公开(公告)号：US11211357B2

公开(公告)日：2021-12-28

申请号：US17037909

申请日：2020-09-30

Applicant: GUANGDONG UNIVERSITY OF TECHNOLOGY

Inventor： Yun Chen ,  Shuquan Ding ,  Yunbo He ,  Maoxiang Hou ,  Xin Chen ,  Jian Gao ,  Ni Zhao ,  Lanyu Zhang ,  Zhengping Wang

IPC: H01L23/00 ,  B23K20/00 ,  B23K26/34 ,  B23K37/047 ,  B23K101/32 ,  B23K103/00 ,  B23K103/08 ,  B23K101/38

Abstract: A method for processing an ultra-high density interconnect wire under light source guidance, comprising preparing a photo-thermal response conductive paste, and putting it into an air pressure injector; driving the air pressure injector; the air pressure injector extrudes the photo-thermal response conductive paste, so that the photo-thermal response conductive paste is connected with the first chip to form an interconnection wire; stopping extruding the photo-thermal response conductive paste, and driving the air pressure injector to pull off the interconnection wire; a linear light source emits light and irradiates on the interconnection wire to bend to an upper side of a second chip bonding pad; an extrusion mechanism presses a free end of the interconnection wire on the second chip bonding pad; the first chip and the second chip are subjected to glue dripping encapsulation.