公开(公告)号：US20140233086A1

公开(公告)日：2014-08-21

申请号：US14173211

申请日：2014-02-05

Applicant: Harman Becker Automotive Systems GmbH

Inventor： Wieland OBERST ,  Guenther KRAFT ,  Valod NOSHADI ,  Michael HUONKER ,  Kelei SHEN

IPC: G02B26/08

CPC classification number: G02B26/0833 ,  B81B7/007 ,  B81B2201/042 ,  B81B2207/096 ,  H01L23/38 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/1461 ,  H01L2924/16195 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An electronic component is provided that includes a spatial light modulator device, and a circuit board comprising a first major surface, at least one electrically conductive redistribution layer and a first cavity positioned in the first major surface. The spatial light modulator device is positioned within the cavity and is electrically connected to the redistribution layer.

Abstract translation: 提供了一种电子部件，其包括空间光调制器装置，以及包括第一主表面，至少一个导电再分配层和位于第一主表面中的第一腔的电路板。 空间光调制器装置位于空腔内并电连接到再分配层。

公开(公告)号：US20160174382A1

公开(公告)日：2016-06-16

申请号：US14909180

申请日：2014-07-03

Applicant: HARMAN BECKER AUTOMOTIVE SYSTEMS GMBH

Inventor： Guenther KRAFT ,  Krunoslac ORCIC ,  Didier BERTHOMIER ,  Thomas SCHIEMANN ,  Valod NOSHADI

IPC: H05K1/18 ,  H01L25/16 ,  H01L23/538 ,  H05K1/11 ,  H05K1/02 ,  H01L23/38

CPC classification number: H05K1/185 ,  H01L23/38 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5389 ,  H01L24/19 ,  H01L25/16 ,  H01L2224/04105 ,  H01L2224/16225 ,  H01L2224/73267 ,  H01L2924/15153 ,  H05K1/0203 ,  H05K1/0298 ,  H05K1/115 ,  H05K1/181 ,  H05K1/183 ,  H05K2201/10159 ,  H05K2201/10219 ,  H05K2201/10734 ,  Y02P70/611

Abstract: An electronic module is provided that includes a multilayer circuit board, and an electronic component, and a Peltier heat pump. The electronic component is mounted on a major surface of the multilayer circuit board and is electrically coupled to at least one memory die. The at least one memory die is at least partially embedded within the multilayer circuit board. The Peltier heat pump device has at least one pair of thermoelectric semiconductor members arranged thermally in parallel and electrically in series, and the at least one pair of semiconductor members are at least partially embedded in the circuit board.

Abstract translation: 提供一种电子模块，其包括多层电路板和电子部件以及珀耳帖热泵。 电子部件安装在多层电路板的主表面上并电连接至至少一个存储管芯。 所述至少一个存储器管芯至少部分地嵌入所述多层电路板内。 珀耳帖热泵装置具有至少一对并联热电并且电串联的至少一对热电半导体部件，并且至少一对半导体部件至少部分地嵌入电路板中。

公开(公告)号：US20140298825A1

公开(公告)日：2014-10-09

申请号：US14247870

申请日：2014-04-08

Applicant: Harman Becker Automotive Systems GmbH

Inventor： Valod NOSHADI

IPC: H05K7/20

CPC classification number: H05K7/205 ,  H01L35/32 ,  H05K1/0201 ,  H05K1/0206 ,  H05K1/0209 ,  H05K1/16 ,  H05K2201/09672 ,  H05K2201/10219

Abstract: A circuit board is provided that includes at least one Peltier heat pump device with at least one pair of semiconductor members arranged thermally in parallel and electrically in series. The at least one pair of semiconductor members is at least partially embedded in the circuit board.

Abstract translation: 提供了一种电路板，其包括至少一个珀尔帖热泵装置，其具有并联热电并串联电连接的至少一对半导体部件。 至少一对半导体构件至少部分地嵌入电路板中。

公开(公告)号：US20250016960A1

公开(公告)日：2025-01-09

申请号：US18754826

申请日：2024-06-26

Applicant: Harman Becker Automotive Systems GmbH

Inventor： Valod NOSHADI

IPC: H05K7/20

Abstract: A liquid-cooled system comprises a primary cooling circuit designed to circulate a cooling liquid for the purpose of dissipating heat from a heat source. A cold plate assembly is thermally coupled to the heat source, facilitating the exchange of heat with the cooling liquid. In emergency situations, in which a failure of the regular cooling circuit may occur, the system activates an emergency cooling unit comprising a Phase Change Material (PCM) housed within a dedicated containment structure. A pair of distributor valves are mechanically linked to both the primary cooling circuit and the emergency cooling unit. The pair of distributor valves are configured to selectively disconnect the cold plate assembly from the primary cooling circuit and to connect the cold plate assembly to the emergency cooling unit when prompted by a control signal, thus providing emergency cooling functionality for a predetermined period of time.

公开(公告)号：US20180114742A1

公开(公告)日：2018-04-26

申请号：US15787094

申请日：2017-10-18

Applicant: Harman Becker Automotive Systems GmbH

Inventor： Valod NOSHADI ,  Herbert KRONENWETT

IPC: H01L23/40 ,  H01L23/367

CPC classification number: H01L23/4006 ,  H01L23/3672 ,  H01L23/3736 ,  H01L2224/16227 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/16251

Abstract: A system for mounting a heat sink to a printed circuit board includes a frame that is configured to be mounted to a printed circuit board and to receive a heat sink. The heat sink and the frame are formed as separate components. The frame is formed as a rigid component. The system further includes fastening elements that are configured to fix the heat sink to the frame in a mounting position after the heat sink has been inserted into the frame