公开(公告)号：US20220363001A1

公开(公告)日：2022-11-17

申请号：US17828293

申请日：2022-05-31

Applicant: Formlabs, Inc.

Inventor： Adam Damiano ,  Andre Comella

IPC: B29C64/35 ,  B29C64/393 ,  B29C64/129 ,  B33Y50/02 ,  B29C64/227 ,  B33Y40/00 ,  B33Y10/00 ,  B29C64/124 ,  B01D39/16 ,  B01J8/00

Abstract: According to some aspects, a method is provided of removing debris from a liquid photopolymer in an additive fabrication device. According to some embodiments, a mesh of solid material may be formed in an additive fabrication device from a liquid photopolymer, and particles of debris present in the liquid photopolymer may adhere to the mesh. The debris may thereby be removed from the liquid photopolymer by removing the mesh from the additive fabrication device. The mesh may then be discarded.

公开(公告)号：US11897199B2

公开(公告)日：2024-02-13

申请号：US17828293

申请日：2022-05-31

Applicant: Formlabs, Inc.

Inventor： Adam Damiano ,  Andre Comella

IPC: B01D37/00 ,  B29C64/135 ,  B33Y40/20 ,  B29C64/35 ,  B29C64/393 ,  B29C64/129 ,  B33Y50/02 ,  B29C64/227 ,  B33Y10/00 ,  B29C64/124 ,  B01D39/16 ,  B01J8/00 ,  B33Y40/10 ,  B33Y40/00 ,  B01D29/00 ,  B29L31/14 ,  B29L31/00 ,  B29C37/00

CPC classification number: B29C64/35 ,  B01D29/0093 ,  B01D39/1623 ,  B01J8/006 ,  B29C64/124 ,  B29C64/129 ,  B29C64/227 ,  B29C64/393 ,  B33Y10/00 ,  B33Y40/00 ,  B33Y40/10 ,  B33Y50/02 ,  B29C2037/96 ,  B29L2031/14 ,  B29L2031/737

Abstract: According to some aspects, a method is provided of removing debris from a liquid photopolymer in an additive fabrication device. According to some embodiments, a mesh of solid material may be formed in an additive fabrication device from a liquid photopolymer, and particles of debris present in the liquid photopolymer may adhere to the mesh. The debris may thereby be removed from the liquid photopolymer by removing the mesh from the additive fabrication device. The mesh may then be discarded.

公开(公告)号：US10668665B2

公开(公告)日：2020-06-02

申请号：US15791926

申请日：2017-10-24

Applicant: Formlabs, Inc.

Inventor： Adam Damiano ,  Andre Comella

IPC: B01D37/00 ,  B29C64/35 ,  B29C64/393 ,  B29C64/129 ,  B33Y50/02 ,  B29C64/227 ,  B33Y40/00 ,  B33Y10/00 ,  B29C64/124 ,  B01D39/16 ,  B01J8/00 ,  B29L31/14 ,  B29L31/00 ,  B29C37/00

Abstract: According to some aspects, a method is provided of removing debris from a liquid photopolymer in an additive fabrication device. According to some embodiments, a mesh of solid material may be formed in an additive fabrication device from a liquid photopolymer, and particles of debris present in the liquid photopolymer may adhere to the mesh. The debris may thereby be removed from the liquid photopolymer by removing the mesh from the additive fabrication device. The mesh may then be discarded.

公开(公告)号：US11383442B2

公开(公告)日：2022-07-12

申请号：US16867839

申请日：2020-05-06

Applicant: Formlabs, Inc.

Inventor： Adam Damiano ,  Andre Comella

IPC: B01D37/00 ,  B33Y80/00 ,  B29C64/35 ,  B29C64/393 ,  B29C64/129 ,  B33Y50/02 ,  B29C64/227 ,  B33Y40/00 ,  B33Y10/00 ,  B29C64/124 ,  B01D39/16 ,  B01J8/00 ,  B29L31/14 ,  B29L31/00 ,  B29C37/00

Abstract: According to some aspects, a method is provided of removing debris from a liquid photopolymer in an additive fabrication device. According to some embodiments, a mesh of solid material may be formed in an additive fabrication device from a liquid photopolymer, and particles of debris present in the liquid photopolymer may adhere to the mesh. The debris may thereby be removed from the liquid photopolymer by removing the mesh from the additive fabrication device. The mesh may then be discarded.

公开(公告)号：US20200269508A1

公开(公告)日：2020-08-27

申请号：US16867839

申请日：2020-05-06

Applicant: Formlabs, Inc.

Inventor： Adam Damiano ,  Andre Comella

IPC: B29C64/35 ,  B29C64/393 ,  B29C64/129 ,  B33Y50/02 ,  B29C64/227 ,  B33Y40/00 ,  B33Y10/00 ,  B29C64/124 ,  B01D39/16 ,  B01J8/00

Abstract: According to some aspects, a method is provided of removing debris from a liquid photopolymer in an additive fabrication device. According to some embodiments, a mesh of solid material may be formed in an additive fabrication device from a liquid photopolymer, and particles of debris present in the liquid photopolymer may adhere to the mesh. The debris may thereby be removed from the liquid photopolymer by removing the mesh from the additive fabrication device. The mesh may then be discarded.

公开(公告)号：US20190118476A1

公开(公告)日：2019-04-25

申请号：US15791926

申请日：2017-10-24

Applicant: Formlabs, Inc.

Inventor： Adam Damiano ,  Andre Comella

IPC: B29C64/35 ,  B29C64/393 ,  B29C64/227 ,  B33Y50/02 ,  B29C64/129

Abstract: According to some aspects, a method is provided of removing debris from a liquid photopolymer in an additive fabrication device. According to some embodiments, a mesh of solid material may be formed in an additive fabrication device from a liquid photopolymer, and particles of debris present in the liquid photopolymer may adhere to the mesh. The debris may thereby be removed from the liquid photopolymer by removing the mesh from the additive fabrication device. The mesh may then be discarded.