公开(公告)号：US11409975B2

公开(公告)日：2022-08-09

申请号：US17269552

申请日：2019-08-22

Applicant: EM Microelectronic-Marin SA

Inventor： James J. Springer ,  Fabrice Walter ,  Pierre Muller ,  Fabien Bourquin

IPC: H04B5/02 ,  H04W4/80 ,  G06K19/073 ,  G06K7/10 ,  H04B5/00

Abstract: The present disclosure relates to a NFC communication system, to a method of establishing communication between a wireless communication device and a passive NFC device and to a passive NFC device. The passive NFC device includes an NFC controller, an NFC transceiver coupled with the NFC controller, and at least one persistent flag coupled with the NFC controller, the persistent flag being switchable between an activated state and a deactivated state. The NFC controller is configured to perform a logical operation being divisible into a sequence of at least a first subtask and a second subtask and the NFC controller is configured to ascertain the status of the persistent flag. The NFC controller is further configured to selectively perform at least one of the first subtask and the second subtask on the basis of the status of the persistent flag.

公开(公告)号：US20240088066A1

公开(公告)日：2024-03-14

申请号：US18463771

申请日：2023-09-08

Applicant: EM Microelectronic-Marin SA

Inventor： Christophe ENTRINGER ,  Yves Dupraz ,  Pierre Muller ,  Zeng Wang ,  Alexis Durand ,  Arthur Hugh MacDougall

IPC: H01L23/58 ,  H01L21/78 ,  H01L23/31

CPC classification number: H01L23/585 ,  H01L21/78 ,  H01L23/3192 ,  H01L24/13

Abstract: A semiconductor wafer (1a, 1b) including a plurality of chips (2) and a separation zone (3) spacing the semiconductor chips (2) from each other in this wafer (1a, 1b), such a separation zone (3) extending from a front face (4a) to an opposite backside face (4b) of this wafer (1a, 1b), this separation zone (3) includes a scribe line (6) configured to be diced using plasma etching and an inlet area (13) of this scribe line (6), the inlet (13) being delimitated by free ends of plasma etch-resistant material layers (9) extending each from a peripheral wall (20) of a functional part (18) of a chip (2) into the scribe line (6) by overlapping a top of a seal ring (7) of this chip (2).

公开(公告)号：US12153983B2

公开(公告)日：2024-11-26

申请号：US18251043

申请日：2021-11-01

Applicant: EM Microelectronic-Marin SA

Inventor： Paul Muller ,  Christophe Entringer ,  Pierre Muller ,  Thomas Coulot ,  Arthur Hugh MacDougall

IPC: G06K19/077

Abstract: An RFID assembly and an assembly method thereof are provided. The assembly method for an RFID assembly comprises a step of providing at least one integrated circuit which includes at least one IC contact and at least one dielectric layer, and a deposition of at least one electrical contact and of at least one re-passivation layer. The at least one electrical contact is deposited on at least one first portion and the at least one re-passivation layer is deposited on at least one second portion, which is distinct of the at least one first portion.