公开(公告)号：US20180218890A1

公开(公告)日：2018-08-02

申请号：US15746647

申请日：2016-07-18

Applicant: HONEYWELL INTERNATIONAL INC.

Inventor： John A. DUNLOP ,  Kevin T. HUBERT ,  Jacob C. RUZICKA ,  Andrew N.A. WRAGG ,  Michael D. BLONDELL ,  William P. JARDEE ,  Phillip F. JOHN ,  Edward P. LARA ,  Wayne D. MEYER ,  Adam P. DAUB ,  Scott A. BUCKHART ,  Travis C. JUNTTILA

IPC: H01J37/34 ,  H01F7/06 ,  H01F27/28 ,  C23C14/35

CPC classification number: H01J37/3458 ,  C23C14/34 ,  C23C14/35 ,  H01F7/06 ,  H01F27/28 ,  H01F27/2847 ,  H01J37/00 ,  H01J37/3211 ,  H01J37/32871 ,  H01J37/3438 ,  H01J37/3488

Abstract: A high surface area coil for use with a physical vapor deposition apparatus comprising a first surface. At least a portion of the first surface has a macrotexture with a surface roughness between about 15 μm and about 150 μm. At least a portion of the first surface has a microtexture with a surface roughness between about 2 μm and 15 μm.