公开(公告)号：US20190256984A1

公开(公告)日：2019-08-22

申请号：US16325482

申请日：2016-10-26

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： YA-TING YEH ,  KUAN-TING WU ,  SHIH-HSUN HUANG

IPC: C23C28/00 ,  B32B15/04 ,  C23C28/04 ,  C25D11/24 ,  C25D11/30

Abstract: Examples relating to coating an alloy substrate are described. For example, techniques for coating a surface of the alloy substrate with a coating layer and an exterior coat include anodizing an alloy substrate to form a metal oxide layer on surface of the alloy substrate and obtain an anodized alloy substrate. The alloy substrate is a metal alloy and the anodized alloy substrate has irregularities on surface. Thereafter, a coating layer is applied on the surface of the alloy substrate to smoothen the surface by providing a uniform covering on the irregularities of the surface. After applying the coating layer, an exterior coat is deposited on the surface of the alloy substrate.

公开(公告)号：US20220066515A1

公开(公告)日：2022-03-03

申请号：US17418464

申请日：2019-02-01

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： KUAN-TING WU ,  YA-TING YEH ,  CHIH-HSIUNG LIAO

IPC: G06F1/16

Abstract: The present disclosure is drawn to covers for electronic devices. In one example, a cover for an electronic device can include an aluminum or aluminum alloy cover frame having an opening. A magnesium or magnesium alloy cover panel supported by the aluminum or aluminum alloy cover frame within or over the opening. A protective coating can be over a surface of the aluminum or aluminum alloy cover frame and a surface of the magnesium or magnesium alloy cover panel. A chamfered edge can include a chamfer at an edge of the aluminum or aluminum alloy cover frame. The chamfer can expose the aluminum or aluminum alloy cover frame beneath the protective coating, and the chamfer at the same time does not expose the magnesium or magnesium alloy cover panel.

公开(公告)号：US20210043270A1

公开(公告)日：2021-02-11

申请号：US16965127

申请日：2018-04-11

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： KUAN-TING WU ,  YA-TING YEH ,  CHAO-WEN CHENG ,  HSIN-YI LEE

IPC: G12B9/04 ,  C03C27/04

Abstract: In one example, a device housing is described, which may include a base substrate and ion-exchanged glass beads disposed on an outer surface of the base substrate.

公开(公告)号：US20190255877A1

公开(公告)日：2019-08-22

申请号：US16325478

申请日：2016-10-26

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY L.P.

Inventor： YA-TING YEH ,  WEN-TA LAI ,  KUAN-TING WU

IPC: B44C1/22 ,  C23C8/10 ,  B05D1/02 ,  B23K26/362

Abstract: The present subject matter relates to patterned substrates. In an example implementation of the present subject matter, techniques for creating patterns on different substrates are described. In an example, a method of creating the patterns includes spray depositing a plurality of coating layers over the substrate to form a coated substrate, where the plurality of coating layers include at least a top layer, and at least one of a base coating layer, a primer coating layer, and a powder coating layer. The method further includes forming a predefined pattern on the coated substrate by one of laser etching and Computer Numeric Control (CNC) process.

公开(公告)号：US20200283648A1

公开(公告)日：2020-09-10

申请号：US16754122

申请日：2017-11-13

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： KUAN-TING WU ,  YA-TING YEH ,  CHI HAO CHANG

IPC: C09D7/62 ,  C09D5/10 ,  C09D7/40 ,  H01Q1/42

Abstract: In one example, an electronic device housing is described, which may include a substrate having a surface and at least one waterborne metallic paint coating formed on the surface of the substrate. The at least one waterborne metallic paint coating may include an insulating material encapsulated metal powder in combination with at least one of a surface modified synthetic mica and a surface modified glass platelet.

公开(公告)号：US20190025895A1

公开(公告)日：2019-01-24

申请号：US16067766

申请日：2016-04-06

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： KUAN-TING WU ,  AI-TSUNG LI ,  YA-TING YEH ,  KEVIN VOSS ,  MICHAEL DELPIER

IPC: G06F1/20 ,  B32B33/00

Abstract: Examples of a cover for a device are described herein. The cover includes a substrate to be placed in proximity of a heat source of a device. In an example, a heat resistant layer is applied over a surface of the substrate to insulate heat generated by the heat source. Further, a top layer is applied over one of the heat resistant layer and another surface of the substrate, which is opposite to the surface having the heat resistant layer. The top layer provides at least one of chemical resistant properties and aesthetic properties.

公开(公告)号：US20180213659A1

公开(公告)日：2018-07-26

申请号：US15746129

申请日：2015-08-17

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： KUAN-TING WU ,  KEVIN VOSS ,  YA-TING YEH

IPC: H05K5/02

CPC classification number: H05K5/02 ,  B05D3/06 ,  B05D3/10 ,  B05D3/12 ,  C03C17/42 ,  C03C2217/76 ,  C03C2218/31 ,  C03C2218/32

Abstract: Various examples provide a method of making a hydrophobic surface for an object. According to the method, a hydrophobic coating may be applied to an original surface of the object. A microstructure may be formed on the original surface of the object. The hydrophobic surface of the object may be obtained with the microstructure submerged by the hydrophobic coating. The microstructure may be a rough structure including micro-sired portions, and may have greater hardness than the hydrophobic coating.