公开(公告)号：US20240222067A1

公开(公告)日：2024-07-04

申请号：US18393233

申请日：2023-12-21

Applicant: FEI Company

Inventor： Radek Smolka ,  Lukas Zabransky ,  Branislav Straka ,  Marek Melichar

IPC: H01J37/244 ,  H01J37/10 ,  H01J37/24

CPC classification number: H01J37/244 ,  H01J37/10 ,  H01J37/24 ,  H01J2237/24578 ,  H01J2237/2826

Abstract: Disclosed herein are systems and methods for calibration of a charged particle beam microscope, including a source configured to generate a CPB comprising a plurality of charged particles having a known energy; at least one lens; a detector; and a controller. According to various disclosed embodiments, the controller may determine, based on a calibration characteristic, that the CPB microscope requires recalibration. Based on that determination, the controller may operate the source to generate a calibration CPB and configure the at least one lens to act as a charged particle mirror. The controller may receive data from the detector associated with the plurality of charged particles after reflecting off the charged particle mirror. The controller may then analyze the data from the detector and automatically recalibrate the CPB microscope based on calibration characteristics in the data from the detector.

公开(公告)号：US20240363304A1

公开(公告)日：2024-10-31

申请号：US18509205

申请日：2023-11-14

Applicant: FEI Company

Inventor： Jaroslav Velcovský ,  Remco T. J. P. Geurts ,  Marek Melichar

IPC: H01J37/10 ,  H01J37/04 ,  H01J37/22 ,  H01J37/305

CPC classification number: H01J37/10 ,  H01J37/045 ,  H01J37/22 ,  H01J37/3053 ,  H01J2237/006

Abstract: Surface contamination and debris deposition associated with laser ablation or ion beam milling is reduced by combining a directed flow to a workpiece with suction at a suitable vacuum pressure. The vacuum pressure is typically selected so that any contaminants or debris have relatively short mean free paths to avoid build-up on distant surfaces in a vacuum chamber. A shutter can be used to shield portions of a charged-particle-beam optical column during processing. Processing at vacuum pressures associated with the relatively short MFPs can be combined with processing at vacuum pressures associated with relatively long MFPs to provide coarse and fine milling or ablation.