公开(公告)号：US20160345440A1

公开(公告)日：2016-11-24

申请号：US14836875

申请日：2015-08-26

Applicant: HZO, Inc.

Inventor： Vimal Kumar Kasagani ,  Colin LaMar Loose ,  Tyler Christensen Child ,  Caleb Edward Kanavel ,  Heidi L. Popeck ,  Samuel R. Anderson ,  Cameron LaMar Loose ,  Xiaowei Shen

IPC: H05K3/28 ,  H05K3/30 ,  H05K3/36 ,  H05K1/14 ,  B05B15/04 ,  H05K13/00 ,  H04N5/225 ,  B05D1/32 ,  B05D5/00 ,  H05K5/02 ,  H05K5/00

CPC classification number: H05K3/284 ,  B05B12/24 ,  B05B12/26 ,  B05D1/32 ,  B05D5/00 ,  H01L21/56 ,  H04N5/2257 ,  H05K1/148 ,  H05K3/0079 ,  H05K3/28 ,  H05K3/285 ,  H05K3/288 ,  H05K3/30 ,  H05K3/36 ,  H05K3/361 ,  H05K5/0017 ,  H05K5/0026 ,  H05K5/0286 ,  H05K13/00 ,  H05K2201/10037 ,  H05K2201/10128 ,  H05K2203/1316 ,  H05K2203/1327 ,  H05K2203/1383

Abstract: Processes for masking electronic devices, including, but not limited to, electronic subassemblies, prior to the application of protective coatings to the electronic devices are disclosed. Such processes include the use of a plurality of different masking techniques in combination to mask the electronic device. Different masking techniques may be used to mask different features and/or components of the electronic device. Some features and/or components may be masked by way of two or more masking techniques. With one or more masks in place, an electronic device may be protectively coated. After a protective coating has been applied to the electronic device, at least a portion of the mask(s) may be removed from the electronic device. Protectively coated electronic devices may then be assembled with one another.

Abstract translation: 公开了在向电子设备施加保护涂层之前掩蔽电子设备的方法，包括但不限于电子组件。 这样的处理包括组合使用多种不同的掩蔽技术来掩蔽电子设备。 可以使用不同的掩蔽技术来掩蔽电子设备的不同特征和/或组件。 一些特征和/或组件可以通过两种或多种掩蔽技术来掩蔽。 使用一个或多个掩模就位，电子设备可以被保护地涂覆。 在对电子设备施加了保护涂层之后，可以从电子设备移除至少一部分掩模。 然后可以将保护性涂覆的电子设备彼此组装。

公开(公告)号：US10098236B2

公开(公告)日：2018-10-09

申请号：US14836875

申请日：2015-08-26

Applicant: HZO, Inc.

Inventor： Vimal Kumar Kasagani ,  Colin LaMar Loose ,  Tyler Christensen Child ,  Caleb Edward Kanavel ,  Heidi L. Popeck ,  Samuel R. Anderson ,  Cameron LaMar Loose ,  Xiaowei Shen

IPC: H05K3/28 ,  H05K1/14 ,  H05K13/00 ,  H05K3/30 ,  H05K3/36 ,  H05K5/00 ,  H05K5/02 ,  B05D1/32 ,  B05D5/00 ,  H01L21/56 ,  H05K3/00 ,  H04N5/225 ,  B05B12/24 ,  B05B12/26

Abstract: Processes for masking electronic devices, including, but not limited to, electronic subassemblies, prior to the application of protective coatings to the electronic devices are disclosed. Such processes include the use of a plurality of different masking techniques in combination to mask the electronic device. Different masking techniques may be used to mask different features and/or components of the electronic device. Some features and/or components may be masked by way of two or more masking techniques. With one or more masks in place, an electronic device may be protectively coated. After a protective coating has been applied to the electronic device, at least a portion of the mask(s) may be removed from the electronic device. Protectively coated electronic devices may then be assembled with one another.