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公开(公告)号：US10681455B2
公开(公告)日：2020-06-09
申请号：US16192407
申请日：2018-11-15
Applicant: HYUNDAI MOTOR COMPANY , KIA MOTORS CORPORATION
Inventor： Hyunsoo Kim , Ilseon Yoo
Abstract: A microphone includes an acoustic element including an acoustic hole; a case disposed below the acoustic element and including an acoustic inlet formed in a position corresponding to the acoustic hole; and a plurality of through holes formed between the acoustic element and the case and formed in a position corresponding to the acoustic hole.
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公开(公告)号：US10412506B2
公开(公告)日：2019-09-10
申请号：US15804083
申请日：2017-11-06
Applicant: Hyundai Motor Company , Kia Motors Corporation
Inventor： Hyunsoo Kim , Ilseon Yoo
Abstract: A microphone and a manufacturing method thereof are provided. The microphone includes a substrate that has a cavity formed in a central portion thereof, and a diaphragm that is disposed on the substrate to cover the cavity and includes a first non-doped area formed at predetermined intervals. A fixed membrane is spaced apart from the diaphragm with an air layer interposed therebetween. A second non-doped area protrudes upward to prevent direct contact with the diaphragm and a supporting layer supports the fixed membrane and the diaphragm.
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公开(公告)号：US09693150B2
公开(公告)日：2017-06-27
申请号：US14847776
申请日：2015-09-08
Applicant: Hyundai Motor Company
Inventor： Sang-Hyeok Yang , Hyunsoo Kim , Sang Gyu Park , Ilseon Yoo
IPC: H04R17/02
CPC classification number: H04R17/02 , H04R2201/003 , H04R2410/03
Abstract: A microphone, that increases sensitivity without a separate circuit is provided. The microphone includes an audio detection module having a vibration film that outputs capacitance signals by vibrating audio introduced from the exterior and a piezoresistive element that outputs a piezoresistive signal by a sound pressure of the audio. A semiconductor chip includes an amplifier electrically connected to the audio detection module to receive a capacitance signal and a piezoresistive signal from the audio detection module and amplifies the capacitance signal and piezoresistive signal to an electrical signal. The amplifier includes an input terminal that receives an input of the capacitance signal; a first resistor connected to the input terminal and the piezoresistive element; an output terminal that amplifies and outputs the capacitance signal and piezoresistive signal to an electrical signal; and a second resistor connected to the input terminal and the output terminal and connected to the piezoresistive element.
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公开(公告)号：US09380391B2
公开(公告)日：2016-06-28
申请号：US14555873
申请日：2014-11-28
Applicant: Hyundai Motor Company
Inventor： Ilseon Yoo , Hyunsoo Kim
Abstract: A microphone and method of manufacturing the microphone are provided. The microphone includes a substrate that has a penetration aperture, a vibration film disposed on the substrate that covers the penetration aperture, and a first electrode disposed on the vibration film. The first electrode includes a first portion and a second portion separated from each other. In addition, the microphone includes a piezoelectric layer disposed on the second portion of the first electrode, a second electrode disposed on the piezoelectric layer, and a fixed electrode. Further, the first portion of the first electrodes is disposed at a substantially center portion of the vibration film and the second portion of the first electrode is disposed at an edge portion of the vibration film.
