公开(公告)号：US20250022791A1

公开(公告)日：2025-01-16

申请号：US18901920

申请日：2024-09-30

Applicant: Flosfia Inc.

Inventor： Hiroshi KONDO ,  Tatsuhiro NAKAZAWA ,  Kengo TAKEUCHI ,  Takashi SHINOHE

IPC: H01L23/498

Abstract: Provided is a semiconductor device including: a first wiring layer; a holding layer; a semiconductor element that is disposed between the first wiring layer and the holding layer and includes at least a semiconductor layer and a first electrode disposed on a first surface of the semiconductor layer; an insulator in which at least a part of the semiconductor element is embedded; and a first connecting portion that electrically connects the first wiring layer and the first electrode, wherein a connection area between the first connecting portion and the first electrode occupies 45% or more of an area of an exposed part of the first electrode.

公开(公告)号：US20230315959A1

公开(公告)日：2023-10-05

申请号：US18089883

申请日：2022-12-28

Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD. ,  FLOSFIA INC.

Inventor： Masato ITO ,  Masaya MITAKE ,  Kengo TAKEUCHI ,  Toshimi HITORA ,  Fujio OKUI

IPC: G06F30/3308

CPC classification number: G06F30/3308 ,  G06F2119/08

Abstract: Provided a design support apparatus of supporting design of a component embedded substrate including one or more embedded electronic components that configure at least a part of a circuit, including, a component information acquiring unit that acquires component information about the electronic components to be incorporated in the component embedded substrate; and a required minimum area calculating unit that calculates a required minimum area of a surface of the component embedded substrate on the basis of at least information about a size of each electronic component contained in the component information.