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公开(公告)号：US20240322494A1
公开(公告)日：2024-09-26
申请号：US18612078
申请日：2024-03-21
Inventor： JIA-HAU LIU , QIN-XIN CAO , TSU-YANG WU
IPC: H01R13/6471 , H01R13/6581
CPC classification number: H01R13/6471 , H01R13/6581
Abstract: An electrical connector includes: a housing defining a longitudinal direction; a row of first terminals being retained in the housing and having plural pairs of signal terminals and plural grounding terminals; a row of second terminals retained in the housing opposite to the row of the first terminals; and a first grounding member retained in the housing, wherein the first grounding member has a longitudinal ridge, plural shielding portions, and plural grounding tails extending from the longitudinal ridge, the shielding portions face and shield corresponding pairs of signal terminals of the row of first terminals, respectively, spanning from a rear end to a front end of corresponding signal terminals, and the grounding tails contact corresponding grounding terminals of the row of first terminals, respectively.
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Patent Agency Ranking
公开(公告)号：US20190235188A1
公开(公告)日：2019-08-01
申请号：US16238534
申请日：2019-01-03
Applicant: FU DING PRECISION COMPONENT (SHEN ZHEN) CO., LTD. , FOXCONN INTERCONNECT TECHNOLOGY LIMITED
Inventor： SHIH-WEI HSIAO , HSIU-YUAN HSU , WEI-CHIH LIN , SHUO-HSIU HSU , YEN-HSU KO , CHIH-CHUNG HSIEH , CHENG-KAI HUANG , PAUL CHEN , GENN-SHENG LEE , JIA-HAU LIU , MAO-CHUN WENG , WAYNE CHOU
IPC: G02B6/42 , H05K1/18 , H05K1/14 , H05K1/02 , H05K5/03 , H05K5/00 , H05K5/02 , H01R12/70 , H01R12/71
Abstract: A interconnection system includes a panel side kit and a wall-mount kit coupled with each other and secured together via magnetic forces. The wall-mount kit includes a printed circuit board enclosed within a bracket and defining a center region for power transmission and a pair of side regions for high speed transmission. In the side regions, on the coupling side a plurality of wireless transmission units are located while on the back side a plurality of ROSA OE modules are provided to transfer the optical signal from optical fibers to the electronic signal for wireless transmission wherein the optical fibers are linked to a control box via a plurality of TOSA EO modules. The panel side kit includes wireless receiving units that interact with the wireless transmission units, and a plurality of connectors with the body of the display.
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公开(公告)号：US20240429632A1
公开(公告)日：2024-12-26
申请号：US18748510
申请日：2024-06-20
Applicant: FUDING PRECISION COMPONENTS (SHENZHEN) CO., LTD. , FOXCONN INTERCONNECT TECHNOLOGY LIMITED
Inventor： FANG-JWU LIAO , JIA-HAU LIU , CHIA-RU CHANG
Abstract: A chip connector includes: an insulative housing defining an upper face, a lower face, and plural terminal grooves extending through the upper face and the lower face; and plural conductive terminals received in the terminal grooves respectively, each terminal including a fixing portion, an elastic arm extending from the fixing portion, a tail portion, and an accessory portion, the elastic arm including an upward portion, an inclined portion extending obliquely from the upward portion, and a contacting portion bending from the inclined portion, wherein the accessory portion comprises a slanting portion with a resisting portion at a free end thereof, the slanting portion faces and extends toward the fixing portion, and the inclined portion abuts against the resisting portion when the elastic arm is moved downwards.
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公开(公告)号：US20160109664A1
公开(公告)日：2016-04-21
申请号：US14884772
申请日：2015-10-16
Applicant: FOXCONN INTERCONNECT TECHNOLOGY LIMITED
Inventor： CHUN-YI CHANG , JIA-HAU LIU
CPC classification number: G02B6/428 , G02B6/4206 , H05K1/0209 , H05K1/0243 , H05K2201/09063 , H05K2201/10121 , H05K2201/10545 , H05K2203/167
Abstract: An optoelectronic assembly includes a printed circuit board (PCB) defining opposite upper and lower surfaces, and equipped, on the upper surface, with an active component and an Integrated Circuit (IC) linked to each other via the flip chip technology, a lens module located on the side of the lower surface and communicating with the active component through via holes in the PCB, and a fiber assembly located in the lens module to be optically coupled to the active component via said lens module.
Abstract translation: 光电组件包括限定相对的上表面和下表面的印刷电路板（PCB），并且在上表面上配备有通过倒装芯片技术相互连接的有源部件和集成电路（IC），透镜模块 位于下表面的侧面并通过PCB中的通孔与有源部件连通，以及位于透镜模块中的光纤组件，以通过所述透镜模块光学耦合到有源部件。
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5.发明公开公开(公告)号：US20230411907A1
公开(公告)日：2023-12-21
申请号：US18208373
申请日：2023-06-12
Inventor： FANG-JWU LIAO , JIA-HAU LIU , JUI-HSIANH CHIU
IPC: H01R13/6471
CPC classification number: H01R13/6471
Abstract: An electrical connector includes: a substrate having plural holes; plural contacts mounted in the corresponding holes, the plural contacts including a first row of contacts arranged as a pair of signal contacts flanked by two ground contacts, a second row of contacts having four ground contacts on one side of the first row of contacts, and a third row of contacts having four ground contacts on another side, each contact including a body and an upper arm; and a coupling element interconnecting the two ground contacts of the first row to selected ground contacts of the second and third rows, wherein the upper arm of each of the plurality of contacts has a contacting convex facing upward, and the four ground contacts of the second row are connected side by side and the four ground contacts of the third row are connected side by side.
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公开(公告)号：US20160109665A1
公开(公告)日：2016-04-21
申请号：US14884774
申请日：2015-10-16
Applicant: FOXCONN INTERCONNECT TECHNOLOGY LIMITED
Inventor： CHUN-YI CHANG , JIA-HAU LIU
CPC classification number: G02B6/428 , G02B6/0088 , G02B6/4214 , G02B6/4259 , G02B6/4269 , G02B6/4292
Abstract: An optoelectronic assembly includes a printed circuit board (PCB), a glass carrier positioned upon the PCB and equipped with thereon an active component and an Integrated Circuit (IC) linked to each other via the flip chip technology, an optical waveguide embedded within the PCB, and a ferrule located around the optical waveguide to couple an external optical device thereto for optical transmission therebetween.
Abstract translation: 光电组件包括印刷电路板（PCB），位于PCB上并配有有源元件的玻璃载体和通过倒装芯片技术彼此连接的集成电路（IC），嵌入PCB内的光波导 以及位于光波导周围的套圈，以将外部光学装置耦合到其上，用于其间的光传输。
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