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公开(公告)号：US10924011B2
公开(公告)日：2021-02-16
申请号：US16258254
申请日：2019-01-25
Applicant: Faraday Semi, Inc.
Inventor： Parviz Parto
Abstract: A direct current to direct current (DC-DC) converter can include a chip embedded integrated circuit (IC), one or more switches, and an inductor. The IC can be embedded in a PCB. The IC can include driver, switches, and PWM controller. The IC and/or switches can include eGaN. The inductor can be stacked above the IC and/or switches, reducing an overall footprint. One or more capacitors can also be stacked above the IC and/or switches. Vias can couple the inductor and/or capacitors to the IC (e.g., to the switches). The DC-DC converter can offer better transient performance, have lower ripples, or use fewer capacitors. Parasitic effects that prevent efficient, higher switching speeds are reduced. The inductor size and overall footprint can be reduced. Multiple inductor arrangements can improve performance. Various feedback systems can be used, such as a ripple generator in a constant on or off time modulation circuit.
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公开(公告)号：US11557962B2
公开(公告)日：2023-01-17
申请号：US17174275
申请日：2021-02-11
Applicant: Faraday Semi, Inc.
Inventor： Parviz Parto
Abstract: A direct current to direct current (DC-DC) converter can include a chip embedded integrated circuit (IC), one or more switches, and an inductor. The IC can be embedded in a PCB. The IC can include driver, switches, and PWM controller. The IC and/or switches can include eGaN. The inductor can be stacked above the IC and/or switches, reducing an overall footprint. One or more capacitors can also be stacked above the IC and/or switches. Vias can couple the inductor and/or capacitors to the IC (e.g., to the switches). The DC-DC converter can offer better transient performance, have lower ripples, or use fewer capacitors. Parasitic effects that prevent efficient, higher switching speeds are reduced. The inductor size and overall footprint can be reduced. Multiple inductor arrangements can improve performance. Various feedback systems can be used, such as a ripple generator in a constant on or off time modulation circuit.
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公开(公告)号：US11069624B2
公开(公告)日：2021-07-20
申请号：US16851032
申请日：2020-04-16
Applicant: FARADAY SEMI, INC.
Inventor： Martin Standing , Parviz Parto
Abstract: A die can be applied to a front conductive layer. Openings can be formed in the conductive layer over contact points on the die. The openings can be filled with a conductive material to electrically couple the conductive layer to the contact points on the die. The front conductive layer can be etched to form a first conductive pattern. Conductive standoffs can be formed on portions of the front conductive layer. An additional front conductive layer can be laminated onto the front side. Openings can be formed in the additional front conductive layer over the standoffs. The openings can be filled with a conductive material to electrically couple the additional conductive layer to the underlying standoffs. The additional conductive layer can be etched to form a second conductive pattern.
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公开(公告)号：US11063516B1
公开(公告)日：2021-07-13
申请号：US16942602
申请日：2020-07-29
Applicant: FARADAY SEMI, INC.
Inventor： Seungbeom Kevin Kim , Jack Walter Cornish, III , Saurabh Anil Jayawant , Parviz Parto
Abstract: A power converter can include first, second, third, and fourth power switches, and a driver for operating the drive switches to modify an input voltage. An AC coupling capacitor can be coupled between the first and fourth power switches. Bootstrap capacitors can be used for driving the first and second power switches, which can be high-side switches. In some embodiments, a current sensing circuit can be used to measure current through the third and/or fourth power switches and for determining the current through the power converter. In some embodiments, the power converter can monitor the voltage across the AC coupling capacitor and can determine the current through the power converter based on the monitored voltages. In some embodiments, the AC coupling capacitor can be pre-charged before the power converter begins normal operation.
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公开(公告)号：US20240266957A1
公开(公告)日：2024-08-08
申请号：US18506941
申请日：2023-11-10
Applicant: FARADAY SEMI, INC.
Inventor： Seungbeom Kevin Kim , Jack Walter Cornish, III , Saurabh Anil Jayawant , Parviz Parto
CPC classification number: H02M3/158 , H02M1/0006 , H02M1/0095 , H02M1/08
Abstract: A power converter can include first, second, third, and fourth power switches, and a driver for operating the drive switches to modify an input voltage. An AC coupling capacitor can be coupled between the first and fourth power switches. Bootstrap capacitors can be used for driving the first and second power switches, which can be high-side switches. In some embodiments, a current sensing circuit can be used to measure current through the third and/or fourth power switches and for determining the current through the power converter. In some embodiments, the power converter can monitor the voltage across the AC coupling capacitor and can determine the current through the power converter based on the monitored voltages. In some embodiments, the AC coupling capacitor can be pre-charged before the power converter begins normal operation.
