公开(公告)号：US20190172729A1

公开(公告)日：2019-06-06

申请号：US16200010

申请日：2018-11-26

Applicant: Elemental Scientific, Inc.

Inventor： Tyler Yost ,  Daniel R. Wiederin ,  Beau Marth ,  Jared Kaser ,  Jonathan Hein ,  Jae Seok Lee ,  Jae Min Kim ,  Stephen H. Sudyka

IPC: H01L21/67 ,  H01J49/10 ,  G01N21/73 ,  H01L21/66

Abstract: Systems and methods are described for integrated decomposition and scanning of a semiconducting wafer, where a single chamber is utilized for decomposition and scanning of the wafer of interest.

公开(公告)号：US20230395406A1

公开(公告)日：2023-12-07

申请号：US18320748

申请日：2023-05-19

Applicant: Elemental Scientific, Inc.

Inventor： Tyler Yost ,  Daniel R. Wiederin ,  Beau A. Marth ,  Jared Kaser ,  Jonathan Hein ,  Jae Seok Lee ,  Jae Min Kim ,  Stephen H. Sudyka

IPC: H01L21/67 ,  H01L21/66 ,  H01L21/677 ,  H01J49/10 ,  G01N21/73

CPC classification number: H01L21/6719 ,  H01L21/67126 ,  H01L22/34 ,  H01L21/67772 ,  H01J49/105 ,  H01L21/67748 ,  H01L21/67051 ,  H01L21/67259 ,  H01L21/6708 ,  G01N21/73 ,  H01L22/14 ,  H01L21/6715 ,  H01L22/12 ,  H01J49/00

Abstract: Systems and methods are described for integrated decomposition and scanning of a semiconducting wafer, where a single chamber is utilized for decomposition and scanning of the wafer of interest.

公开(公告)号：US11476134B2

公开(公告)日：2022-10-18

申请号：US17361943

申请日：2021-06-29

Applicant: Elemental Scientific, Inc.

Inventor： Tyler Yost ,  Daniel R. Wiederin ,  Beau Marth ,  Jared Kaser ,  Jonathan Hein ,  Jae Seok Lee ,  Jae Min Kim ,  Stephen H. Sudyka

IPC: H01L21/67 ,  H01L21/66 ,  G01N21/73 ,  H01L21/677 ,  H01J49/10 ,  H01J49/00 ,  G01N33/00

Abstract: Systems and methods are described for integrated decomposition and scanning of a semiconducting wafer, where a single chamber is utilized for decomposition and scanning of the wafer of interest.

公开(公告)号：US11694914B2

公开(公告)日：2023-07-04

申请号：US17968124

申请日：2022-10-18

Applicant: Elemental Scientific, Inc.

Inventor： Tyler Yost ,  Daniel R. Wiederin ,  Beau A. Marth ,  Jared Kaser ,  Jonathan Hein ,  Jae Seok Lee ,  Jae Min Kim ,  Stephen H. Sudyka

IPC: H01L21/67 ,  H01L21/66 ,  G01N21/73 ,  G01N33/00 ,  H01L21/677 ,  H01J49/10 ,  H01J49/00

CPC classification number: H01L21/6719 ,  G01N21/73 ,  H01J49/105 ,  H01L21/6708 ,  H01L21/6715 ,  H01L21/67051 ,  H01L21/67126 ,  H01L21/67259 ,  H01L21/67748 ,  H01L21/67772 ,  H01L22/14 ,  H01L22/34 ,  G01N2033/0095 ,  H01J49/00 ,  H01L22/12

Abstract: Systems and methods are described for integrated decomposition and scanning of a semiconducting wafer, where a single chamber is utilized for decomposition and scanning of the wafer of interest.

公开(公告)号：US11406973B1

公开(公告)日：2022-08-09

申请号：US16561306

申请日：2019-09-05

Applicant: Elemental Scientific, Inc.

Inventor： Daniel R. Wiederin ,  Jared Kaser

IPC: B01L3/02

Abstract: A fluid handling assembly for selectively coupling and decoupling with a pipet tip can include a sampling arm, an arm cover, a probe carrier unit, a probe, and a biasing spring. The arm cover can be carried by the sampling arm. The probe carrier unit can be movably mounted within the arm cover, with the probe carrier unit including a probe release structure and a main probe carrier. The probe release structure and the main probe carrier can be interconnected. The probe can be carried by the main probe carrier and movable through a probe opening in the arm cover. The probe can be configured to releasably carry a pipet tip. The biasing spring can be carried within the arm cover and can contact the probe release structure. The biasing spring can bias the probe release structure to push the probe down toward the probe opening in the arm cover.

