公开(公告)号：US20180093241A1

公开(公告)日：2018-04-05

申请号：US15820548

申请日：2017-11-22

Applicant: IHI CORPORATION

Inventor： Shigeki SAKAKURA ,  Nobuyuki HONMA ,  Takashi NISHII ,  Tomohiro KANEKO ,  Rie HARADA ,  Kunitaka MASAKI ,  Hiroyuki KAMATA ,  Koki HAMADA ,  Akihisa YANO ,  Tatsuya OKA ,  Yusuke TAKEUCHI

IPC: B01J12/00 ,  B01J19/24 ,  C01B3/38 ,  C01B3/48 ,  C07C1/04 ,  F28D9/00 ,  F28F3/08

CPC classification number: B01J12/007 ,  B01J19/24 ,  B01J19/2445 ,  B01J19/245 ,  B01J19/249 ,  B01J2219/2465 ,  C01B3/38 ,  C01B3/384 ,  C01B3/48 ,  C01B2203/0233 ,  C01B2203/0238 ,  C01B2203/0283 ,  C01B2203/0833 ,  C01B2203/0883 ,  C01B2203/1241 ,  C07C1/041 ,  F28D9/00 ,  F28D9/0093 ,  F28F3/00 ,  F28F3/08

Abstract: An end surface of each first side wall, an end surface of each first middle wall, and an end surface of each first end wall are joined to an adjacent second structure by diffusion bonding, an end surface of each second side wall, an end surface of each second middle wall, and an end surface of each second end wall are joined to an adjacent first structure or a lid structure by diffusion bonding, a thickness of each first side wall is greater than or equal to a thickness of each first middle wall, and a thickness of each second side wall is greater than or equal to a thickness of each second middle wall.