公开(公告)号：US20210032463A1

公开(公告)日：2021-02-04

申请号：US16550844

申请日：2019-08-26

Applicant: Elite Material Co., Ltd.

Inventor： Chenyu SHEN ,  Yan ZHANG ,  Jue TAN ,  Rongtao WANG

IPC: C08L71/12 ,  C08J5/24 ,  C08L79/08 ,  B32B5/02 ,  B32B5/26 ,  B32B15/14 ,  B32B15/20 ,  H05K1/03

Abstract: A resin composition comprises: an unsaturated bond-containing polyphenylene ether resin; a maleimide resin of Formula (1); and a compound of Formula (2) or Formula (3). The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following improvements can be achieved, including prepreg viscosity variation ratio, stickiness resistance, amount of void after lamination, multi-layer board thermal resistance, glass transition temperature, ratio of thermal expansion, copper foil peeling strength and dissipation factor.

公开(公告)号：US20210139691A1

公开(公告)日：2021-05-13

申请号：US16716977

申请日：2019-12-17

Applicant: Elite Material Co., Ltd.

Inventor： Yan ZHANG ,  Jue TAN ,  Rongtao WANG

IPC: C08L53/00 ,  C08F293/00 ,  C08F299/02 ,  C08J5/24 ,  C08K5/3435 ,  C08K5/3415 ,  C08K5/50 ,  B32B15/20 ,  B32B5/02 ,  B32B15/14

Abstract: A resin composition includes: a vinyl-containing polyphenylene ether resin; a compound of Formula (1); and a compound of Formula (2), a compound of Formula (3), a compound of Formula (4) or a combination thereof. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following improvements can be achieved, including prepreg viscosity variation ratio, prepreg stickiness resistance, amount of void after lamination, multi-layer board thermal resistance, glass transition temperature, ratio of thermal expansion, copper foil peeling strength, dissipation factor and laminate appearance.

公开(公告)号：US20230055543A1

公开(公告)日：2023-02-23

申请号：US17497359

申请日：2021-10-08

Applicant: Elite Material Co., Ltd.

Inventor： Rongtao WANG ,  Zhenfang SHANG ,  Ningning JIA

IPC: C08L65/02 ,  C08J5/24

Abstract: A resin composition includes 100 parts by weight of an unsaturated C═C double bond-containing polyphenylene ether resin; 15 parts by weight to 40 parts by weight of a hydrogenated styrene-butadiene-styrene triblock copolymer; 1 part by weight to 20 parts by weight of a compound of Formula (1); and 0.001 part by weight to 0.5 part by weight of a compound of Formula (2), a compound of Formula (3), a compound of Formula (4) or a combination thereof. Moreover, an article may be made from the resin composition, including a prepreg, a resin film, a laminate or a printed circuit board.