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Patent Agency Ranking
公开(公告)号：US11990839B2
公开(公告)日：2024-05-21
申请号：US18338188
申请日：2023-06-20
Applicant: Faraday Semi, Inc.
Inventor： Parviz Parto , Saurabh Anil Jayawant , Jimmy Lin
CPC classification number: H02M3/158 , H02M1/0009 , H02M1/0058 , H02M3/07
Abstract: A power converter can include first, second, third, and fourth switches, and a driver for operating the drive switches to modify an input voltage and provide an output voltage. An AC coupling capacitor can be coupled between the first and fourth switches. The first, second, third, and fourth switches can control current through two inductors. The power converter can have a fifth switch, which can provide a discharge path for discharging the first inductor, the second inductor, and/or the capacitor. Another capacitor can be between the fifth switch and ground. The power converter can provide an output voltage that is at least about ⅙ of the input voltage. The power converter can include resonance circuitry, such as a third inductor, for soft switching the fifth switch.
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公开(公告)号：US20240055360A1
公开(公告)日：2024-02-15
申请号：US18185234
申请日：2023-03-16
Applicant: FARADAY SEMI, INC.
Inventor： Martin Standing , Parviz Parto
CPC classification number: H01L23/5389 , H01L23/5383 , H01L23/5386 , H01L24/19 , H01L24/20 , H01L21/4853 , H01L21/4857 , H01L21/4864 , H01L21/565 , H01L21/78 , H01L23/3121 , H01L2924/14252 , H01L2224/214 , H01L2924/1205 , H01L2924/1206
Abstract: A die can be applied to a front conductive layer. Openings can be formed in the conductive layer over contact points on the die. The openings can be filled with a conductive material to electrically couple the conductive layer to the contact points on the die. The front conductive layer can be etched to form a first conductive pattern. Conductive standoffs can be formed on portions of the front conductive layer. An additional front conductive layer can be laminated onto the front side. Openings can be formed in the additional front conductive layer over the standoffs. The openings can be filled with a conductive material to electrically couple the additional conductive layer to the underlying standoffs. The additional conductive layer can be etched to form a second conductive pattern.
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公开(公告)号：US20220069705A1
公开(公告)日：2022-03-03
申请号：US17371885
申请日：2021-07-09
Applicant: FARADAY SEMI, INC.
Inventor： Seungbeom Kevin Kim , Jack Walter Cornish, III , Saurabh Anil Jayawant , Parviz Parto
Abstract: A power converter can include first, second, third, and fourth power switches, and a driver for operating the drive switches to modify an input voltage. An AC coupling capacitor can be coupled between the first and fourth power switches. Bootstrap capacitors can be used for driving the first and second power switches, which can be high-side switches. In some embodiments, a current sensing circuit can be used to measure current through the third and/or fourth power switches and for determining the current through the power converter. In some embodiments, the power converter can monitor the voltage across the AC coupling capacitor and can determine the current through the power converter based on the monitored voltages. In some embodiments, the AC coupling capacitor can be pre-charged before the power converter begins normal operation.
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公开(公告)号：US20220068823A1
公开(公告)日：2022-03-03
申请号：US17371825
申请日：2021-07-09
Applicant: FARADAY SEMI, INC.
Inventor： Martin Standing , Parviz Parto
Abstract: A die can be applied to a front conductive layer. Openings can be formed in the conductive layer over contact points on the die. The openings can be filled with a conductive material to electrically couple the conductive layer to the contact points on the die. The front conductive layer can be etched to form a first conductive pattern. Conductive standoffs can be formed on portions of the front conductive layer. An additional front conductive layer can be laminated onto the front side. Openings can be formed in the additional front conductive layer over the standoffs. The openings can be filled with a conductive material to electrically couple the additional conductive layer to the underlying standoffs. The additional conductive layer can be etched to form a second conductive pattern.
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公开(公告)号：US20250062683A1
公开(公告)日：2025-02-20
申请号：US18643893
申请日：2024-04-23
Applicant: FARADAY SEMI, INC.
Inventor： Parviz Parto
Abstract: A direct current to direct current (DC-DC) converter can include a chip embedded integrated circuit (IC), one or more switches, and an inductor. The IC can be embedded in a PCB. The IC can include driver, switches, and PWM controller. The IC and/or switches can include eGaN. The inductor can be stacked above the IC and/or switches, reducing an overall footprint. One or more capacitors can also be stacked above the IC and/or switches. Vias can couple the inductor and/or capacitors to the IC (e.g., to the switches). The DC-DC converter can offer better transient performance, have lower ripples, or use fewer capacitors. Parasitic effects that prevent efficient, higher switching speeds are reduced. The inductor size and overall footprint can be reduced. Multiple inductor arrangements can improve performance. Various feedback systems can be used, such as a ripple generator in a constant on or off time modulation circuit.
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