公开(公告)号：US12178022B2

公开(公告)日：2024-12-24

申请号：US18190751

申请日：2023-03-27

Applicant: Huazhong University of Science and Technology

Inventor： Zhiqiang Wang ,  Yu Liao ,  Guoqing Xin ,  Xiaojie Shi ,  Yong Kang

IPC: H05K7/20

Abstract: The present disclosure relates to the technical field of heat dissipation for electronic devices, and discloses a manifold microchannel heat sink based on directional optimization of hotspot areas, including a power module, a heat dissipation substrate, a cold source device, and a diverter manifold; the heat dissipation substrate is arranged on the power module, a microchannel is provided on a side of the heat dissipation substrate away from the power module and on a back of a heat generating area of the power module for carrying the power module and dissipating heat from the power module. According to the manifold microchannel heat sink based on the directional optimization of hotspot areas, the local heat dissipation performance of the power module may be preliminarily changed by optimizing the microchannel on the heat dissipation substrate, which avoids poor heat dissipation temperature uniformity in a multi-heat source system.