公开(公告)号：US20190352789A1

公开(公告)日：2019-11-21

申请号：US16383852

申请日：2019-04-15

Applicant: Guangdong University of Technology

Inventor： Yun CHEN ,  Xin CHEN ,  Dachuang SHI ,  Xun CHEN ,  Qiang LIU ,  Jian GAO ,  Chengqiang CUI

IPC: C25D5/02 ,  C25D7/12 ,  C25D3/38 ,  C25D17/00 ,  H01L21/288 ,  H01L21/768

Abstract: A method for synchronous electroplating filling of differential vias and an electroplating device. Laser irradiation is adopted as an external energy field to assist synchronous electroplating filling of differential vias. A mask or digital maskless technology is used to precisely heat the vias with different positions and different sizes. The filling rate of different regions varies with the temperature difference, thereby realizing the synchronous electroplating filling of differential vias in one step. In the processes of immersion pre-wetting by the electroplating liquid and electroplating filling copper, the laser is used for preheating the wafer processed with vias. In these two steps, the laser needs to locally and precisely heat upper surfaces of the micro vias on the wafer through the mask corresponding to the micro vias on the wafer.

公开(公告)号：US20210219476A1

公开(公告)日：2021-07-15

申请号：US17218367

申请日：2021-03-31

Applicant: GUANGDONG UNIVERSITY OF TECHNOLOGY

Inventor： Xin CHEN ,  Yunbo HE ,  Xiquan MAI ,  Chengqiang CUI ,  Qiang LIU ,  Jian GAO ,  Zhijun YANG ,  Xun CHEN ,  Yun CHEN ,  Kai ZHANG ,  Hui TANG ,  Yu ZHANG

IPC: H05K13/04 ,  H01L33/00 ,  H01L33/62

Abstract: A variable pitch electronic component mass transfer apparatus is disclosed. A die-bond transfer head is disposed below each of the die-bond brackets. The die-bond connecting rod is provided with die-bond movable nodes arranged equidistantly. Each of the die-bond movable node is hinged to one of the die-bond brackets. An output end of the die-bond linear motor drives the die-bond connecting rod to move telescopically. A flip-chip transfer head is disposed below each of the flip-chip brackets. The flip-chip connecting rod is provided with flip-chip movable nodes arranged equidistantly. Each of the flip-chip movable nodes is hinged to one of the flip-chip brackets. An output end of the flip-chip linear motor drives the flip-chip connecting rod to move telescopically. An output end of the connecting rod rotating motor is connected to the flip-chip rail, and is configured to turn over the flip-chip rail.

公开(公告)号：US20230298914A1

公开(公告)日：2023-09-21

申请号：US18062026

申请日：2022-12-06

Applicant: GUANGDONG UNIVERSITY OF TECHNOLOGY

Inventor： Hui TANG ,  Zhishen LIAO ,  Xin CHEN ,  Zhihang LIN ,  Jian GAO ,  Qiang LIU ,  Xun CHEN

IPC: H01L21/67

CPC classification number: H01L21/67144 ,  H01L21/67259

Abstract: A compliant mechanical system for Mini/Micro chip mass transfer and packaging comprises a flexure-based continuous ejector pin mechanism including a drive support plate, a mounting base, first thorn die attach drive devices, second thorn die attach drive devices, first flexible hinges, second flexible hinges, and a pricking pin. The first thorn die attach drive devices and the second thorn die attach drive devices are mounted on the drive support plate. A drive end of the first thorn die attach drive device horizontally passes rightward through the first flexible hinge at a corresponding position; a drive end of the second thorn die attach drive device horizontally passes leftward through the first flexible hinge at a corresponding position; and the mounting base is hinged to the drive ends of the two thorn die attach drive devices through the second flexible hinges.

公开(公告)号：US20230268205A1

公开(公告)日：2023-08-24

申请号：US18062025

申请日：2022-12-06

Applicant: GUANGDONG UNIVERSITY OF TECHNOLOGY

Inventor： Xin CHEN ,  Zhihang LIN ,  Hui TANG ,  Hongcheng LI ,  Jian GAO ,  Qiang LIU ,  Xun CHEN

IPC: H01L21/67 ,  H01L33/00

CPC classification number: H01L21/67144 ,  H01L33/0093

Abstract: A flexure-based continuous ejector pin mechanism for Mini/Micro chip mass transfer includes a first drive frame, a second drive frame, a mounting base, a first thorn die attach drive device, a second thorn die attach drive device, first flexible hinges, second flexible hinges, and a pricking pin. The second drive frame and the first drive frame are connected through the first flexible hinge. The mounting base is connected to a left side and a right side of the second drive frame through the second flexible hinges. Compared with a laser transfer technology, the flexible movable thorn die attach device has lower cost and higher accuracy; compared with a vacuum nozzle transfer technology, the flexible movable thorn die attach device has higher transfer efficiency and quality; and compared with a conventional thorn die attach device, the flexible movable thorn die attach device has higher transfer efficiency and precision.

公开(公告)号：US20190355587A1

公开(公告)日：2019-11-21

申请号：US16383885

申请日：2019-04-15

Applicant: Guangdong University of Technology

Inventor： Xin CHEN ,  Yun CHEN ,  Dachuang SHI ,  Xun CHEN ,  Qiang LIU ,  Jian GAO ,  Chengqiang CUI

IPC: H01L21/308 ,  H01L21/306

Abstract: A method for synchronous wet etching processing of differential microstructures, including the following steps: step a: performing photoetching on a processing surface of a workpiece to be processed to develop the workpiece; step b: affixing a mask to a surface opposite to the processing surface of the workpiece; step c: continuously cooling the mask; step d: placing the cooled mask and the workpiece in a wet etching device; and adding an etchant to the processing surface of the workpiece to start etching; step e: removing the mask and the workpiece from the wet etching device after the set etching time; separating the mask and the workpiece to obtain a workpiece with a etching structure. A temperature difference is formed between the pattern area to be processed and the retaining area.

公开(公告)号：US20250134683A1

公开(公告)日：2025-05-01

申请号：US18621119

申请日：2024-03-29

Applicant: GUANGDONG UNIVERSITY OF TECHNOLOGY

Inventor： Xun CHEN ,  Rongguang ZHANG ,  Xuanzhi ZHANG ,  Xin CHEN ,  Han WANG ,  Jingsong YAO

IPC: A61F2/92 ,  A61K9/00

Abstract: The present disclosure belongs to the technical field of drug delivery and biomimetic structures inducing cell proliferation and differentiation, and in particular relates to a micro-nano medical stent for directional, quantitative and timed controlled release of drug and a preparation method thereof. The micro-nano medical stent provided by the present disclosure is composed of an ordered fiber structure electrospun as a skeleton layer and a disordered fiber structure electrospun as an ECM layer that can both load drugs. The micro-nano medical stent can achieve directional, quantitative and timed release of drugs.