公开(公告)号：US20210219476A1

公开(公告)日：2021-07-15

申请号：US17218367

申请日：2021-03-31

Applicant: GUANGDONG UNIVERSITY OF TECHNOLOGY

Inventor： Xin CHEN ,  Yunbo HE ,  Xiquan MAI ,  Chengqiang CUI ,  Qiang LIU ,  Jian GAO ,  Zhijun YANG ,  Xun CHEN ,  Yun CHEN ,  Kai ZHANG ,  Hui TANG ,  Yu ZHANG

IPC: H05K13/04 ,  H01L33/00 ,  H01L33/62

Abstract: A variable pitch electronic component mass transfer apparatus is disclosed. A die-bond transfer head is disposed below each of the die-bond brackets. The die-bond connecting rod is provided with die-bond movable nodes arranged equidistantly. Each of the die-bond movable node is hinged to one of the die-bond brackets. An output end of the die-bond linear motor drives the die-bond connecting rod to move telescopically. A flip-chip transfer head is disposed below each of the flip-chip brackets. The flip-chip connecting rod is provided with flip-chip movable nodes arranged equidistantly. Each of the flip-chip movable nodes is hinged to one of the flip-chip brackets. An output end of the flip-chip linear motor drives the flip-chip connecting rod to move telescopically. An output end of the connecting rod rotating motor is connected to the flip-chip rail, and is configured to turn over the flip-chip rail.