公开(公告)号：US10111335B2

公开(公告)日：2018-10-23

申请号：US15670185

申请日：2017-08-07

Applicant: IBIDEN CO., LTD.

Inventor： Toru Furuta ,  Masashi Awazu

IPC: H05K1/16 ,  H05K1/18 ,  H05K3/46 ,  H01L23/00

Abstract: A printed wiring board includes a central resin insulating layer, an electronic component embedded in the central resin insulating layer, a first resin insulating layer formed on a first surface side of the central resin insulating layer, and a second resin insulating layer formed on a second surface side of the central resin insulating layer on the opposite side with respect to the first surface side. The central resin insulating layer does not contain a core material, and one of the first resin insulating layer and the second resin insulating layer includes a core material and the other one of the first resin insulating layer and the second resin insulating layer does not contain a core material.

公开(公告)号：US10095330B2

公开(公告)日：2018-10-09

申请号：US15082407

申请日：2016-03-28

Applicant: IBIDEN CO., LTD.

Inventor： Toru Furuta ,  Osamu Futonagane

IPC: G06K9/28 ,  G06F3/041 ,  H05K1/16 ,  H05K3/46 ,  H05K1/02

Abstract: A printed wiring board includes a first insulating layer, a first conductor circuit including fingerprint authentication circuitry and embedded in the first insulating layer such that the first circuit has exposed surface exposed from surface of the first insulating layer, a second insulating layer on which the first insulating layer is formed, a second conductor circuit including fingerprint authentication circuitry and embedded in the second insulating layer such that the second circuit has exposed surface exposed from surface of the second insulating layer and is interposed between the first and second insulating layers, and a solder resist layer formed on the surface of the first insulating layer and covering the first circuit. The first and second circuits are positioned such that the first and second circuits are opposing each other across the first insulating layer and that a finger for fingerprint authentication is placed on the solder resist layer.

公开(公告)号：US09713267B2

公开(公告)日：2017-07-18

申请号：US14674301

申请日：2015-03-31

Applicant: IBIDEN CO., LTD.

Inventor： Toru Furuta ,  Takeshi Furusawa ,  Tomoya Terakura

IPC: H05K1/11 ,  H05K3/40 ,  H05K1/02 ,  H05K3/00 ,  H05K3/28 ,  H05K3/34

CPC classification number: H05K3/4007 ,  H05K1/0271 ,  H05K1/111 ,  H05K3/0097 ,  H05K3/282 ,  H05K3/3436 ,  H05K2201/0355 ,  H05K2201/0376 ,  H05K2201/09745 ,  H05K2201/09772 ,  H05K2203/0369 ,  H05K2203/1536 ,  Y02P70/611 ,  Y10T29/49165

Abstract: A method for manufacturing a printed wiring board with conductive posts includes forming on a first foil provided on carrier a first conductive layer including mounting pattern to connect electronic component via conductive posts, forming on the first foil a laminate including an insulating layer and a second foil to form the laminate on the first conductive layer, removing the carrier, forming a metal film on the laminate and first film, forming resist on the metal film to have pattern exposing portion of the metal film corresponding to the mounting pattern and portion of the second foil for a second conductive layer, forming an electroplating layer on the portion of the metal film not covered by the resist, removing the resist, and applying etching to remove the first and second foils below the metal film exposed by the removing the resist and to form the posts on the mounting pattern.