公开(公告)号：US20090255723A1

公开(公告)日：2009-10-15

申请号：US12103191

申请日：2008-04-15

Applicant: Hui-Lung LAI

Inventor： Hui-Lung LAI

IPC: H05K1/00

CPC classification number: H05K1/0219 ,  G06F3/044 ,  H05K1/0224 ,  H05K1/0253 ,  H05K2201/09263 ,  H05K2201/09336 ,  H05K2201/097

Abstract: A printed circuit board with ground grid includes a first insulating plate, a plurality of first metal lines formed on the first insulating plate, a sub-circuit board above the plurality of first metal lines, a second insulating plate above the sub-circuit board, a plurality of second metal lines formed on the second insulating plate, and, a plurality of conductive components formed in and through the second insulating plate and the sub-circuit board to electrically connect the plurality of first metal lines and the plurality of second metal lines. As additional electronic elements and circuits can be located on the first insulating plate and/or on the second insulating plate without limitation, difficulties for printed circuit board layout can be dramatically reduced.

Abstract translation: 具有接地栅格的印刷电路板包括第一绝缘板，形成在第一绝缘板上的多个第一金属线，多个第一金属线上方的副电路板，副电路板上方的第二绝缘板， 形成在所述第二绝缘板上的多个第二金属线，以及形成在所述第二绝缘板中的多个导电部件和所述副电路基板，以将所述多个第一金属线和所述多个第二金属线 。 由于附加的电子元件和电路可以无限制地位于第一绝缘板和/或第二绝缘板上，所以印刷电路板布局的困难可以大大降低。