CONFORMAL MANUFACTURING DEVICE AND METHOD FOR COMPLEX CURVED-SURFACE ELECTRONIC SYSTEM

    公开(公告)号:US20210076503A1

    公开(公告)日:2021-03-11

    申请号:US16340380

    申请日:2018-04-09

    Abstract: The invention belongs to a related field of electronic manufacturing technology, and particularly relates to a conformal manufacturing device and a method for a complex curved-surface electronic system, the system includes a support platform and a six-degree-of-freedom spherical motor linkage platform, a 3D measurement module, a laser lift-off module, a curved-surface transfer printing module and a conformal jet printing module respectively mounted on the support platform and independently controllable, and specific structures and work modes of these key components are improved. The invention further discloses a corresponding manufacturing method. Through the invention, multiple process flows required in conformal manufacturing process of the complex curved-surface electronic system are effectively integrated into an integrated device, so as to realize conformal hybrid manufacturing of the rigid/flexible curved-surface electronic system with arbitrary area, and the invention has advantages of high precision, high efficiency and high automation, which greatly broadens the application scope of the curved-surface electronic manufacturing technology.

    QUALITY INSPECTION SYSTEM FOR ENTIRE INKJET PRINTING MANUFACTURING PROCESS FOR DISPLAY DEVICE

    公开(公告)号:US20230415185A1

    公开(公告)日:2023-12-28

    申请号:US18455640

    申请日:2023-08-25

    Abstract: The disclosure discloses a quality inspection system for the entire process of inkjet printing manufacturing of display devices, which includes a substrate inspection module, a nozzle inspection module, an ink droplet inspection module, a coating thickness inspection module, and a control module. Through the design and matching of these modules, it is possible to realize a series of operations such as substrate inspection, nozzle inspection, flying ink droplet inspection, liquid coating inspection, and cured coating inspection. The system also discloses a corresponding quality inspection method for the entire inkjet printing manufacturing process for display devices. The system effectively compensates for the shortcomings of current technology which only inspect a single stage without taking the whole process into consideration, thereby realizing high-precision quality inspection of each stage in the inkjet printing manufacturing process of display devices, and significantly improving the quality and yield of the display device product.

    MULTIFUNCTIONAL ELECTROHYDRODYNAMIC INKJET PRINTING DEVICE AND PRINTING METHOD USING THE SAME
    4.
    发明申请
    MULTIFUNCTIONAL ELECTROHYDRODYNAMIC INKJET PRINTING DEVICE AND PRINTING METHOD USING THE SAME 有权
    多功能电动态喷墨打印装置及其印刷方法

    公开(公告)号:US20160001550A1

    公开(公告)日:2016-01-07

    申请号:US14849631

    申请日:2015-09-10

    Abstract: An electrohydrodynamic inkjet printing device, including: a support part; a jet printing module; a substrate bearing and moving module; and a roll-to-roll thin film conveying module. The jet printing module is disposed on the support part and includes a nozzle for ejecting printing fluid onto a substrate for pattern printing. The substrate bearing and moving module is disposed on the support part, and fixedly bears a rigid substrate as the substrate for pattern printing, and drives the rigid substrate to move with respect to the jet printing module. The roll-to-roll thin film conveying module is disposed on the support part, and transfers a flexible thin film as the substrate for pattern printing, and drives the flexible film to move with respect to the jet printing module.

    Abstract translation: 一种电动液压喷墨印刷装置,包括:支撑部; 喷墨打印模块; 基板轴承和移动模块; 以及卷对卷薄膜输送模块。 喷墨打印模块设置在支撑部分上,并且包括用于将印刷流体喷射到用于图案印刷的基板上的喷嘴。 基板支承和移动模块设置在支撑部分上,并且固定地具有用于图案印刷的基板的刚性基板,并且驱动刚性基板相对于喷墨打印模块移动。 卷对卷薄膜输送模块设置在支撑部分上,并且传送柔性薄膜作为用于图案印刷的基底,并且驱动柔性膜相对于喷墨印刷模块移动。

    SYSTEM AND METHOD FOR QUALITY INSPECTION ON OVERALL INKJET PRINTING MANUFACTURING PROCESS FOR DISPLAY DEVICE

    公开(公告)号:US20220203700A1

    公开(公告)日:2022-06-30

    申请号:US17209138

    申请日:2021-03-22

    Abstract: The disclosure discloses a system for quality inspection in the entire process of inkjet printing manufacturing of display devices, which includes a substrate inspection module, a nozzle inspection module, an ink droplet inspection module, a coating thickness inspection module and a control module. Through design and matching of these modules, it is possible to realize a series of operations such as substrate inspection, nozzle inspection, flying ink droplet inspection, liquid coating inspection and cured coating inspection. The invention also discloses a corresponding quality inspection method for the entire inkjet printing manufacturing process for display devices. The invention effectively compensates for the shortcomings of current technology which only inspect a single stage without taking the whole process into consideration, thereby realizing high-precision quality inspection of each stage in the inkjet printing manufacturing process of display devices, and significantly improving the quality and yield of the display device product.

    LASER STRIPPING MASS-TRANSFER DEVICE AND METHOD FOR MICRODEVICES BASED ON WINDING PROCESS

    公开(公告)号:US20210013066A1

    公开(公告)日:2021-01-14

    申请号:US17041464

    申请日:2019-07-01

    Abstract: A laser stripping mass-transfer device includes a microdevice laser stripping transfer module, an auxiliary conveyor module, a transition conveyor module, a transfer conveyor module, a substrate carrier module, a microdevice filling module, a curing module, an encapsulation module and a substrate transportation module. The microdevice laser stripping transfer module is configured to implement detection and stripping of the microdevices. The auxiliary conveyor module is configured to adhere the stripped microdevices. The transition conveyor module is configured to pick up and transfer the microdevices to the transfer conveyor module. The transfer conveyor module is configured to pick up and transfer the microdevices to the substrate carrier module. The substrate carrier module is configured to feed the microdevices into the microdevice filling module, the curing module, the encapsulation module, and the substrate transportation module for filling, curing, encapsulating, loading and unloading.

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