公开(公告)号：US4715117A

公开(公告)日：1987-12-29

申请号：US839730

申请日：1986-03-14

Applicant: Eyo Enomoto

Inventor： Eyo Enomoto

IPC: H05K3/46 ,  H05K1/00 ,  H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K3/00 ,  H05K3/18 ,  H05K3/38 ,  H05K3/42 ,  H01K3/22 ,  H01K3/10

CPC classification number: H05K1/0306 ,  H05K1/0287 ,  H05K3/0055 ,  H05K2201/09581 ,  H05K2201/09609 ,  H05K2201/09945 ,  H05K2203/1394 ,  H05K3/181 ,  H05K3/386 ,  H05K3/426 ,  H05K3/429 ,  Y10T29/49163 ,  Y10T29/49165

Abstract: A ceramic substrate having a plurality of holes arranged regularly with a specified pitch can be used for an universal high density ceramic wiring board, wherein predetermined one or more holes among said plurality of holes are used as through holes for interconnecting both side circuits, and the remaining holes not used for a circuit are filled with an electrical insulating material.Said ceramic substrate of universal type can easily be produced inexpensively and within a short lead time, because said substrate requires no individual mold for each of various circuits to punch a green sheet and can be kept in stock as a fired ceramic substrate.

公开(公告)号：US4792646A

公开(公告)日：1988-12-20

申请号：US97452

申请日：1987-09-16

Applicant: Eyo Enomoto

Inventor： Eyo Enomoto

IPC: H05K3/46 ,  H05K1/00 ,  H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K3/00 ,  H05K3/18 ,  H05K3/38 ,  H05K3/42

CPC classification number: H05K1/0306 ,  H05K1/0287 ,  H05K3/0055 ,  H05K2201/09581 ,  H05K2201/09609 ,  H05K2201/09945 ,  H05K2203/1394 ,  H05K3/181 ,  H05K3/386 ,  H05K3/426 ,  H05K3/429 ,  Y10T29/49163 ,  Y10T29/49165

Abstract: A ceramic substrate having a plurality of holes arranged regularly with a specified pitch can be used for an universal high density ceramic wiring board, wherein predetermined one or more holes among said plurality of holes are used as through holes for interconnecting both side circuits, and the remaining holes not used for a circuit are filled with an electrical insulating material.Said ceramic substrate of universal type can easily be produced inexpensively and within a short lead time, because said substrate requires no individual mold for each of various circuits to punch a green sheet and can be kept in stock as a fired ceramic substrate.

Abstract translation: 具有以规定间距规则排列的多个孔的陶瓷基板可以用于通用高密度陶瓷布线板，其中所述多个孔中的预定的一个或多个孔用作用于互连两侧电路的通孔，并且 不用于电路的剩余孔填充有电绝缘材料。 所述通用型陶瓷基板可以容易地廉价地生产并且在短的提前期内，因为所述基板不需要各种电路的单独模具来冲压生片，并且可以作为烧制的陶瓷基板保存。