公开(公告)号：US20120023744A1

公开(公告)日：2012-02-02

申请号：US13192474

申请日：2011-07-28

Applicant: HUI ZENG

Inventor： HUI ZENG

IPC: H05K3/36

CPC classification number: H05K3/4635 ,  H05K3/0097 ,  H05K2201/055 ,  H05K2201/0715 ,  Y10T29/49126

Abstract: In a method for manufacturing multilayer PCBs having n circuit layers, a double-sided flexible substrate strip is provided. The strip comprises a number of PCB units, each comprising m segments, wherein m=n/2 if n represents an even integer, and m=(n+1)/2 if n represents an odd integer. Each segment includes two foil portions. In a reel to reel process, the strip is treated to form n−2 foil portions of each PCB unit into traces, further remove one foil portion if n represents an odd integer. The other two foil portions are left untreated. Then the strip is cut to separate the PCB units from each other. The PCB unit is folded in such a manner that the traces are arranged between the other two foil portions. The folded PCB unit is laminated to form a multilayer substrate and traces are formed in the two foil portions.

Abstract translation: 在具有n个电路层的多层PCB的制造方法中，提供双面柔性衬底条。 条带包括多个PCB单元，每个PCB单元包括m个段，其中如果n表示偶数整数，则m = n / 2，如果n表示奇整数，则m =（n + 1）/ 2。 每个片段包括两个箔片部分。 在卷轴到卷轴处理中，处理条带以将每个PCB单元的n-2个箔部分形成迹线，如果n表示奇整数则进一步去除一个箔部分。 另外两个箔片部分未经处理。 然后切割条带以将PCB单元彼此分开。 PCB单元以使得迹线布置在另外两个箔部分之间的方式折叠。 折叠的PCB单元被层压以形成多层基板，并且在两个箔部分中形成迹线。

公开(公告)号：US20120011713A1

公开(公告)日：2012-01-19

申请号：US13181453

申请日：2011-07-12

Applicant: HUI ZENG

Inventor： HUI ZENG

IPC: H05K3/00

CPC classification number: H05K3/4635 ,  H05K3/429 ,  H05K2201/055 ,  H05K2203/0228 ,  H05K2203/1545 ,  Y10T29/49124

Abstract: In a method for manufacturing multilayer PCBs having n circuit layers, a flexible substrate strip is provided. The strip comprises a number of PCB units, each comprising n segmental portions. The strip is treated in a reel to reel process to form traces in n−2 segmental portions of each of the PCB units, the other two segmental portions are left untreated without traces. Then the strip is cut to obtain a number of separated PCB units. The PCB unit is folded in such a manner that the n−2 segmental portions having traces are arranged between the other two segmental portions without traces. The folded PCB unit is laminated to form a multilayer substrate and traces are formed in the two segmental portions.

Abstract translation: 在制造具有n个电路层的多层PCB的方法中，提供了柔性衬底条。 该条带包括多个PCB单元，每个PCB单元包括n个段部分。 将带材以卷轴处理以在每个PCB单元的n-2个节段部分中形成迹线，而另外两个节段部分未被处理而没有痕迹。 然后切割条以获得多个分离的PCB单元。 PCB单元被折叠成使得具有迹线的n-2个节段部分布置在没有痕迹的另外两个节段部分之间。 将折叠的PCB单元层叠以形成多层基板，并且在两个节段部分中形成迹线。

公开(公告)号：US20110297437A1

公开(公告)日：2011-12-08

申请号：US13116021

申请日：2011-05-26

Applicant: HUI ZENG

Inventor： HUI ZENG

IPC: H05K5/00

CPC classification number: H01R4/2433 ,  H01R2201/04 ,  H01R2201/06

Abstract: An electronic component device for electrically and mechanically connecting to a lead wire includes a base and a cover. The base includes a receiving body, at least one electronic component, and two spaced stripping connectors. The receiving body defining an installation groove. The at least one electronic component and the stripping connectors are received in the receiving body. Each stripping connector is in electrically connected with the at least one electronic component. The stripping connector defines a stripping slot for extension of the core therethrough, which has a size smaller than or equal to the diameter of the core. The cover includes a pressing surface and an electrically insulating cutting body. The cutting body is used for cutting off the lead wire. The pressing surface is configured for pressing the lead wire into the stripping slot, thus making the core in electrical connection with the at least one electronic component.

Abstract translation: 用于电和机械地连接到引线的电子部件装置包括基座和盖。 基座包括接收体，至少一个电子部件和两个间隔开的剥离连接器。 接收体限定安装槽。 所述至少一个电子部件和剥离连接器被容纳在接收体中。 每个剥离连接器与至少一个电子部件电连接。 剥离连接器限定用于芯的延伸的剥离槽，其具有小于或等于芯的直径的尺寸。 盖子包括一个按压表面和一个电绝缘的切割体。 切割体用于切断导线。 按压表面构造成将引线压入剥离槽，从而使芯与至少一个电子部件电连接。