公开(公告)号：US09681591B2

公开(公告)日：2017-06-13

申请号：US14611577

申请日：2015-02-02

Applicant: FUJITSU LIMITED

Inventor： Jun Taguchi

IPC: H05K7/20 ,  H01L23/473 ,  F28F27/02

CPC classification number: H05K7/20927 ,  F28F27/02 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A heat-receiving device includes: a first heat receiver into which a refrigerant flows, and that receives heat from a heat-generating part; and a second heat receiver into which the refrigerant discharged from the first heat receiver flows, and that receives heat from the heat-generating part or another heat-generating part; wherein the first heat receiver includes: a case; a flow path that includes first and second branch paths branch off from each other and are joined again, that is provided within the case, and through which the refrigerant flows; and a thermostat that is provided in the first branch path, and that reduces a flow rate of the refrigerant flowing through the first branch path as a temperature of the refrigerant flowing through the first branch path decreases.

公开(公告)号：US09867274B2

公开(公告)日：2018-01-09

申请号：US14804748

申请日：2015-07-21

Applicant: FUJITSU LIMITED

Inventor： Jun Taguchi

IPC: H05K1/02 ,  H05K1/14

CPC classification number: H05K1/0203 ,  H05K1/0206 ,  H05K1/144 ,  H05K2201/0311 ,  H05K2201/042 ,  H05K2201/09754 ,  H05K2201/1028 ,  H05K2201/10409 ,  H05K2201/10598

Abstract: A circuit board includes a plate member capable of holding a printed circuit board, the printed circuit board including an electronic component, and a cooling member provided on the electronic component, the printed circuit board and the electronic component being positioned between the plate member and the cooling member; and a circuit provided to the plate member and allowed to be electrically connected with the printed circuit board.

公开(公告)号：US09600039B2

公开(公告)日：2017-03-21

申请号：US14456155

申请日：2014-08-11

Applicant: FUJITSU LIMITED

Inventor： Jun Taguchi

IPC: H05K7/20 ,  G06F1/20

CPC classification number: G06F1/20 ,  H05K7/2039 ,  H05K7/20772

Abstract: An electronic device is described, which includes: a first cooling member having a first overlapping portion in which a first insertion hole is formed, and provided to be abutted on a first component to be cooled provided on a substrate; a second cooling member having a second overlapping portion in which a second insertion hole is formed, and provided to be abutted on a second component to be cooled provided on the substrate, the second overlapping portion overlapping the first overlapping portion; and a coupling member inserted through the first insertion hole and the second insertion hole to couple the first overlapping portion to the second overlapping portion through an elastic member.

公开(公告)号：US09468132B2

公开(公告)日：2016-10-11

申请号：US14597759

申请日：2015-01-15

Applicant: FUJITSU LIMITED

Inventor： Jun Taguchi ,  Masaru Kase

IPC: H05K7/20 ,  H01L23/473

CPC classification number: H05K7/20281 ,  H01L23/473 ,  H01L2924/0002 ,  H05K7/20209 ,  H05K7/20254 ,  H05K7/20272 ,  H01L2924/00

Abstract: A heat-receiving device includes: a plurality of heat receivers into which a refrigerant flows; a series path that comprises a connection path connecting adjacent heat receivers among the plurality of heat receivers, that connects the plurality of heat receivers in series, and into which the refrigerant flows; a bypass path that is not connected to the plurality of heat receivers, and into which the refrigerant flows; a branch path that connects the connection path and the bypass path, and into which the refrigerant flows; and a throttle valve that is provided in the connection path on an upstream side with respect to a connection point of the connection path and the branch path, and that reduces a flow rate at which the refrigerant flows into the connection path as a temperature of the refrigerant flowing into the connection path decreases.

Abstract translation: 热接收装置包括：制冷剂流入的多个热接收器; 串联路径，其包括连接多个热接收器的多个热接收器之间的连接相邻的热接收器的连接路径，多个热接收器串联连接，制冷剂流入该连接路径; 没有连接到多个热接收器并且制冷剂流入的旁路路径; 连接所述连接路径和所述旁通路径的分支路径，所述制冷剂流入所述分支路径; 以及节流阀，其设置在相对于连接路径和分支路径的连接点的上游侧的连接路径中，并且将制冷剂流入连接路径的流量减小为 流入连接路径的制冷剂减少。

公开(公告)号：US20150049430A1

公开(公告)日：2015-02-19

申请号：US14456155

申请日：2014-08-11

Applicant: Fujitsu Limited

Inventor： Jun Taguchi

IPC: G06F1/20

CPC classification number: G06F1/20 ,  H05K7/2039 ,  H05K7/20772

Abstract: An electronic device is described, which includes: a first cooling member having a first overlapping portion in which a first insertion hole is formed, and provided to be abutted on a first component to be cooled provided on a substrate; a second cooling member having a second overlapping portion in which a second insertion hole is formed, and provided to be abutted on a second component to be cooled provided on the substrate, the second overlapping portion overlapping the first overlapping portion; and a coupling member inserted through the first insertion hole and the second insertion hole to couple the first overlapping portion to the second overlapping portion through an elastic member.

Abstract translation: 描述了一种电子设备，其包括：第一冷却构件，具有第一重叠部分，第一重叠部分形成有第一插入孔，并且设置成抵靠设置在基板上的要冷却的第一部件; 第二冷却构件，具有第二重叠部分，第二重叠部分形成有第二插入孔，并且设置成抵接在设置在基板上的待冷却的第二部件上，第二重叠部分与第一重叠部分重叠; 以及通过所述第一插入孔插入的联接构件和所述第二插入孔，以通过弹性构件将所述第一重叠部分耦合到所述第二重叠部分。