Abstract translation: 提供麦克风和制造麦克风的方法。 麦克风包括具有穿透孔的基板，设置在基板上的覆盖穿透孔的振动膜以及设置在振动膜上的第一电极。 第一电极包括彼此分离的第一部分和第二部分。 此外，麦克风包括设置在第一电极的第二部分上的压电层，设置在压电层上的第二电极和固定电极。 此外，第一电极的第一部分设置在振动膜的大致中心部分，第一电极的第二部分设置在振动膜的边缘部分。
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公开(公告)号：US20160150326A1
公开(公告)日：2016-05-26
申请号：US14852574
申请日：2015-09-13
Applicant: Hyundai Motor Company
Inventor： Ilseon Yoo , Hyunsoo Kim , Yong Sung Lee
CPC classification number: H04R31/00 , H04R17/02 , H04R19/005 , H04R19/04 , H04R2201/003
Abstract: A microphone and a method of manufacturing the microphone are provided. The method includes; preparing a substrate and forming a vibrating membrane having an oxide film and a plurality of slots onto the substrate. A sacrificial layer and a fixed membrane is formed over the vibrating membrane and air intake apertures are formed through the fixed membrane. A first pad is connected to the fixed membrane, a second pad is connected to the vibrating membrane, and a phase delay unit is bonded to the bonding pad. A penetration aperture may be formed by etching the rear side of the substrate and bonding the phase delay unit on the bonding pad. A sound passage, is formed by connecting passage patterns, and sound apertures with the sound passages by sequentially stacking phase delay layers on the bonding pad and simultaneously forming the passage patterns in the phase delay layers.
Abstract translation: 提供麦克风和制造麦克风的方法。 该方法包括： 制备基板并在基板上形成具有氧化膜和多个狭缝的振动膜。 在振动膜上形成牺牲层和固定膜，并且通过固定膜形成进气口。 第一焊盘连接到固定膜，第二焊盘连接到振动膜，并且相位延迟单元结合到焊盘。 可以通过蚀刻衬底的后侧并将相位延迟单元接合在焊盘上来形成穿透孔。 通过在接合焊盘上顺序堆叠相位延迟层并同时形成相位延迟层中的通道图案，通过连接通道图案和声音孔与声音通道形成声音通道。
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Patent Agency Ranking
公开(公告)号：US20160142828A1
公开(公告)日：2016-05-19
申请号：US14847776
申请日：2015-09-08
Applicant: Hyundai Motor Company
Inventor： Sang-Hyeok Yang , Hyunsoo Kim , Sang Gyu Park , Ilseon Yoo
IPC: H04R17/02
CPC classification number: H04R17/02 , H04R2201/003 , H04R2410/03
Abstract: A microphone, that increases sensitivity without a separate circuit is provided. The microphone includes an audio detection module having a vibration film that outputs capacitance signals by vibrating audio introduced from the exterior and a piezoresistive element that outputs a piezoresistive signal by a sound pressure of the audio. A semiconductor chip includes an amplifier electrically connected to the audio detection module to receive a capacitance signal and a piezoresistive signal from the audio detection module and amplifies the capacitance signal and piezoresistive signal to an electrical signal. The amplifier includes an input terminal that receives an input of the capacitance signal; a first resistor connected to the input terminal and the piezoresistive element; an output terminal that amplifies and outputs the capacitance signal and piezoresistive signal to an electrical signal; and a second resistor connected to the input terminal and the output terminal and connected to the piezoresistive element.
Abstract translation: 提供了一种麦克风，无需单独的电路即可提高灵敏度。 麦克风包括具有振动膜的音频检测模块，该振动膜通过从外部引入的振动音频输出电容信号，以及通过音频的声压输出压阻信号的压阻元件。 半导体芯片包括电连接到音频检测模块的放大器，以从音频检测模块接收电容信号和压阻信号，并将电容信号和压阻信号放大到电信号。 放大器包括接收电容信号的输入的输入端; 连接到输入端子和压阻元件的第一电阻器; 输出端子，其将电容信号和压阻信号放大并输出到电信号; 以及连接到输入端子和输出端子并连接到压阻元件的第二电阻器。
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公开(公告)号：US09807531B2
公开(公告)日：2017-10-31
申请号：US14852574
申请日：2015-09-13
Applicant: Hyundai Motor Company
Inventor： Ilseon Yoo , Hyunsoo Kim , Yong Sung Lee
CPC classification number: H04R31/00 , H04R17/02 , H04R19/005 , H04R19/04 , H04R2201/003
Abstract: A microphone and a method of manufacturing the microphone are provided. The method includes; preparing a substrate and forming a vibrating membrane having an oxide film and a plurality of slots onto the substrate. A sacrificial layer and a fixed membrane is formed over the vibrating membrane and air intake apertures are formed through the fixed membrane. A first pad is connected to the fixed membrane, a second pad is connected to the vibrating membrane, and a phase delay unit is bonded to the bonding pad. A penetration aperture may be formed by etching the rear side of the substrate and bonding the phase delay unit on the bonding pad. A sound passage, is formed by connecting passage patterns, and sound apertures with the sound passages by sequentially stacking phase delay layers on the bonding pad and simultaneously forming the passage patterns in the phase delay layers.
