公开(公告)号：US20040195002A1

公开(公告)日：2004-10-07

申请号：US10832433

申请日：2004-04-27

Applicant: FUJIKURA LTD.

Inventor： Reiji Higuchi ,  Shouji Itou ,  Osamu Nakao

IPC: H05K001/11 ,  H01R012/04

CPC classification number: H05K3/4632 ,  H05K1/0393 ,  H05K3/244 ,  H05K3/246 ,  H05K3/247 ,  H05K3/4069 ,  H05K3/4617 ,  H05K3/4652 ,  H05K2201/0129 ,  H05K2201/0347 ,  H05K2201/035 ,  H05K2201/0352 ,  H05K2201/0355 ,  H05K2201/09481 ,  H05K2201/096 ,  H05K2203/0156 ,  H05K2203/0191 ,  H05K2203/0554 ,  H05K2203/072 ,  H05K2203/1453 ,  H05K2203/1461 ,  Y10T29/49126 ,  Y10T29/49155

Abstract: A multilayer wiring board assembly, a multilayer wiring board assembly component and a method of manufacture thereof are described in which it is possible to easily laminate together flexible FPCs having highly packing densities by via-on-via and chip-on-via. The multilayer wiring board assembly is laminated by laminating together a plurality of multilayer wiring board assembly components, each of which is made by preparing a copper plated resin film 10 made of a copper plated resin film made of a resin film having adhesivity which is provided with a copper foil bonded to one surface thereof and in which a through hole is opened through said copper foil and said resin film, and a conductive paste filler embedded by screen printing in the through hole of said copper plated resin film from said copper foil with a leading end of said conductive paste filler being projected from said resin film.

Abstract translation: 一种多层布线基板组合体，多层布线基板组装部件及其制造方法，其中可以容易地将具有高封装密度的柔性FPC通过通孔通孔和芯片通孔层叠在一起。 通过层叠多个多层布线板组装部件来层叠多层布线基板组件，该多个多层布线基板组装部件通过制备由镀铜树脂膜制成的镀铜树脂膜10，该镀铜树脂膜由具有粘合性的树脂膜制成，该树脂膜具有 在其一个表面上结合有铜箔，其中通过所述铜箔和所述树脂膜打开通孔，以及通过丝网印刷嵌入所述镀铜树脂膜的所述铜箔的所述铜箔的通孔中的导电糊状填料， 所述导电浆料填充物的前端从所述树脂膜突出。

公开(公告)号：US20030019662A1

公开(公告)日：2003-01-30

申请号：US10190496

申请日：2002-07-09

Applicant: FUJIKURA LTD.

Inventor： Reiji Higuchi ,  Shouji Itou ,  Osamu Nakao

IPC: H05K001/00

CPC classification number: H05K3/4632 ,  H05K1/0393 ,  H05K3/244 ,  H05K3/246 ,  H05K3/247 ,  H05K3/4069 ,  H05K3/4617 ,  H05K3/4652 ,  H05K2201/0129 ,  H05K2201/0347 ,  H05K2201/035 ,  H05K2201/0352 ,  H05K2201/0355 ,  H05K2201/09481 ,  H05K2201/096 ,  H05K2203/0156 ,  H05K2203/0191 ,  H05K2203/0554 ,  H05K2203/072 ,  H05K2203/1453 ,  H05K2203/1461 ,  Y10T29/49126 ,  Y10T29/49155

Abstract: A multilayer wiring board assembly, a multilayer wiring board assembly component and a method of manufacture thereof are described in which it is possible to easily laminate together flexible FPCs having highly packing densities by via-on-via and chip-on-via. The multilayer wiring board assembly is laminated by laminating together a plurality of multilayer wiring board assembly components, each of which is made by preparing a copper plated resin film 10 made of a copper plated resin film made of a resin film having adhesivity which is provided with a copper foil bonded to one surface thereof and in which a through hole is opened through said copper foil and said resin film, and a conductive paste filler embedded by screen printing in the through hole of said copper plated resin film from said copper foil with a leading end of said conductive paste filler being projected from said resin film.

