公开(公告)号：US20150382456A1

公开(公告)日：2015-12-31

申请号：US14753165

申请日：2015-06-29

Applicant: FANUC CORPORATION

Inventor： Norihiro SAIDOU ,  Yuichi OKOUCHI

IPC: H05K1/02 ,  H05K3/34 ,  H05K1/18

CPC classification number: H05K3/3452 ,  H05K1/181 ,  H05K2201/09845 ,  H05K2203/0594 ,  H05K2203/1476

Abstract: A printed circuit board including a metal conductor formed on a surface of an insulating base material and having a component mounting portion, and a solder resist covering a part of the metal conductor, includes a thinned part on a component-mounting-portion side in the solder resist.

Abstract translation: 一种印刷电路板，包括形成在绝缘基材的表面上并具有部件安装部分的金属导体和覆盖金属导体的一部分的阻焊剂，包括在所述金属导体的部件安装部侧的薄化部分 阻焊剂

公开(公告)号：US20150319851A1

公开(公告)日：2015-11-05

申请号：US14699078

申请日：2015-04-29

Applicant: FANUC CORPORATION

Inventor： Norihiro SAIDOU ,  Takeshi SAWADA

IPC: H05K1/02 ,  H05K3/00 ,  H05K1/09

CPC classification number: H05K1/0284 ,  H05K1/09 ,  H05K3/0091 ,  H05K3/06 ,  H05K3/243 ,  H05K3/244 ,  H05K3/3468 ,  H05K2201/0355 ,  H05K2203/0353 ,  H05K2203/0445 ,  H05K2203/0554 ,  H05K2203/073

Abstract: A printed circuit board includes, an insulating substrate, a metal conductor which is formed on the insulating substrate, a solder resist coating a part of the metal conductor, a scooped-out portion of the metal conductor formed in the vicinity of an end of the solder resist, and a metal layer coating the scooped-out portion.

Abstract translation: 印刷电路板包括绝缘基板，形成在绝缘基板上的金属导体，金属导体的一部分的阻焊剂涂层，形成在金属导体的端部附近的金属导体的舀出部分 阻焊剂和涂覆舀出部分的金属层。