公开(公告)号：US20160345440A1

公开(公告)日：2016-11-24

申请号：US14836875

申请日：2015-08-26

Applicant: HZO, Inc.

Inventor： Vimal Kumar Kasagani ,  Colin LaMar Loose ,  Tyler Christensen Child ,  Caleb Edward Kanavel ,  Heidi L. Popeck ,  Samuel R. Anderson ,  Cameron LaMar Loose ,  Xiaowei Shen

IPC: H05K3/28 ,  H05K3/30 ,  H05K3/36 ,  H05K1/14 ,  B05B15/04 ,  H05K13/00 ,  H04N5/225 ,  B05D1/32 ,  B05D5/00 ,  H05K5/02 ,  H05K5/00

CPC classification number: H05K3/284 ,  B05B12/24 ,  B05B12/26 ,  B05D1/32 ,  B05D5/00 ,  H01L21/56 ,  H04N5/2257 ,  H05K1/148 ,  H05K3/0079 ,  H05K3/28 ,  H05K3/285 ,  H05K3/288 ,  H05K3/30 ,  H05K3/36 ,  H05K3/361 ,  H05K5/0017 ,  H05K5/0026 ,  H05K5/0286 ,  H05K13/00 ,  H05K2201/10037 ,  H05K2201/10128 ,  H05K2203/1316 ,  H05K2203/1327 ,  H05K2203/1383

Abstract: Processes for masking electronic devices, including, but not limited to, electronic subassemblies, prior to the application of protective coatings to the electronic devices are disclosed. Such processes include the use of a plurality of different masking techniques in combination to mask the electronic device. Different masking techniques may be used to mask different features and/or components of the electronic device. Some features and/or components may be masked by way of two or more masking techniques. With one or more masks in place, an electronic device may be protectively coated. After a protective coating has been applied to the electronic device, at least a portion of the mask(s) may be removed from the electronic device. Protectively coated electronic devices may then be assembled with one another.

Abstract translation: 公开了在向电子设备施加保护涂层之前掩蔽电子设备的方法，包括但不限于电子组件。 这样的处理包括组合使用多种不同的掩蔽技术来掩蔽电子设备。 可以使用不同的掩蔽技术来掩蔽电子设备的不同特征和/或组件。 一些特征和/或组件可以通过两种或多种掩蔽技术来掩蔽。 使用一个或多个掩模就位，电子设备可以被保护地涂覆。 在对电子设备施加了保护涂层之后，可以从电子设备移除至少一部分掩模。 然后可以将保护性涂覆的电子设备彼此组装。

公开(公告)号：US20160184964A1

公开(公告)日：2016-06-30

申请号：US14841596

申请日：2015-08-31

Applicant: HZO, Inc.

Inventor： Heidi L. Popeck ,  Caleb Edward Kanavel ,  Samuel R. Anderson ,  Tyler Christensen Child ,  Daniel J. Triplett

IPC: B24C1/00

CPC classification number: B24C1/003 ,  B24C1/04 ,  B24C1/086 ,  H01L21/67069

Abstract: Apparatuses and systems that enable selective removal of protective coatings from substrates are disclosed. Such a material removal system may use pressurized solid carbon dioxide (CO2) (i.e., dry ice) to remove a selected portion of a protective coating from a substrate. The material removal system may include one or more templates that provide selectivity in removing protective coatings from one or more substrates, fixtures for holding one or more substrates in place while material removal processes occur and apparatuses for positioning one or more substrates at desired locations in material removal systems.

Abstract translation: 公开了能够从衬底中选择性地去除保护性涂层的装置和系统。 这种材料去除系统可以使用加压的固体二氧化碳（CO 2）（即干冰）从衬底去除保护涂层的选定部分。 材料去除系统可以包括一个或多个模板，其提供从一个或多个基板去除保护涂层的选择性，用于在发生材料去除过程时将一个或多个基板保持就位的固定装置，以及用于将一个或多个基板定位在材料的期望位置处的装置 清除系统。

公开(公告)号：US10098236B2

公开(公告)日：2018-10-09

申请号：US14836875

申请日：2015-08-26

Applicant: HZO, Inc.

Inventor： Vimal Kumar Kasagani ,  Colin LaMar Loose ,  Tyler Christensen Child ,  Caleb Edward Kanavel ,  Heidi L. Popeck ,  Samuel R. Anderson ,  Cameron LaMar Loose ,  Xiaowei Shen

IPC: H05K3/28 ,  H05K1/14 ,  H05K13/00 ,  H05K3/30 ,  H05K3/36 ,  H05K5/00 ,  H05K5/02 ,  B05D1/32 ,  B05D5/00 ,  H01L21/56 ,  H05K3/00 ,  H04N5/225 ,  B05B12/24 ,  B05B12/26

Abstract: Processes for masking electronic devices, including, but not limited to, electronic subassemblies, prior to the application of protective coatings to the electronic devices are disclosed. Such processes include the use of a plurality of different masking techniques in combination to mask the electronic device. Different masking techniques may be used to mask different features and/or components of the electronic device. Some features and/or components may be masked by way of two or more masking techniques. With one or more masks in place, an electronic device may be protectively coated. After a protective coating has been applied to the electronic device, at least a portion of the mask(s) may be removed from the electronic device. Protectively coated electronic devices may then be assembled with one another.

公开(公告)号：US10293465B2

公开(公告)日：2019-05-21

申请号：US14841596

申请日：2015-08-31

Applicant: HZO, Inc.

Inventor： Heidi L. Popeck ,  Caleb Edward Kanavel ,  Samuel R. Anderson ,  Tyler Christensen Child ,  Daniel J. Triplett

IPC: B24C1/04 ,  B24C1/00 ,  B24C1/08 ,  H01L21/67

Abstract: Apparatuses and systems that enable selective removal of protective coatings from substrates are disclosed. Such a material removal system may use pressurized solid carbon dioxide (CO2) (i.e., dry ice) to remove a selected portion of a protective coating from a substrate. The material removal system may include one or more templates that provide selectivity in removing protective coatings from one or more substrates, fixtures for holding one or more substrates in place while material removal processes occur and apparatuses for positioning one or more substrates at desired locations in material removal systems.