公开(公告)号：US20150077963A1

公开(公告)日：2015-03-19

申请号：US14491069

申请日：2014-09-19

Applicant: IBIDEN CO., LTD.

Inventor： Takema ADACHI ,  Yuzo KAIDA

IPC: H05K1/14 ,  H05K3/42 ,  H05K3/36 ,  H05K3/10 ,  H05K1/11 ,  H05K3/00

CPC classification number: H05K1/144 ,  H01L2224/16225 ,  H01L2924/15311 ,  H05K3/368 ,  H05K3/4015 ,  H05K2201/042 ,  H05K2201/10242 ,  Y10T29/49126 ,  Y10T29/49156

Abstract: A printed wiring board includes a wiring board, and multiple posts formed on the wiring board and positioned to mount a second printed wiring board onto the wiring board. Each of the metal posts has a first surface connected to the wiring board, a second surface formed to connect the second printed wiring board, and a side surface between the first surface and the second surface, and the side surface of each of the metal posts forms a curved surface.

Abstract translation: 印刷电路板包括布线板和形成在布线板上并定位成将第二印刷布线板安装到布线板上的多个柱。 每个金属柱具有连接到布线板的第一表面，形成为连接第二印刷线路板的第二表面和第一表面和第二表面之间的侧表面以及每个金属柱的侧表面 形成曲面。