公开(公告)号：US20190237296A1

公开(公告)日：2019-08-01

申请号：US16260988

申请日：2019-01-29

Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATION

Inventor： Yuko OTANI ,  Yohei MINEKAWA ,  Takashi NOBUHARA ,  Nobuhiko KANZAKI ,  Takehiro HIRAI ,  Miyuki FUKUDA ,  Yuya ISOMAE ,  Kaori YAESHIMA ,  Yuji TAKAGI

IPC: H01J37/22 ,  G06T7/73 ,  G06T7/13 ,  G06T7/60 ,  G02B21/00 ,  G02B21/36 ,  G06T7/00 ,  H01J37/28

Abstract: A defect observation device detects a defect with high accuracy regardless of a defect size. One imaging configuration for observing an observation target on a sample is selected from an optical microscope, an optical microscope, and an electron microscope, and an imaging condition of the selected imaging configuration is controlled.

公开(公告)号：US20130134308A1

公开(公告)日：2013-05-30

申请号：US13687922

申请日：2012-11-28

Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATION

Inventor： Fumiaki ENDO ,  Kaori YAESHIMA

IPC: G01N21/95 ,  H01J37/28

CPC classification number: G01N21/9501 ,  H01J37/265 ,  H01J37/28 ,  H01J2237/2067 ,  H01J2237/2817

Abstract: If an indentation mark is put in the vicinity of a defect under constant conditions regardless of the film type of samples, surroundings of the mark become cracked or the mark may be too small to view, thus causing the problem of difficulty in viewing the mark or the defect. Another problem is that in a patterned wafer, an indentation mark is coincidentally put on a film not suited for marking. To solve such problems, an elemental analysis is conducted of a position to be marked and, on the basis of the analysis results, such indentation marking conditions as the pressing load, descending rate, and marking depth of an indenter are varied to perform marking suited for a film type. If the film type of the location to be marked cannot be concluded to be a registered film type, marking under wrong conditions is prevented by switching to manual setting. It is also possible to avoid putting marks on a material if the material is not suited for marking.

Abstract translation: 如果在恒定条件下将缺陷标记放置在缺陷附近，而不管样品的膜类型如何，则标记的周围变得破裂或标记可能太小而不能观察，因此导致难以观察标记或 缺陷。 另一个问题是，在图案化晶片中，凹陷标记巧合地放在不适于标记的膜上。 为了解决这些问题，对要标记的位置进行元素分析，并且基于分析结果，改变压头负载，压下率和压头的标记深度等压痕标记条件，以进行适合的标记 为电影类型。 如果要标记的位置的胶片类型不能被认定为注册胶片类型，则通过切换到手动设置来防止在错误状态下的标记。 如果材料不适于标记，也可以避免在材料上放置标记。