公开(公告)号：US3887997A

公开(公告)日：1975-06-10

申请号：US41427473

申请日：1973-11-09

Applicant: GEN MOTORS CORP

Inventor： HARTLEROAD RONALD J ,  KRAJEWSKI JAMES C ,  RAYON RONALD G

IPC: H01L21/60 ,  H01L21/00 ,  B01J17/00

CPC classification number: H01L21/67144 ,  H01L24/75 ,  H01L2224/75704 ,  H01L2924/01322 ,  H01L2924/14 ,  Y10T29/41 ,  Y10T29/49121 ,  Y10T29/53178 ,  Y10T29/53196 ,  H01L2924/00

Abstract: A self-aligning method and apparatus for magnetically transferring semiconductor chips to corresponding fingers of a conductive lead frame for bonding thereto. A chip having a plurality of soft ferromagnetic integral leads on one face thereof is positioned face up, below overlying soft ferromagnetic fingers of the lead frame. A magnetic field is applied generally perpendicular to the underside of the chip and the fingers to produce lead-finger engagement. While producing this engagement, the chip is concurrently automatically oriented by the magnetic field to precisely align chip leads with corresponding lead frame fingers. In a preferred embodiment, a semiconductor flip chip having soft ferromagnetic contact bumps is placed face up on a tip of a soft iron probe extending from an electromagnet. The probe raises to position the chip into close proximity with the overlying lead frame fingers. A magnetic force from the electromagnet is then transmitted through the probe to raise the chip up off the probe and simultaneously rotate it horizontally into precise aligned engagement with the fingers so that it can be bonded thereto.

公开(公告)号：US3918146A

公开(公告)日：1975-11-11

申请号：US50223374

申请日：1974-08-30

Applicant: GEN MOTORS CORP

Inventor： HARTLEROAD RONALD J ,  GRABOWSKI JAMES P

IPC: H01L21/00 ,  H01L21/60 ,  B01J17/00

CPC classification number: H01L24/83 ,  H01L21/67144 ,  H01L24/75 ,  H01L2224/13144 ,  H01L2224/2919 ,  H01L2224/75 ,  H01L2224/79 ,  H01L2224/8319 ,  H01L2224/83801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  Y10T29/53196 ,  H01L2924/00

Abstract: An improved apparatus for simultaneously automatically magnetically transferring a plurality of integrally leaded semiconductor chips to overlying conductive lead frame structures for bonding. The apparatus includes a soft ferromagnetic vertically extending member cooperating with an electromagnet. The vertically extending member supports a soft ferromagnetic web that in turn supports a plurality of soft ferromagnetic cylinder members. A nonferromagnetic portion in a central part of the web concentrates magnetic flux in the cylinder members. Each cylinder member has a vertical cylindrical chamber therein with openings at each end. A soft ferromagnetic probe having an enlarged lower end is slidably mounted in each cylinder member, with its upper end projecting out of the chamber upper opening. A vacuum applied to the upper portion of each chamber allows atmospheric pressure to upwardly bias the probes. A taper on the upper end of the probes facilitates inserting them into a temporary chip carrying template and further concentrates magnetic flux. A strong magnetic force is thus uniformly applied to a plurality of integrally leaded semiconductor chips for improved precision bonding to a lead frame.

Abstract translation: 一种改进的装置，用于同时自动地将多个整体引线的半导体芯片磁转移到覆盖的用于接合的导电引线框架结构。 该装置包括与电磁体配合的软铁磁垂直延伸部件。 垂直延伸构件支撑软铁磁纤维网，其又支撑多个软铁磁性圆柱体构件。 纤维网中心部分的非铁磁部分集中在气缸构件中的磁通量。 每个气缸构件具有垂直圆柱形室，其中每个端部具有开口。 具有放大的下端的软铁磁探头可滑动地安装在每个气缸构件中，其上端突出出室上部开口。 施加到每个室的上部的真空允许大气压力向上偏置探针。 探针上端的锥形有助于将它们插入到临时的载片模板中，并进一步集中磁通量。 因此，强大的磁力均匀地施加到多个整体引线的半导体芯片，用于改善与引线框架的精密接合。

公开(公告)号：US3887996A

公开(公告)日：1975-06-10

申请号：US46602474

申请日：1974-05-01

Applicant: GEN MOTORS CORP

Inventor： HARTLEROAD RONALD J ,  GRABOWSKI JAMES P

IPC: H01L21/00 ,  H01L21/60 ,  B01J17/00

CPC classification number: H01L24/86 ,  H01L21/67144 ,  H01L24/26 ,  H01L24/83 ,  H01L2221/68354 ,  H01L2224/13144 ,  H01L2224/8319 ,  H01L2224/83801 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  Y10T29/41 ,  Y10T29/49121 ,  Y10T29/53178 ,  Y10T29/53196

