公开(公告)号：US20210210461A1

公开(公告)日：2021-07-08

申请号：US17037909

申请日：2020-09-30

Applicant: GUANGDONG UNIVERSITY OF TECHNOLOGY

Inventor： Yun CHEN ,  Shuquan DING ,  Yunbo HE ,  Maoxiang HOU ,  Xin CHEN ,  Jian GAO ,  Ni ZHAO ,  Lanyu ZHANG ,  Zhengping WANG

IPC: H01L23/00

Abstract: A method for processing an ultra-high density interconnect wire under light source guidance, comprising preparing a photo-thermal response conductive paste, and putting it into an air pressure injector; driving the air pressure injector; the air pressure injector extrudes the photo-thermal response conductive paste, so that the photo-thermal response conductive paste is connected with the first chip to form an interconnection wire; stopping extruding the photo-thermal response conductive paste, and driving the air pressure injector to pull off the interconnection wire; a linear light source emits light and irradiates on the interconnection wire to bend to an upper side of a second chip bonding pad; an extrusion mechanism presses a free end of the interconnection wire on the second chip bonding pad; the first chip and the second chip are subjected to glue dripping encapsulation.