公开(公告)号：US12112110B2

公开(公告)日：2024-10-08

申请号：US17890354

申请日：2022-08-18

Applicant: Huazhong University of Science and Technology ,  Shenzhen Union Semiconductor Co., LTD

Inventor： Zhiqiang Wang ,  Yayong Yang ,  Yuxin Ge ,  Guoqing Xin ,  Xiaojie Shi

IPC: G06F30/367 ,  G06F30/31 ,  G06F30/398

CPC classification number: G06F30/367 ,  G06F30/31 ,  G06F30/398

Abstract: The present invention belongs to the technical field of simulation of power semiconductor modules, and discloses a multi-physics co-simulation method of a power semiconductor module. The multi-physics co-simulation method of the power semiconductor module comprises: adopting professional circuit simulation software PSpice supporting a spice model to be imported into a device, and by designing a specific collaborative analysis method and performing secondary development of a software data exchange interface, i.e. constructing a coupling interface of co-simulation, performing electricity-heat-force co-simulation of two types of software PSpice and COMSOL by adopting an indirect coupling manner. The simulation time is greatly shortened, and the simulation efficiency is improved.

公开(公告)号：US11976984B1

公开(公告)日：2024-05-07

申请号：US18182339

申请日：2023-03-12

Applicant: Huazhong University of Science and Technology

Inventor： Zhiqiang Wang ,  Yayong Yang ,  Guoqing Xin ,  Xiaojie Shi ,  Yong Kang

IPC: G01K7/22 ,  G01K15/00

CPC classification number: G01K7/22 ,  G01K15/005

Abstract: The present disclosure belongs to the technical field of power electronic converters, and discloses a method and a system for predicting a junction temperature of a power semiconductor module in the full life cycle and a terminal. The method includes the steps: arranging an NTC thermistor network to monitor the temperature of each area inside the power module when the power module works; obtaining data for training the neural network by utilizing finite element simulation or experiments, and building a neural network model among the temperature of the NTC resistor network, a water flow rate, an aging factor and the junction temperature of the chip under working conditions. The present disclosure improves the junction temperature prediction accuracy of areas with relatively large errors comprehensively and realizes the high-precision junction temperature prediction under all working conditions.

公开(公告)号：US12178022B2

公开(公告)日：2024-12-24

申请号：US18190751

申请日：2023-03-27

Applicant: Huazhong University of Science and Technology

Inventor： Zhiqiang Wang ,  Yu Liao ,  Guoqing Xin ,  Xiaojie Shi ,  Yong Kang

IPC: H05K7/20

Abstract: The present disclosure relates to the technical field of heat dissipation for electronic devices, and discloses a manifold microchannel heat sink based on directional optimization of hotspot areas, including a power module, a heat dissipation substrate, a cold source device, and a diverter manifold; the heat dissipation substrate is arranged on the power module, a microchannel is provided on a side of the heat dissipation substrate away from the power module and on a back of a heat generating area of the power module for carrying the power module and dissipating heat from the power module. According to the manifold microchannel heat sink based on the directional optimization of hotspot areas, the local heat dissipation performance of the power module may be preliminarily changed by optimizing the microchannel on the heat dissipation substrate, which avoids poor heat dissipation temperature uniformity in a multi-heat source system.