Abstract: A method and apparatus for automatically transferring and bonding integrally leaded semiconductor devices to conductive lead frame structures. An integrally leaded semiconductor chip affixed to a flexible carrier is positioned over an aperture in a slide member. The slide member is slidably mounted in a groove in one surface of a positioning device. A push rod presses the chip into the aperture in the slide member. The slide member is then moved in the groove to strip the chip from the carrier and automatically transfer it to an opening at the opposite end of the groove. A bonding probe extends through the opening to lift the chip up into alignment with an overlying lead frame structure for bonding.

Abstract translation: 一种用于将一体化的引线半导体器件自动转移和结合到导电引线框架结构的方法和装置。 固定在柔性载体上的整体引线的半导体芯片位于滑动构件的孔上。 滑动构件可滑动地安装在定位装置的一个表面中的凹槽中。 推杆将芯片压入滑动构件的孔中。 然后滑动构件在槽中移动以从载体剥离芯片并将其自动转移到凹槽的相对端处的开口。 接合探针延伸穿过开口以将芯片提升到与覆盖的引线框架结构对准以进行接合。

公开(公告)号：US3911569A

公开(公告)日：1975-10-14

申请号：US52502274

申请日：1974-11-18

Applicant: GEN MOTORS CORP

Inventor： HARTLEROAD RONALD J ,  GRABOWSKI JAMES P

IPC: H05K1/18 ,  H05K3/34 ,  H05K13/04

CPC classification number: H05K3/3421 ,  H05K1/182 ,  H05K13/0421 ,  H05K13/0465 ,  H05K2201/09418 ,  H05K2201/10924 ,  H05K2203/0195 ,  Y02P70/613 ,  Y10T29/49121 ,  Y10T29/49133

Abstract: A method and apparatus for transferring miniature semiconductor device pill-type components from a temporary carrier lead frame and directly bonding them to a printed circuit board. Each pilltype component has a semiconductor device chip encapsulated in a plastic body and a radial array of leads extending from the body. The circuit board has an opening in it to receive the pill body, and a plurality of conductors converging on the opening in a pattern corresponding to the pill leads. A pill on the lead frame is registered closely over a circuit board opening and its converging conductors. A combination transfer and soldering tool is registered over the pill. The bottom end of the tool is metal and has a periphery corresponding to and slightly smaller than the periphery of the pill leads. A heat insulating insert in the tool bottom end corresponds to the pill body. The tool is lowered, with the insert engaging the pill body, to separate the pill from the lead frame and press the pill body into the circuit board opening. The tool is heated to concurrently solder the pill leads to the circuit board conductors.

Abstract translation: 一种用于从临时载体引线框架传送微型半导体器件药片型部件并将其直接接合到印刷电路板的方法和装置。 每个药丸型组件具有封装在塑料体中的半导体器件芯片和从身体延伸的引线的径向阵列。 电路板在其中具有开口以接收药丸体，并且多个导体以对应于药丸引线的图案会聚在开口上。 引线框架上的药丸紧密地注册在电路板开口及其会聚导体上。 在药丸上注册了组合转移和焊接工具。 刀具的底端是金属的，并且具有对应于并且略小于药丸引线周边的周边。 工具底端的隔热插入物对应于药丸体。 工具降低，插入物与药丸体接合，以将药丸与引线框架分开，并将药丸体压入电路板开口。 该工具被加热以将药丸引线同时焊接到电路板导体。

公开(公告)号：US3887998A

公开(公告)日：1975-06-10

申请号：US45800474

申请日：1974-04-04

Applicant: GEN MOTORS CORP

Inventor： HARTLEROAD RONALD J ,  GRABOWSKI JAMES P

IPC: H01L21/00 ,  H01L21/60 ,  B01J17/00

CPC classification number: H01L24/83 ,  H01L21/67144 ,  H01L24/75 ,  H01L2224/75 ,  H01L2224/79 ,  H01L2224/83143 ,  H01L2224/8319 ,  H01L2224/83801 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  Y10T29/53004 ,  Y10T29/53178 ,  Y10T29/53196

Abstract: A method and apparatus for transferring integrally leaded semiconductor device chips from a temporary carrier to an overlying conductive lead frame in which the chips can be consistently reliably bonded thereto on a mass production basis without overstressing the lead frame fingers. A chip is elevated on a probe close to the underside of the lead frame fingers. A magnetic force raises the chip off the probe to the lead frame fingers and aligns the chip therewith. The chip is bonded with a hot gas blast. Means are provided to back up the chip with a predetermined uniform probe load during bonding, regardless as to nonuniformities in chip thickness and lead frame nonplanarity.

