公开(公告)号：US20160334472A1

公开(公告)日：2016-11-17

申请号：US14710102

申请日：2015-05-12

Applicant: FREESCALE SEMICONDUCTOR, INC.

Inventor： PAIGE M. HOLM ,  Lianjun Liu

IPC: G01R33/00

CPC classification number: G01R33/0023 ,  G01R33/0011 ,  G01R33/0017 ,  G01R33/0035 ,  G01R33/09

Abstract: A sensor package includes a magnetic field sensor and a corruption detection and reset subsystem. The magnetic field sensor has a magnetic sense element and a ferromagnetic structure characterized by a baseline magnetic state. The subsystem includes a detector element, a processor, and current carrying structure positioned in proximity to the ferromagnetic structure. Methodology performed by the subsystem entails detecting at the detector element an altered magnetic state of the ferromagnetic structure, where the altered magnetic state differs from the baseline magnetic state. Methodology further entails determining, at the processor, when a reset action is needed in response to the altered magnetic state and applying a reset magnetic field to the ferromagnetic structure to reset the ferromagnetic structure from the altered magnetic state to the baseline magnetic state.

Abstract translation: 传感器封装包括磁场传感器和损坏检测和复位子系统。 磁场传感器具有磁感应元件和以基线磁状态为特征的铁磁结构。 子系统包括位于铁磁结构附近的检测器元件，处理器和载流结构。 由子系统执行的方法需要在检测器元件处检测铁磁结构的改变的磁状态，其中改变的磁状态与基线磁状态不同。 方法还需要在处理器处确定响应于改变的磁状态需要复位动作并将复位磁场施加到铁磁结构以将铁磁结构从改变的磁状态重新设置到基线磁状态。

公开(公告)号：US20160204089A1

公开(公告)日：2016-07-14

申请号：US14596888

申请日：2015-01-14

Applicant: FREESCALE SEMICONDUCTOR, INC.

Inventor： PAIGE M. HOLM ,  VIJAY SARIHAN

IPC: H01L25/16 ,  H01L23/00 ,  H01L43/12 ,  H01L43/06 ,  H01L43/04

CPC classification number: H01L24/17 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L2224/0401 ,  H01L2224/05569 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/06134 ,  H01L2224/1134 ,  H01L2224/11462 ,  H01L2224/11849 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13155 ,  H01L2224/1319 ,  H01L2224/14134 ,  H01L2224/14179 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81815 ,  H01L2224/92125 ,  H01L2224/94 ,  H01L2924/14 ,  H01L2924/146 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/01082 ,  H01L2224/03 ,  H01L2224/11

Abstract: A device package includes a substrate having an active surface. Electrical connection bumps are deposited on the active surface and are arranged in an array having a perimeter. At least one electronic component is formed at a region of the active surface, where the region is located outside of the perimeter of the array of electrical connection bumps. When the device package is coupled with external circuitry via the electrical connection bumps, the region at which the electronic component is formed is suspended over the electronic circuitry. This region is subject to a lower stress profile than a region of the active surface circumscribed by the perimeter. Thus, stress sensitive electronic components can be located in this lower stress region of the active surface.

Abstract translation: 器件封装包括具有活性表面的衬底。 电连接凸块沉积在有源表面上并且布置成具有周边的阵列。 在有源表面的区域处形成至少一个电子部件，其中该区域位于电连接凸块阵列的周边之外。 当器件封装经由电连接凸块与外部电路耦合时，形成电子部件的区域悬挂在电子电路上。 该区域经受比由周边限定的活动表面的区域更低的应力分布。 因此，应力敏感的电子部件可以位于活性表面的该较低应力区域中。

公开(公告)号：US20150048462A1

公开(公告)日：2015-02-19

申请号：US14527567

申请日：2014-10-29

Applicant: FREESCALE SEMICONDUCTOR, INC.

Inventor： PHILIP H. BOWLES ,  PAIGE M. HOLM ,  STEPHEN R. HOOPER ,  RAYMOND M. ROOP

IPC: B81B7/00

CPC classification number: B81B7/0006 ,  B81B7/0077 ,  B81B2201/02 ,  B81C1/0023 ,  H01L2224/48091 ,  H01L2224/48464 ,  H01L2924/1461 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method (70) of forming sensor packages (20) entails providing a sensor wafer (74) having sensors (30) formed on a side (26) positioned within areas (34) delineated by bonding perimeters (36), and providing a controller wafer (82) having control circuitry (42) at one side (38) and bonding perimeters (46) on an opposing side (40). The bonding perimeters (46) of the controller wafer (82) are bonded to corresponding bonding perimeters (36) of the sensor wafer (74) to form a stacked wafer structure (48) in which the control circuitry (42) faces outwardly. The controller wafer (82) is sawn to reveal bond pads (32) on the sensor wafer (74) which are wire bonded to corresponding bond pads (44) formed on the same side (38) of the wafer (82) as the control circuitry (42). The structure (48) is encapsulated in packaging material (62) and is singulated to produce the sensor packages (20).

Abstract translation: 形成传感器封装（20）的方法（70）需要提供传感器晶片（74），传感器晶片（74）具有形成在位于通过接合周边（36）所描绘的区域（34）内的侧面（26）上的传感器（30），并且提供控制器 具有在一侧（38）处的控制电路（42）和在相对侧（40）上的接合周边（46）的晶片（82）。 控制器晶片（82）的接合周边（46）被接合到传感器晶片（74）的对应的接合周边（36），以形成其中控制电路（42）面向外的堆叠的晶片结构（48）。 锯切控制器晶片（82）以露出传感器晶片（74）上的接合焊盘（32），该接合焊盘被引线连接到形成在晶片（82）的同一侧（38）上的对应接合焊盘（44） 电路（42）。 结构（48）被封装在包装材料（62）中，并被分割以产生传感器封装（20）。