公开(公告)号：US20210210461A1

公开(公告)日：2021-07-08

申请号：US17037909

申请日：2020-09-30

Applicant: GUANGDONG UNIVERSITY OF TECHNOLOGY

Inventor： Yun CHEN ,  Shuquan DING ,  Yunbo HE ,  Maoxiang HOU ,  Xin CHEN ,  Jian GAO ,  Ni ZHAO ,  Lanyu ZHANG ,  Zhengping WANG

IPC: H01L23/00

Abstract: A method for processing an ultra-high density interconnect wire under light source guidance, comprising preparing a photo-thermal response conductive paste, and putting it into an air pressure injector; driving the air pressure injector; the air pressure injector extrudes the photo-thermal response conductive paste, so that the photo-thermal response conductive paste is connected with the first chip to form an interconnection wire; stopping extruding the photo-thermal response conductive paste, and driving the air pressure injector to pull off the interconnection wire; a linear light source emits light and irradiates on the interconnection wire to bend to an upper side of a second chip bonding pad; an extrusion mechanism presses a free end of the interconnection wire on the second chip bonding pad; the first chip and the second chip are subjected to glue dripping encapsulation.

公开(公告)号：US20210166981A1

公开(公告)日：2021-06-03

申请号：US17037849

申请日：2020-09-30

Applicant: GUANGDONG UNIVERSITY OF TECHNOLOGY

Inventor： Yun CHEN ,  Yao YAO ,  Shuquan DING ,  Junyu LONG ,  Maoxiang HOU ,  Dachuang SHI ,  Xin CHEN ,  Jian GAO ,  Qiang LIU ,  Lanyu ZHANG ,  Yunbo HE ,  Shenghui ZHANG ,  Zhengping WANG

IPC: H01L21/66 ,  B23K26/08 ,  B23K26/06 ,  B23K26/082

Abstract: The disclosure relates to a method for repairing an internal circuit break defect in a chip, including: S1, detecting the defect position of the chip and the type and performance parameters of a filling material; S2, positioning the chip on a two-dimensional motion platform; S3, setting parameters of two beams of laser; adjusting a focal length of the two beams of laser three-dimensional incident angle and a Z axis, so that a focus point of the two beams of laser irradiate any end of the circuit break of the chip; S4, the two-dimensional motion platform drives the chip to move, so that the focus point of the two beams of laser is moved to an other end of the circuit break, and an moving trajectory of the focus point of the two beams of laser feeds through the two ends of the circuit break of the chip.