Abstract translation: 一种用于将一体化的引线半导体器件芯片从临时载体转移到上覆导电引线框架的方法和装置，其中芯片可以在大规模生产的基础上一致地可靠地结合到其上，而不会对引线框架指状物过度应力。 芯片在靠近引线框架手指的下侧的探头上升高。 磁力将芯片从探针提升到引线框架指状物并使其与芯片对准。 芯片与热气爆炸结合。 提供了用于在接合期间以预定的均匀探针负载来备份芯片的装置，而不管芯片厚度和引线框非平面性的不均匀性。

公开(公告)号：US3912153A

公开(公告)日：1975-10-14

申请号：US52489974

申请日：1974-11-18

Applicant: GEN MOTORS CORP

Inventor： HARTLEROAD RONALD J ,  GRABOWSKI JAMES P

IPC: B23K1/012 ,  H01L21/00 ,  H05K3/34 ,  B23K35/12 ,  B23K3/06

CPC classification number: H01L21/67144 ,  B23K1/012 ,  H05K3/3421 ,  H05K3/3494 ,  H05K2201/09072 ,  H05K2201/09418 ,  H05K2201/09709 ,  H05K2203/0195 ,  H05K2203/0475 ,  H05K2203/081 ,  Y02P70/613

Abstract: A method and apparatus for bonding miniature semiconductor pilltype components directly to a circuit board. Each pill-type component has a semiconductor device chip encapsulated in a plastic body and an array of leads radially extending from the body. The body is placed on a probe extending through an opening in a printed circuit board bonding site. A tubular soldering member is positioned over the component. A hot gas is blown through the soldering member and directed toward the bonding site to pre-melt solder on circuit board conductors corresponding to the component leads. The component leads and circuit board conductors are aligned while looking through the tubular soldering member. An end surface on the soldering member presses the component leads against their corresponding circuit board conductors. A holding tool inserted through the soldering member abuts the component body to hold the component in place when the soldering member is removed.

公开(公告)号：US3911568A

公开(公告)日：1975-10-14

申请号：US52497574

申请日：1974-11-18

Applicant: GEN MOTORS CORP

Inventor： HARTLEROAD RONALD J ,  GRABOWSKI JAMES P

IPC: H01L21/00 ,  H05K3/34

CPC classification number: H01L21/67144 ,  H05K3/3421 ,  H05K2201/09418 ,  H05K2201/09709 ,  H05K2201/10924 ,  H05K2203/0195 ,  Y02P70/613 ,  Y10T29/49121 ,  Y10T29/49133

Abstract: A method and apparatus for transferring miniature semiconductor pill-type components from a temporary carrier lead frame and directly bonding them to a printed circuit board. Each pill-type component has a semiconductor device chip encapsulated in a plastic body and an array of leads for the chip radially extending from the body. The lead frame with a plurality of pilltype components temporarily attached to it is held above a printed circuit board having a plurality of printed conductors thereon which correspond to the component leads. A hollow, heated transfer and soldering tool is positioned over a component. Alignment of the component leads with the circuit board conductors is accomplished while looking through the hollow tool. The tool is then pressed against the component leads to simultaneously form them and bring them into registered engagement with the circuit board conductors for soldering. Lead frame holding tabs serving as a temporary component support are automatically pulled from the component body just before the lead-conductor engagement by coaction with slots in the tool.

Abstract translation: 一种用于从临时载体引线框架传送微型半导体药丸型部件并将其直接接合到印刷电路板的方法和装置。 每个药丸型组件具有封装在塑料体中的半导体器件芯片和用于芯片的引线阵列，用于从主体径向延伸的芯片。 具有临时附接到其上的多个药丸型部件的引线框架被保持在其上具有对应于部件引线的多个印刷导体的印刷电路板上。 一个中空的，加热的传送和焊接工具位于一个部件上。 组件引线与电路板导体的对准是通过中空工具进行查看。 然后将工具压在组件引线上，同时形成它们，并使其与电路板导体进行注册接合以进行焊接。 作为临时组件支撑的引线框架保持片在刚好在引线接合之前通过与工具中的插槽的协作从组件主体中拉出。

公开(公告)号：US3868765A

公开(公告)日：1975-03-04

申请号：US41450173

申请日：1973-11-09

Applicant: GEN MOTORS CORP

Inventor： HARTLEROAD RONALD J ,  GRABOWSKI JAMES P

IPC: B23K1/012 ,  H01L21/00 ,  B23K5/00 ,  H01L7/00

CPC classification number: B82Y15/00 ,  B23K1/012 ,  B23K2201/40 ,  H01L21/67144 ,  Y10T29/53004 ,  Y10T29/53178 ,  Y10T29/53196