公开(公告)号：US11244841B2

公开(公告)日：2022-02-08

申请号：US16200038

申请日：2018-11-26

Applicant: Elemental Scientific, Inc.

Inventor： Tyler Yost ,  Daniel R. Wiederin ,  Beau Marth ,  Jared Kaser ,  Jonathan Hein ,  Jae Seok Lee ,  Jae Min Kim ,  Stephen H. Sudyka

IPC: H01L21/67 ,  H01L21/66 ,  H01L21/677 ,  H01J49/10 ,  G01N21/73 ,  H01J49/00 ,  G01N33/00

Abstract: Systems and methods are described for integrated decomposition and scanning of a semiconducting wafer, where a single chamber is utilized for decomposition and scanning of the wafer of interest.

公开(公告)号：US12094738B2

公开(公告)日：2024-09-17

申请号：US18320748

申请日：2023-05-19

Applicant: Elemental Scientific, Inc.

Inventor： Tyler Yost ,  Daniel R. Wiederin ,  Beau A. Marth ,  Jared Kaser ,  Jonathan Hein ,  Jae Seok Lee ,  Jae Min Kim ,  Stephen H. Sudyka

IPC: H01L21/67 ,  G01N21/73 ,  G01N33/00 ,  H01J49/00 ,  H01J49/10 ,  H01L21/66 ,  H01L21/677

CPC classification number: H01L21/6719 ,  G01N21/73 ,  H01J49/105 ,  H01L21/67051 ,  H01L21/6708 ,  H01L21/67126 ,  H01L21/6715 ,  H01L21/67259 ,  H01L21/67748 ,  H01L21/67772 ,  H01L22/14 ,  H01L22/34 ,  G01N33/0095 ,  H01J49/00 ,  H01L22/12

Abstract: Systems and methods are described for integrated decomposition and scanning of a semiconducting wafer, where a single chamber is utilized for decomposition and scanning of the wafer of interest.

公开(公告)号：US11705351B2

公开(公告)日：2023-07-18

申请号：US16200010

申请日：2018-11-26

Applicant: Elemental Scientific, Inc.

Inventor： Tyler Yost ,  Daniel R. Wiederin ,  Beau Marth ,  Jared Kaser ,  Jonathan Hein ,  Jae Seok Lee ,  Jae Min Kim ,  Stephen H. Sudyka

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/66 ,  H01J49/10 ,  G01N21/73 ,  H01J49/00 ,  G01N33/00

CPC classification number: H01L21/6719 ,  G01N21/73 ,  H01J49/105 ,  H01L21/6708 ,  H01L21/6715 ,  H01L21/67051 ,  H01L21/67126 ,  H01L21/67259 ,  H01L21/67748 ,  H01L21/67772 ,  H01L22/14 ,  H01L22/34 ,  G01N2033/0095 ,  H01J49/00 ,  H01L22/12

Abstract: Systems and methods are described for integrated decomposition and scanning of a semiconducting wafer, where a single chamber is utilized for decomposition and scanning of the wafer of interest.

公开(公告)号：US20220189794A1

公开(公告)日：2022-06-16

申请号：US17562411

申请日：2021-12-27

Applicant: Elemental Scientific, Inc.

Inventor： Tyler Yost ,  Daniel R. Wiederin ,  Beau Marth ,  Jared Kaser ,  Jonathan Hein ,  Jae Seok Lee ,  Jae Min Kim ,  Stephen H. Sudyka

IPC: H01L21/67 ,  H01L21/66 ,  H01L21/677 ,  H01J49/10 ,  G01N21/73

Abstract: Systems and methods are described for integrated decomposition and scanning of a semiconducting wafer, where a single chamber is utilized for decomposition and scanning of the wafer of interest.

公开(公告)号：US20190172731A1

公开(公告)日：2019-06-06

申请号：US16200074

申请日：2018-11-26

Applicant: Elemental Scientific, Inc.

Inventor： Tyler Yost ,  Daniel R. Wiederin ,  Beau Marth ,  Jared Kaser ,  Jonathan Hein ,  Jae Seok Lee ,  Jae Min Kim ,  Stephen H. Sudyka

IPC: H01L21/67 ,  H01L21/677 ,  H01J49/10 ,  H01L21/66

Abstract: Systems and methods are described for integrated decomposition and scanning of a semiconducting wafer, where a single chamber is utilized for decomposition and scanning of the wafer of interest.