公开(公告)号：US20230303389A1

公开(公告)日：2023-09-28

申请号：US17702599

申请日：2022-03-23

Applicant: Exo Imaging, Inc.

Inventor： Liang WANG ,  David KREVOR ,  Naresh MANTRAVADI ,  Brian BIRCUMSHAW ,  Jason TAUSCHER

IPC: B81C1/00 ,  B81B7/00

CPC classification number: B81C1/00825 ,  B81B7/0016 ,  B81B2201/0271 ,  B81B2207/012 ,  B81C2203/0792

Abstract: Described herein are methods and systems useful in the fabrication of ultrasound transducer devices. Fabrication of ultrasound transducer devices can comprise manipulation of components having extremely small cross-sectional thicknesses, which can increase the risk of damage to the components. For example, inadvertent application of forces sufficient to damage such components is a significant risk during fabrication steps. As described herein, the risk of damage to an ultrasound transducer device component having a small cross-sectional thickness, such as an ultrasound microelectromechanical system (MEMS) wafer, can be reduced by partially or completely coating or filling all or a portion of the component with a stabilizing material, for example, prior to subjecting the component to forces associated with manipulation of the component during the fabrication process.