公开(公告)号：US09521750B2

公开(公告)日：2016-12-13

申请号：US14713424

申请日：2015-05-15

Applicant: Hermes-Epitek Corp.

Inventor： Chien-Yao Hung

IPC: H05K1/11 ,  H05K1/02 ,  H05K3/40

CPC classification number: H05K1/115 ,  H05K1/0296 ,  H05K3/4007 ,  H05K2201/09063 ,  H05K2201/09227

Abstract: The present invention relates to a printed circuit board of a probe card. The printed circuit board comprises a first side, a second side, a plurality of plated through holes and at least one electric barrier. The first side includes a plurality of first contacts and a plurality of second contacts respectively corresponding to the first contacts. The second side includes a plurality of third contacts respectively corresponding to the second contacts and a plurality of second-side traces extended to a predefined/specific region. The plated through holes penetrate through the first side and the second side, so that the third contacts are electrically connected to the second contacts. The at least one electric barrier is installed among at least two of the second side traces.

Abstract translation: 本发明涉及一种探针卡的印刷电路板。 印刷电路板包括第一侧，第二侧，多个电镀通孔和至少一个电屏障。 第一侧包括分别对应于第一触点的多个第一触点和多个第二触点。 第二侧包括分别对应于第二触点的多个第三触点和延伸到预定/特定区域的多个第二侧迹线。 电镀通孔穿过第一侧和第二侧，使得第三触头电连接到第二触点。 所述至少一个电屏障安装在所述第二侧迹线中的至少两个中。

公开(公告)号：US09408293B2

公开(公告)日：2016-08-02

申请号：US14717240

申请日：2015-05-20

Applicant: Hermes-Epitek Corp.

Inventor： Chien-Yao Hung

IPC: H05K1/00 ,  G01R31/00 ,  G01R31/20 ,  H05K1/02

CPC classification number: H05K1/02 ,  G01R1/07378 ,  H05K1/142 ,  H05K2203/049

Abstract: The invention relates to a printed circuit board structure, which comprises a first body, a second body and a sleeve. The sleeve is arranged between and connected with the first body and the second body so as to generate a differential height between the first body and the second body. Via the differential height are solved the problems of insufficient probe stiffness and poor wafer-sort quality, which is caused by decreasing the probe diameter to adapt to miniaturized chips.

Abstract translation: 本发明涉及一种印刷电路板结构，其包括第一主体，第二主体和套筒。 所述套筒布置在所述第一主体和所述第二主体之间并与所述第二主体连接，从而在所述第一主体和所述第二主体之间产生差异高度。 通过差分高度解决了探针刚度不足和晶片分选质量差的问题，这是由于减小探头直径以适应小型化芯片而引起的。

公开(公告)号：US10247756B2

公开(公告)日：2019-04-02

申请号：US15195130

申请日：2016-06-28

Applicant: Hermes-Epitek Corp.

Inventor： Chien-Yao Hung

IPC: G01R1/073 ,  G01R31/28 ,  G01R1/067 ,  H05K1/14

Abstract: The invention relates to a probe card structure, which comprises printed circuit board structure with a first through hole, a center stiffener with a second through hole, a first probe head module with a first through hole set and a plurality of first probe pins, and a second probe head module provided with a plurality of second probe pins. The first probe head module and the second probe head module are respectively arranged on a lower surface and an upper surface of the printed circuit board structure, wherein those first probe pins are set on a periphery of an opening of the first through hole set; and a portion of the second probe head module penetrating the first through hole, the second through hole, and the first through hole set. The first and second probe head module integrated together can be utilized for 3D IC testing.

公开(公告)号：US09423423B2

公开(公告)日：2016-08-23

申请号：US14010083

申请日：2013-08-26

Applicant: Hermes-Epitek Corp.

Inventor： Chien-Yao Hung

IPC: G01R1/067 ,  G01R1/073

CPC classification number: G01R1/07378 ,  G01R1/07342 ,  G01R31/2818

Abstract: A probe card for circuit-testing comprising a testing PCB, a probe head, and a silicon interposer substrate is provided. The probe head has a plurality of probes provided with a fine pitch arrangement and held inside. The silicon interposer substrate is used for conveying signals between said probes and said test PCB. The interconnection of said silicon interposer substrate is formed by utilizing the through-silicon via process. A plurality of upper terminals and a plurality of lower terminals are respectively array-arranged on the top surface and the bottom surface of said silicon interposer substrate. The pitch between the upper terminals is larger than the pitch between the lower terminals and the pitch between adjacent lower terminals is equal to the fine pitch of the arrangement of probes.

Abstract translation: 提供了一种用于电路测试的探针卡，包括测试PCB，探针头和硅插入器衬底。 探头具有设置有细间距排列并保持在内部的多个探针。 硅插入器基板用于在所述探针和所述测试PCB之间输送信号。 所述硅插入器基板的互连通过利用硅通孔工艺形成。 多个上端子和多个下端子分别排列在所述硅插入器衬底的顶表面和底表面上。 上端子之间的间距大于下端之间的间距，相邻下端之间的间距等于探针布置的细间距。

公开(公告)号：US09970961B2

公开(公告)日：2018-05-15

申请号：US15215806

申请日：2016-07-21

Applicant: Hermes-Epitek Corp.

Inventor： Chien-Yao Hung

IPC: G01R31/00 ,  G01R1/073 ,  G01R31/28

CPC classification number: G01R1/07378 ,  G01R1/07342 ,  G01R31/2818

Abstract: A probe card for circuit-testing with fine pitch circuit including a testing PCB, a probe head, and a silicon interposer substrate is provided. The probe head has a plurality of probes provided with a fine pitch arrangement and held inside. The silicon interposer substrate is used for conveying signals between said probes and said test PCB. The interconnection of said silicon interposer substrate is fully-filled formed by utilizing the through-silicon via semiconductor fabrication process. A plurality of upper terminals and a plurality of lower terminals are respectively array-arranged on the top surface and the bottom surface of said silicon interposer substrate. The pitch between the upper terminals is larger than the pitch between the lower terminals and the pitch between adjacent lower terminals is equal to the fine pitch of the arrangement of probes.

公开(公告)号：US09279853B2

公开(公告)日：2016-03-08

申请号：US14446628

申请日：2014-07-30

Applicant: HERMES-EPITEK CORP.

Inventor： Chien-Yao Hung ,  Chih-Yao Chen

IPC: G01R1/04 ,  G01R31/28

CPC classification number: G01R31/2887 ,  G01R31/2889

Abstract: A test probe card structure includes a probe card and a connection circuit common plate. The probe card includes a probe substrate, A test circuit board is disposed between the probe substrate and the connection circuit common plate, The test circuit board has a lest circuit connection section attached to and electrically connected with a common circuit adaptation section of the connection circuit common plate. A circuit extension section is formed around the connection circuit common plate, which is all-channel electrically connectable between a tester and the teat circuit connection section. The connection circuit common plate serves to provide an all-channel test circuit convergence connection ability for the test circuit board so as to greatly minify the size of the test circuit board and lower the manufacturing cost of the probe card.

Abstract translation: 测试卡结构包括探针卡和连接电路公共板。 探针卡包括探针基板，测试电路板设置在探针基板和连接电路公共板之间。测试电路板具有连接到连接电路的公共电路适配部分并与其电连接的电路连接部分 普通板。 电路延伸部分形成在连接电路公共板周围，连接电路公共板在测试器和乳头电路连接部分之间是全通道电连接的。 连接电路公共板用于为测试电路板提供全通道测试电路会聚连接能力，大大缩小测试电路板的尺寸，降低探针卡的制造成本。