is provided. The power conversion device is disposed on a light fixture and includes a housing, a power converter, and at least one temperature determination component. The power converter and the temperature determination component are disposed within the housing, and the temperature determination component is a temperature fuse. When an ambient temperature of the power converter reaches a preset temperature, the temperature determination component melts to indicate that the power converter is used under the abnormal ambient temperature. Accordingly, the ambient temperature of the power converter can be determined to be abnormal.
-
公开(公告)号：US20240237186A9
公开(公告)日：2024-07-11
申请号：US18313358
申请日：2023-05-07
Applicant: ELEMENTS PERFORMANCE TECHNOLOGY INC.
Inventor： JERRYSON LEE , Ethan Lee , Yu-Jia Huang , KUO-SUNG HUANG
CPC classification number: H05K1/0201 , F21V23/02 , H05K1/18 , F21Y2115/10 , H05K2201/062 , H05K2201/10015
Abstract: A power supply device having a thermal insulation function includes a circuit board, and at least one heat-sensitive component and a plurality of heat-generating electronic components that are disposed on the circuit board and spaced apart from one another. The heat-generating electronic components include a transformer, an inductor, an integrated circuit, or a metal oxide semiconductor (MOS). A minimum distance between the heat-sensitive component and the heat-generating electronic components is 7 mm. A thermal insulation area is defined between the heat-sensitive component and the heat-generating electronic components, and none of the heat-generating electronic components is disposed within a 270° range of the thermal insulation area. The heat-generating electronic components are disposed outside the thermal insulation area to separate the heat-sensitive component from a heat source on the circuit board, such that a high temperature of the heat source has less influence on the heat-sensitive component.
-
公开(公告)号：US20240237253A9
公开(公告)日：2024-07-11
申请号：US18109912
申请日：2023-02-15
Applicant: ELEMENTS PERFORMANCE TECHNOLOGY INC.
Inventor： JERRYSON LEE , Ethan Lee , Yu-Jia Huang , KUO-SUNG HUANG
CPC classification number: H05K7/14322 , H05B45/37
Abstract: A power conversion device having a temperature determination function is provided. The power conversion device is disposed on a light fixture and includes a housing, a power converter, and at least one temperature determination component. The power converter and the temperature determination component are disposed within the housing, and the temperature determination component is a temperature fuse. When an ambient temperature of the power converter reaches a preset temperature, the temperature determination component melts to indicate that the power converter is used under the abnormal ambient temperature. Accordingly, the ambient temperature of the power converter can be determined to be abnormal.
-
公开(公告)号：US20240138049A1
公开(公告)日：2024-04-25
申请号：US18313358
申请日：2023-05-06
Applicant: ELEMENTS PERFORMANCE TECHNOLOGY INC.
Inventor： JERRYSON LEE , Ethan Lee , Yu-Jia Huang , KUO-SUNG HUANG
CPC classification number: H05K1/0201 , F21V23/02 , H05K1/18 , F21Y2115/10 , H05K2201/062 , H05K2201/10015
Abstract: A power supply device having a thermal insulation function includes a circuit board, and at least one heat-sensitive component and a plurality of heat-generating electronic components that are disposed on the circuit board and spaced apart from one another. The heat-generating electronic components include a transformer, an inductor, an integrated circuit, or a metal oxide semiconductor (MOS). A minimum distance between the heat-sensitive component and the heat-generating electronic components is 7 mm. A thermal insulation area is defined between the heat-sensitive component and the heat-generating electronic components, and none of the heat-generating electronic components is disposed within a 270° range of the thermal insulation area. The heat-generating electronic components are disposed outside the thermal insulation area to separate the heat-sensitive component from a heat source on the circuit board, such that a high temperature of the heat source has less influence on the heat-sensitive component.
-
-
-
Search Results
4
records
(took 0.02 seconds)
