公开(公告)号：US20160105960A1

公开(公告)日：2016-04-14

申请号：US14880299

申请日：2015-10-12

Applicant: IBIDEN CO., LTD.

Inventor： Hajime SAKAMOTO ,  Yoshinori SHIZUNO ,  Shigeru YAMADA ,  Takashi KARIYA

IPC: H05K1/11 ,  H05K3/46 ,  H05K3/00 ,  H05K1/02 ,  H05K3/10

CPC classification number: H01L23/5383 ,  H01L21/486 ,  H01L2224/16227 ,  H01L2224/1703 ,  H01L2924/15192 ,  H01L2924/15313 ,  H05K3/007 ,  H05K3/025 ,  H05K3/4644 ,  H05K3/4658 ,  H05K3/4694 ,  H05K2201/10159 ,  H05K2201/10378 ,  H05K2201/1053

Abstract: A multilayer wiring board includes a main wiring board including insulation layers, first via conductors formed in the insulation layers, and a first conductive layer including first mounting pads such that the first mounting pads are positioned to mount a first electronic component and a second electronic component adjacent to each other on the main wiring board, and a wiring structure body mounted on the main wiring board such that the wiring structure body is positioned in an outermost insulation layer of the insulation layers, the wiring structure body including a second conductive layer which includes second mounting pads such that the second mounting pads are positioned to connect to the first electronic component and the second electronic component mounted on the main wiring board. The first via conductors are formed such that the first via conductors have diameters which increase in a same direction.

Abstract translation: 多层布线基板包括：主布线板，包括绝缘层，形成在绝缘层中的第一通孔导体;以及第一导电层，包括第一安装焊盘，使得第一安装焊盘定位成安装第一电子部件和第二电子部件 以及配线结构体，其安装在主配线板上，使得布线结构体位于绝缘层的最外绝缘层中，所述布线结构体包括第二导电层，所述第二导电层包括： 第二安装焊盘，使得第二安装焊盘被定位成连接到安装在主布线板上的第一电子部件和第二电子部件。 第一通孔导体形成为使得第一通孔导体具有沿相同方向增加的直径。

公开(公告)号：US20140231990A1

公开(公告)日：2014-08-21

申请号：US14265887

申请日：2014-04-30

Applicant: IBIDEN CO., LTD.

Inventor： Shinji OUCHI ,  Shigeru YAMADA ,  Makoto TERUI ,  Yoshinori SHIZUNO

IPC: H01L23/498 ,  H01L21/768

CPC classification number: H01L23/49811 ,  H01L21/76885 ,  H01L23/3192 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/02377 ,  H01L2224/0346 ,  H01L2224/03831 ,  H01L2224/0401 ,  H01L2224/0501 ,  H01L2224/05016 ,  H01L2224/05022 ,  H01L2224/05024 ,  H01L2224/05147 ,  H01L2224/05555 ,  H01L2224/05556 ,  H01L2224/05568 ,  H01L2224/05647 ,  H01L2224/13 ,  H01L2224/131 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/351 ,  Y10T29/49165 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor device includes a semiconductor chip and a wiring board formed on the semiconductor chip. The wiring board includes a first insulation layer, first conductive patterns on the first layer, first via conductors formed in the first layer and connecting the first patterns and electrode pads of the chip, respectively, a second insulation layer on the first layer, second conductive patterns on the second layer, and second via conductors formed in the second layer and connecting the first conductive patterns and the second patterns, respectively, each second via conductors has a side surface extending through the second layer such that the side surface has a bent portion which changes inclination of the side surface in depth direction of each second via conductor, and the second patterns are positioned to fan in or out with respect to the electrode pads.

Abstract translation: 半导体器件包括形成在半导体芯片上的半导体芯片和布线板。 布线基板包括第一绝缘层，第一层上的第一导电图案，形成在第一层中的第一通孔导体，分别连接芯片的第一图案和电极焊盘，第一绝缘层，第二导电层 第二层上的图案和形成在第二层中并分别连接第一导电图案和第二图案的第二通孔导体分别具有每个第二通孔导体，具有延伸穿过第二层的侧表面，使得侧表面具有弯曲部分 其改变每个第二通孔导体在深度方向上的侧表面的倾斜度，并且第二图案被定位成相对于电极焊盘进入或者退出。

公开(公告)号：US20160268188A1

公开(公告)日：2016-09-15

申请号：US15055921

申请日：2016-02-29

Applicant: IBIDEN CO., LTD.

