公开(公告)号：US20160227648A1

公开(公告)日：2016-08-04

申请号：US15013286

申请日：2016-02-02

Applicant: FANUC Corporation

Inventor： Takeshi SAWADA ,  Yuichi OKOUCHI ,  Daisuke MIURA

IPC: H05K1/11 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K3/3426 ,  H05K3/305 ,  H05K2201/10772 ,  Y02P70/613

Abstract: The width of a lead-terminal connection pad on a printed wiring board is not greater than the width of a lead terminal. Therefore, a wider space can be secured between adjacent solder joints, so that bridge failure can be suppressed. Further, the length of projection of the lead-terminal connection pad at the proximal portion of the lead terminal is shorter than that of a lead-terminal connection pad on a conventional printed wiring board. Thus, a solder pool at the proximal portion of the lead terminal can be reduced to suppress bridge defect.

Abstract translation: 印刷电路板上的引线端子连接焊盘的宽度不大于引线端子的宽度。 因此，可以在相邻的焊点之间确保更宽的空间，从而可以抑制桥接故障。 此外，引线端子连接焊盘在引线端子的基端部的突出长度比传统印刷电路板上的引线端子连接焊盘的突出长度短。 因此，可以减少引线端子的近端部分的焊料池，以抑制桥接缺陷。

公开(公告)号：US20230276569A1

公开(公告)日：2023-08-31

申请号：US18040352

申请日：2021-07-28

Applicant: FANUC CORPORATION

Inventor： Takeshi SAWADA ,  Fuyuki UENO

IPC: H05K1/02

CPC classification number: H05K1/0268 ,  H05K1/0296

Abstract: Provided is a printed circuit board for degradation detection, the printed circuit board having an insulator substrate and a wiring pattern for degradation detection, the wiring pattern being formed on an outer surface of the insulator substrate, and the printed circuit board for degradation detection being attached to a main printed circuit board for which degradation is to be detected. The wiring pattern is formed on, of the outer surfaces of the insulator substrate, a back surface positioned on the main printed circuit board side. The insulator substrate has a penetrating part (through hole, notch part) penetrating from the back surface to a front surface positioned on the side opposite from the back surface.

公开(公告)号：US20180088451A1

公开(公告)日：2018-03-29

申请号：US15710993

申请日：2017-09-21

Applicant: FANUC CORPORATION

Inventor： Takeshi SAWADA ,  Fuyuki UENO

IPC: G03B21/16 ,  H04N9/31 ,  F16M13/02 ,  F21V29/67

CPC classification number: G03B21/16 ,  F16M11/10 ,  F16M13/027 ,  F21V29/677 ,  G06F1/20 ,  H02K9/04 ,  H02K9/26 ,  H02K11/33 ,  H04N9/3144

Abstract: A cooling device includes a fan for blowing air to a control board arranged on the downstream side by rotation of a rotator. The cooling device further includes a bypass structure provided so as to avoid the rotator and configured to oil liquid to flow, at least, from the upstream side of the fan to the downstream side of the fan, and a gutter provided on the upstream side of the fan to lead the oil liquid to the bypass structure.

公开(公告)号：US20150319851A1

公开(公告)日：2015-11-05

申请号：US14699078

申请日：2015-04-29

Applicant: FANUC CORPORATION

Inventor： Norihiro SAIDOU ,  Takeshi SAWADA

IPC: H05K1/02 ,  H05K3/00 ,  H05K1/09

CPC classification number: H05K1/0284 ,  H05K1/09 ,  H05K3/0091 ,  H05K3/06 ,  H05K3/243 ,  H05K3/244 ,  H05K3/3468 ,  H05K2201/0355 ,  H05K2203/0353 ,  H05K2203/0445 ,  H05K2203/0554 ,  H05K2203/073

Abstract: A printed circuit board includes, an insulating substrate, a metal conductor which is formed on the insulating substrate, a solder resist coating a part of the metal conductor, a scooped-out portion of the metal conductor formed in the vicinity of an end of the solder resist, and a metal layer coating the scooped-out portion.

Abstract translation: 印刷电路板包括绝缘基板，形成在绝缘基板上的金属导体，金属导体的一部分的阻焊剂涂层，形成在金属导体的端部附近的金属导体的舀出部分 阻焊剂和涂覆舀出部分的金属层。

公开(公告)号：US20180070442A1

公开(公告)日：2018-03-08

申请号：US15693523

申请日：2017-09-01

Applicant: FANUC CORPORATION

Inventor： Takeshi SAWADA ,  Yuichi OKOCHI ,  Norihiro SAIDO

IPC: H05K1/02 ,  H05K1/14 ,  G01R31/02

CPC classification number: H05K1/0268 ,  G01R31/021 ,  H05K1/141 ,  H05K3/321 ,  H05K3/3436 ,  H05K2201/0302

Abstract: To provide a printed circuit board that allows for easy exchange of only a deterioration detection conductor, and can reduce costs. A printed circuit board includes: a main printed circuit board in which a wiring pattern is formed on an insulated substrate; and a deterioration detection wiring board in which deterioration detection wiring (deterioration detection wiring pattern) which is wiring having a form whereby deterioration is promoted compared to the wiring pattern on the insulated substrate is formed on a separate insulated substrate from the main printed circuit board, and is exchangeably connected to the main printed circuit board in a vicinity thereof by way of a replacement-enabling connection part. One mode of the replacement-enabling connection part of the printed circuit board is a connection part (solder joint) constituted by solder, another mode thereof is a connection part (electrically conductive adhesive connection part) constituted by electrically conductive adhesive, and yet another mode thereof is a connection part (cable) constituted by a cable.