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公开(公告)号：US09693149B2
公开(公告)日：2017-06-27
申请号：US14551014
申请日：2014-11-23
Applicant: Hyundai Motor Company
Inventor： Ilseon Yoo , Hyunsoo Kim
Abstract: A microphone and method for manufacturing the microphone are provided. The microphone includes a substrate with a penetration aperture, a vibration unit disposed on the substrate to cover the penetration aperture, and a fixed electrode disposed over, and spaced from, the vibration unit. Further, the vibration unit includes a first portion and a second portion disposed on the penetration aperture, and a third portion disposed on the substrate. In addition, the first portion and the third portion are spaced from each other, and the second portion is connected between the first portion and the third portion, and includes a first piezoelectric portion and a second piezoelectric portion.
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公开(公告)号：US20170013339A1
公开(公告)日：2017-01-12
申请号：US14937215
申请日：2015-11-10
Applicant: HYUNDAI MOTOR COMPANY
Inventor： Hyunsoo Kim , Ilseon Yoo
CPC classification number: H04R1/04 , H04R19/005 , H04R2201/003 , H04R2499/13
Abstract: A microphone sensor provides, a receiving space disposed on a cover and a control module and positioned with a sound sensing module in the receiving space. The microphone sensor includes a cover having a receiving groove formed at a lower portion and an air inlet that a sound signal flow in through within a control module coupled to the lower portion of the cover. Furthermore, a sound sensing module is coupled to the control module and positioned at the receiving groove.
Abstract translation: 麦克风传感器提供设置在盖上的接收空间和控制模块，并且在接收空间中定位有声音传感模块。 麦克风传感器包括盖，其具有形成在下部的接收凹槽和声音信号在耦合到盖的下部的控制模块内通过的空气入口。 此外，声音传感模块耦合到控制模块并且定位在接收槽处。
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公开(公告)号：US09368373B2
公开(公告)日：2016-06-14
申请号：US14319324
申请日：2014-06-30
Applicant: Hyundai Motor Company
Inventor： Ilseon Yoo , Hiwon Lee , Soon-myung Kwon , Hyunsoo Kim
IPC: H01L21/50 , H01L21/308 , H01L21/306 , H01L21/18
CPC classification number: H01L21/50 , H01L21/185 , H01L21/30604 , H01L21/308
Abstract: A method of joining semiconductor substrates includes: forming an alignment key on a first semiconductor substrate; forming a first protrusion and a second protrusion, and an alignment recess positioned between the first protrusion and the second protrusion on a second semiconductor substrate; forming a first metal layer and a second metal layer on the first protrusion and the second protrusion, respectively; and joining the first semiconductor substrate and the second semiconductor substrate, in which the alignment key is positioned at the alignment recess when the first semiconductor substrate and the second semiconductor substrate are joined.
Abstract translation: 一种接合半导体衬底的方法包括：在第一半导体衬底上形成对准键; 形成第一突起和第二突起，以及位于第二半导体衬底上的第一突起和第二突起之间的对准凹槽; 在所述第一突起和所述第二突起上分别形成第一金属层和第二金属层; 并且当所述第一半导体衬底和所述第二半导体衬底接合时，所述第一半导体衬底和所述第二半导体衬底接合所述对准键位于所述对准凹槽处。
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