Inventor： Takashi KARIYA ,  Shigeru YAMADA ,  Masatoshi KUNIEDA

IPC: H01L23/498 ,  H01L23/31

CPC classification number: H01L23/3121 ,  H01L23/49811 ,  H01L23/5389 ,  H01L2224/16225 ,  H01L2924/181 ,  H01L2924/00012

Abstract: A printed wiring board for package-on-package includes a first insulating layer, a wiring layer including a conductor pattern and formed on first surface of the first insulating layer, a second insulating layer formed on first surface side of the first insulating layer, electrodes formed in through holes of the first insulating layer respectively such that the electrodes electrically connect to the conductor pattern and have exposed surfaces exposed from second surface of the first insulating layer, first pads formed on the second insulating layer and positioned to connect an IC chip in center portion of the second insulating layer, second pads formed on the second insulating layer and positioned in outer edge portion of the second insulating layer to connect a second printed wiring board, and via conductors formed in the second insulating layer such that the via conductors electrically connect the first and second pads to the conductor pattern.

Abstract translation: 一种用于封装封装的印刷线路板包括：第一绝缘层，包括导体图案的布线层，并形成在第一绝缘层的第一表面上;第二绝缘层，形成在第一绝缘层的第一表面侧;电极 分别形成在第一绝缘层的通孔中，使得电极电连接到导体图案，并且具有从第一绝缘层的第二表面露出的暴露表面，形成在第二绝缘层上的第一焊盘并且定位成将IC芯片 所述第二绝缘层的中心部分，形成在所述第二绝缘层上并位于所述第二绝缘层的外边缘部分中以连接第二印刷线路板的第二焊盘，以及形成在所述第二绝缘层中的通孔导体， 将第一和第二焊盘连接到导体图案。

公开(公告)号：US20150245485A1

公开(公告)日：2015-08-27

申请号：US14628477

申请日：2015-02-23

Applicant: IBIDEN CO., LTD.

Inventor： Nobuya TAKAHASHI ,  Shigeru YAMADA ,  Takashi KARIYA

IPC: H05K1/11 ,  H05K3/18 ,  H05K3/30

CPC classification number: H05K1/113 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5385 ,  H01L23/5386 ,  H01L2224/16225 ,  H01L2924/15311 ,  H05K3/4694 ,  H05K2201/094 ,  H05K2201/09972 ,  H05K2201/10522 ,  H05K2201/10674 ,  Y10T29/49144

Abstract: A printed wiring board includes a first insulating layer, a first conductor layer formed on a surface of the first insulating layer and including first pads, and a wiring structure including a second conductor layer formed on the first insulating layer, a second insulating layer laminated on the second conductor layer, a third conductor layer formed on the second insulating layer, and formed through the second insulating layer. The second conductor layer includes second pads formed on the first insulating layer, the third conductor layer includes third pads formed on the second insulating layer, the via conductors are positioned such that the via conductors are connecting the second pads and the third conductor layer, and the wiring structure is formed such that the second conductor layer and third conductor layer are not electrically connected to the first conductor layer.

Abstract translation: 印刷布线板包括第一绝缘层，形成在第一绝缘层的表面上并包括第一焊盘的第一导体层，以及包括形成在第一绝缘层上的第二导体层的布线结构，层叠在第一绝缘层上的第二绝缘层 第二导体层，形成在第二绝缘层上的第三导体层，并通过第二绝缘层形成。 所述第二导体层包括形成在所述第一绝缘层上的第二焊盘，所述第三导体层包括形成在所述第二绝缘层上的第三焊盘，所述通孔导体定位成使得所述通孔导体连接所述第二焊盘和所述第三导体层，以及 布线结构形成为使得第二导体层和第三导体层不与第一导体层电连接。