公开(公告)号：US20170031328A1

公开(公告)日：2017-02-02

申请号：US15223008

申请日：2016-07-29

Applicant: FANUC Corporation

Inventor： Takeshi SAWADA ,  Weibo LI ,  Kunitaka KOMAKI ,  Yuuki KUROKAWA ,  Shinji AKIMOTO

IPC: G05B13/02 ,  G05B19/4063 ,  G05B19/401

CPC classification number: G05B13/028 ,  G05B19/401 ,  G05B19/404 ,  G05B19/4063 ,  G05B2219/33056 ,  G05B2219/33322 ,  G05B2219/37336 ,  G05B2219/37617 ,  G05B2219/39076 ,  G05B2219/49205 ,  Y02P90/265

Abstract: A machining apparatus is provided with a machine learning device that performs machine learning. The machine learning device performs the machine learning by receiving the input of machining accuracy between a machining shape of a workpiece measured on-machine and design data on the workpiece and machining time of the workpiece measured by a measurement device. Based on a result of the machine learning, the machining apparatus changes machining conditions such that the machining accuracy increases and the machining time becomes as short as possible.

Abstract translation: 一种加工装置具有执行机器学习的机器学习装置。 机器学习装置通过接收在机器上测量的工件的加工形状与工件上的设计数据和由测量装置测量的工件的加工时间之间的加工精度的输入来执行机器学习。 基于机器学习的结果，加工装置改变加工条件，使得加工精度增加，并且加工时间变得尽可能短。

公开(公告)号：US20160324000A1

公开(公告)日：2016-11-03

申请号：US15138354

申请日：2016-04-26

Applicant: FANUC Corporation

Inventor： Makoto BEKKE ,  Takeshi SAWADA

IPC: H05K1/11 ,  H05K1/18

CPC classification number: H05K3/3415 ,  H05K3/3468 ,  H05K2201/10022 ,  H05K2201/10515 ,  H05K2203/1178 ,  Y02P70/613

Abstract: In a leaded electronic component mounting structure in which the effect of reducing the occurrence of a blow hole is not impaired even if resin of a lead-inserted component is softened by heat during soldering and which can reduce a load placed on a lead when an external force acts, the lead of the lead-inserted component is inserted into a through hole provided in a base material of a printed wiring board, soldering is performed by immersing into molten solder, and a surface mount component and a surface mount component pad form an air vent tunnel. The air vent tunnel does not come into direct contact with the lead-inserted component, and therefore is not blocked even if the resin of the lead-inserted component softens due to soldering. Thus, the effect of reducing the occurrence of a blow hole is not impaired.

Abstract translation: 在引导电子部件安装结构中，即使在焊接期间，引入插入部件的树脂由于热而软化而能够减少吹气孔的发生的效果，并且当外部 引线插入部件的引线被插入到设置在印刷电路板的基材中的通孔中，通过浸入熔融焊料中进行焊接，并且表面安装部件和表面安装部件焊盘形成为 通气孔。 排气通道不会与引线插入部件直接接触，因此即使引线插入部件的树脂由于焊接而软化，也不会被阻塞。 因此，不会损害减少气孔的发生的效果。

公开(公告)号：US20150245482A1

公开(公告)日：2015-08-27

申请号：US14630048

申请日：2015-02-24

Applicant: FANUC Corporation

Inventor： Nobuhisa SUGIMOTO ,  Takeshi SAWADA

IPC: H05K1/11 ,  H05K1/18

CPC classification number: H05K1/111 ,  H05K1/181 ,  H05K3/3421 ,  H05K3/3442 ,  H05K2201/09381 ,  Y02P70/611

Abstract: In a printed wiring board on which an electronic component comprising electrode terminal rows on four peripheral sides or two opposite sides thereof is mounted, each of pads at the both ends of pad rows corresponding to the electrode terminal rows extend outwardly relative to the other pads in the direction of arrangement of the pads and has a shape obtained by diagonally cutting a corner located farthest from the center of the electronic component.

Abstract translation: 在其上安装有包括四个周边或其两个相对侧上的电极端子排的电子部件的印刷电路板中，与电极端子排相对应的焊盘列的两端的每个焊盘相对于另一个焊盘向外延伸 焊盘的布置方向，并且具有通过对角切割位于离电子部件的中心最远的拐角获得的形状。