公开(公告)号：US20240088066A1

公开(公告)日：2024-03-14

申请号：US18463771

申请日：2023-09-08

Applicant: EM Microelectronic-Marin SA

Inventor： Christophe ENTRINGER ,  Yves Dupraz ,  Pierre Muller ,  Zeng Wang ,  Alexis Durand ,  Arthur Hugh MacDougall

IPC: H01L23/58 ,  H01L21/78 ,  H01L23/31

CPC classification number: H01L23/585 ,  H01L21/78 ,  H01L23/3192 ,  H01L24/13

Abstract: A semiconductor wafer (1a, 1b) including a plurality of chips (2) and a separation zone (3) spacing the semiconductor chips (2) from each other in this wafer (1a, 1b), such a separation zone (3) extending from a front face (4a) to an opposite backside face (4b) of this wafer (1a, 1b), this separation zone (3) includes a scribe line (6) configured to be diced using plasma etching and an inlet area (13) of this scribe line (6), the inlet (13) being delimitated by free ends of plasma etch-resistant material layers (9) extending each from a peripheral wall (20) of a functional part (18) of a chip (2) into the scribe line (6) by overlapping a top of a seal ring (7) of this chip (2).

公开(公告)号：US20230206022A1

公开(公告)日：2023-06-29

申请号：US18085770

申请日：2022-12-21

Applicant: EM Microelectronic-Marin SA

Inventor： Pierre MULLER ,  Yves Dupraz ,  Alexis Durand ,  Gordon Limond

IPC: G06K19/077

CPC classification number: G06K19/07798

Abstract: A tamper-evident RFID Tag (100) and a method for manufacturing it. The method (500) may provide (510) at least one protection layer (151) before being cured (520) such as to turn the at least one protection layer (151) into at least one degradable layer (155), and to prevent an assembly or a reassembly of the tamper-evident RFID Tag (100) after any attempt of harvesting of the tamper-evident RFID Tag (100).