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公开(公告)号：US20230055543A1
公开(公告)日：2023-02-23
申请号：US17497359
申请日：2021-10-08
Applicant: Elite Material Co., Ltd.
Inventor： Rongtao WANG , Zhenfang SHANG , Ningning JIA
Abstract: A resin composition includes 100 parts by weight of an unsaturated C═C double bond-containing polyphenylene ether resin; 15 parts by weight to 40 parts by weight of a hydrogenated styrene-butadiene-styrene triblock copolymer; 1 part by weight to 20 parts by weight of a compound of Formula (1); and 0.001 part by weight to 0.5 part by weight of a compound of Formula (2), a compound of Formula (3), a compound of Formula (4) or a combination thereof. Moreover, an article may be made from the resin composition, including a prepreg, a resin film, a laminate or a printed circuit board.
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