Abstract translation: 一种多层布线基板组合体，多层布线基板组装部件及其制造方法，其中可以容易地将具有高封装密度的柔性FPC通过通孔通孔和芯片通孔层叠在一起。 通过层叠多个多层布线板组装部件来层叠多层布线基板组件，该多个多层布线基板组装部件通过制备由镀铜树脂膜制成的镀铜树脂膜10，该镀铜树脂膜由具有粘合性的树脂膜制成，该树脂膜具有 在其一个表面上结合有铜箔，其中通过所述铜箔和所述树脂膜打开通孔，以及通过丝网印刷嵌入所述镀铜树脂膜的所述铜箔的所述铜箔的通孔中的导电糊状填料， 所述导电浆料填充物的前端从所述树脂膜突出。

公开(公告)号：US20040198053A1

公开(公告)日：2004-10-07

申请号：US10832436

申请日：2004-04-27

Applicant: FUJIKURA LTD.

Inventor： Reiji Higuchi ,  Shouji Itou ,  Osamu Nakao

IPC: H01L021/302 ,  H01L021/461

CPC classification number: H05K3/4632 ,  H05K1/0393 ,  H05K3/244 ,  H05K3/246 ,  H05K3/247 ,  H05K3/4069 ,  H05K3/4617 ,  H05K3/4652 ,  H05K2201/0129 ,  H05K2201/0347 ,  H05K2201/035 ,  H05K2201/0352 ,  H05K2201/0355 ,  H05K2201/09481 ,  H05K2201/096 ,  H05K2203/0156 ,  H05K2203/0191 ,  H05K2203/0554 ,  H05K2203/072 ,  H05K2203/1453 ,  H05K2203/1461 ,  Y10T29/49126 ,  Y10T29/49155

Abstract: A multilayer wiring board assembly, a multilayer wiring board assembly component and a method of manufacture thereof are described in which it is possible to easily laminate together flexible FPCs having highly packing densities by via-on-via and chip-on-via. The multilayer wiring board assembly is laminated by laminating together a plurality of multilayer wiring board assembly components, each of which is made by preparing a copper plated resin film 10 made of a copper plated resin film made of a resin film having adhesivity which is provided with a copper foil bonded to one surface thereof and in which a through hole is opened through said copper foil and said resin film, and a conductive paste filler embedded by screen printing in the through hole of said copper plated resin film from said copper foil with a leading end of said conductive paste filler being projected from said resin film.

公开(公告)号：US20020134584A1

公开(公告)日：2002-09-26

申请号：US10102628

申请日：2002-03-22

Applicant: FUJIKURA LTD.

Inventor： Reiji Higuchi ,  Shouji Itou ,  Osamu Nakao

IPC: H05K003/46

CPC classification number: H05K3/4635 ,  H05K1/0393 ,  H05K3/246 ,  H05K3/247 ,  H05K3/386 ,  H05K3/4069 ,  H05K3/4617 ,  H05K3/4652 ,  H05K2201/0195 ,  H05K2201/0347 ,  H05K2201/035 ,  H05K2201/0352 ,  H05K2201/0355 ,  H05K2201/09481 ,  H05K2201/096 ,  H05K2203/0156 ,  H05K2203/0191 ,  H05K2203/0554 ,  H05K2203/072 ,  H05K2203/1453 ,  H05K2203/1461 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/249996

Abstract: A multilayer wiring board assembly, a multilayer wiring board assembly component and a method of manufacture thereof are described in which it is possible to easily laminate together flexible FPCs having highly packing densities by via-on-via and chip-on-via. The multilayer wiring board assembly is laminated by laminating together a plurality of multilayer wiring board assembly components, each of which is made by preparing a copper plated resin film 10 made of a flexible resin film 1 which is provided with a copper foil 2 bonded to one surface thereof and an adhesive layer 3 bonded to the other surface, opening a through hole 7 in the copper plated resin film 10 through the resin film 1 and the adhesive layer 3, filling the through hole by screen printing from the copper foil 2 with a conductive paste to form a conductive paste filler 8 having a projection 8b as projected from the adhesive layer 3.

Abstract translation: 一种多层布线基板组合体，多层布线基板组装部件及其制造方法，其中可以容易地将具有高封装密度的柔性FPC通过通孔通孔和芯片通孔层叠在一起。 通过层叠多个多层布线基板组装体来层叠多层布线基板组件，该多个布线基板组装部件通过制备由柔性树脂膜1制成的镀铜树脂膜10制成，该柔性树脂膜1设置有一个接合在一个上的铜箔2 表面和粘合到另一表面的粘合剂层3，通过树脂膜1和粘合剂层3在镀铜树脂膜10中打开通孔7，通过丝网印刷从铜箔2填充通孔 导电膏以形成具有从粘合剂层3突出的突起8b的导电糊状填料8。