Abstract: A method and apparatus for magnetically transferring integrally leaded semiconductor chips from a temporary carrier to a lead frame structure for permanent bonding thereto. A laminated template having a plurality of recesses within one surface thereof serves as the temporary carrier. A soft ferromagnetic probe of a transfer apparatus extends through an opening in the template opposite each recess to engage the back side of a chip therein. The probe raises the chip into close proximity with overlying lead frame fingers. A magnetic force transmitted through the probe raises the chips the rest of the way to and concurrently aligns them with the lead frame fingers.

Abstract translation: 一体化引线半导体芯片从临时载体磁性转移到引线框架结构以永久地结合到其上的方法和装置。 在其一个表面内具有多个凹部的层叠模板用作临时载体。 传送装置的软铁磁探针延伸穿过模板中与每个凹部相对的开口，以与芯片的背面接合。 探头将芯片提升为靠近引导框架手指的位置。 通过探头传递的磁力将芯片的剩余部分提升并将其与引线框架指状物对准。

公开(公告)号：US3868764A

公开(公告)日：1975-03-04

申请号：US41427373

申请日：1973-11-09

Applicant: GEN MOTORS CORP

Inventor： HARTLEROAD RONALD J ,  GRABOWSKI JAMES P

IPC: B23K1/012 ,  H01L21/00 ,  B23K5/00 ,  H01L7/00

CPC classification number: H01L21/67144 ,  B23K1/012 ,  B23K2201/40 ,  Y10T29/53004 ,  Y10T29/53178 ,  Y10T29/53196

Abstract: A method and apparatus for simultaneously magnetically aligning a plurality of integrally leaded semiconductor device chips with conductive lead frame structures for bonding thereto. The semiconductor device chips having a plurality of soft ferromagnetic integral leads on one face thereof are placed in recesses within one surface of a template which serves as a temporary carrier. The template has soft ferromagnetic cores which extend from each of the recesses to an opposite surface of the template. A conductive lead frame structure is positioned so that sets of soft ferromagnetic finger portions overlie each chip within the template recess. A magnetic force is transmitted through selected cores to raise the chips from the template recess and simultaneously rotate them horizontally into precise aligned engagement with their corresponding fingers so that they can be bonded thereto. In a preferred embodiment, the template includes venting means extending from the recesses to facilitate hot gas flow for bonding the chip to the lead frame finger set.

Abstract translation: 一种用于同时将多个整体引线的半导体器件芯片与用于结合到其上的导电引线框架结构磁对准的方法和装置。 在其一个面上具有多个软铁磁性整体引线的半导体器件芯片被放置在用作临时载体的模板的一个表面内的凹槽中。 模板具有从每个凹部延伸到模板的相对表面的软铁磁芯。 定位导电引线框架结构，使得一组软铁磁指状部分覆盖模板凹部内的每个芯片。 磁力通过选定的磁芯传递，以使芯片从模板凹槽上升，并同时使它们水平地旋转，使它们与其对应的手指精确地对齐，使得它们可以粘合到其上。 在优选实施例中，模板包括从凹部延伸的排气装置，以便于热气流，用于将芯片连接到引线框架指套。

公开(公告)号：US3868759A

公开(公告)日：1975-03-04

申请号：US41427273

申请日：1973-11-09

Applicant: GEN MOTORS CORP

Inventor： HARTLEROAD RONALD J ,  GRABOWSKI JAMES P

IPC: H01L21/00 ,  B23Q3/18

CPC classification number: H01L21/67144 ,  Y10T29/49895 ,  Y10T29/53196

Abstract: Apparatus and a method for generally aligning semiconductor device chips having soft ferromagnetic leads with conductive lead frame structures prior to bonding thereto. The chips are prealigned in a temporary chip carrier and transported to a bonding station without losing their prealigned position. A vibratory force applied to the carrier and a magnetic plate below the carrier are used to bring the integral chip leads into close proximity with their corresponding lead frame fingers to promote subsequent consistent precisely aligned engagement therebetween.

Abstract translation: 用于在与其结合之前将具有软铁磁性引线的半导体器件芯片与导电引线框架结构大体对准的装置和方法。 芯片在临时芯片载体中预先对准，并被输送到粘合站，而不会失去其预先对准的位置。 使用施加到载体的振动力和载体下面的磁性板使整个芯片引线与其对应的引线框架指状物紧密接近以促进随后的精确对准的接合。